JPS61166823A - Resin composition for sealing - Google Patents

Abstract

PURPOSE:To provide the titled composition having high adhesivity and excellent moisture resistance and giving small stress to semiconductor element pellet, by adding an alkaline earth metal oxide and an organopolysiloxane having a specific group to an epoxy resin composition. CONSTITUTION:The objective composition is composed essentially of (A) an epoxy resin (a compound having >=2 epoxy groups in a molecule), (B) a novolac- type phenolic resin, (C) an alkaline earth metal oxide (preferably CaO, CaO2, BaO or BaO2 having a particle diameter of 0.01-3mu), (D) an organopolysiloxane having epoxy group, amino group, carboxyl group, OH group and/or cyano group in the molecule [e.g. the compound of formula I or II (R<3> is alkyl or phenyl; X is group of formula III, etc.), etc.], and (E) 30-90wt% inorganic filler (preferably silica or alumina).

Description

Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a resin composition for encapsulating semiconductors, etc., which is characterized by good adhesion, moisture resistance, and low stress applied to semiconductor element pellets. I! l Tsuru.

[Technical background of the invention and its problems] In recent years, in the field of semiconductor integrated circuits, with the increase in integration and reliability, progress has been made in increasing the size of semiconductor element pellets and developing high-density packaging technology. . Therefore, there is a strong demand for resin materials for semiconductor encapsulation to have a property that the stress applied to the element pellet is small even when directly molded.

As a resin for semiconductor encapsulation, a molding resin whose main components are epoxy resin, novolac type phenol 64m, and inorganic filler, and also contains a curing accelerator, coloring agent, and mold release agent has superior moisture resistance and moldability. Therefore, it has become the mainstream sealing resin.

However, with this type of sealing resin, the semiconductor element 74 [
--If you hit the passivation film (') element pellet with cracks due to the stress of the resin, i'8
There is a drawback that causes ft deterioration (lb (variation τ, etc.) 1tl with low stress
It is necessary to develop llt (low stress 4!1 fat). Seal [
Possible methods for reducing stress in the L resin include making J Poyashi resin and phenol resin more flexible, and adding LT plasticizer. However, in the case of epoxy resin compositions using T-Nol resin as a curing agent, the glass transition point of the cured resin decreases,
There are reliability problems due to the deterioration of high-temperature electrical characteristics.
There are also products that reduce the stress applied to the element by adding synthetic rubber 1 to reduce the occurrence of cracks in the passivation film and cracks in the element. The adhesion of the composition to the semiconductor element and lead frame decreases, and the resistance to 7L decreases.
I11 has the disadvantage that the bamboo deteriorates and is less reliable.
-0 [Objective of the Invention 1 The present invention has been made in view of the above-mentioned drawbacks, and its object is to provide good adhesion and high durability. It is an object of the present invention to provide a resin composition for sealing 11 which can be immersed in bamboo 51 and has less stress applied to semiconductor element bellet 1-.

[Summary of the Invention 1] As a result of intensive research to achieve the above object, the present inventor has found that (1) an alkaline earth metal oxide, especially 2) an epoxy group, an Amim L carboxyl group, a hydroxyl group, Although the addition of organoborisilokinane having one or more groups selected from cyano groups has a great effect of reducing stress, the V! ! It has been found that it has excellent W properties and is suitable for a resin composition for a 1L seal that achieves the above objectives.

That is, the present invention provides: (A) an epoxy resin, (B) a novolac type phenolic resin, (C) an alkaline earth metal oxide, (1) a molecule containing a "boxylated" amino group, a carboxyl group, a hydroxyl group, and a cyanide group. 1 selected from the group
Organoborisiloxane 5 and (F) inorganic τ1 filler having a species or 2 or more groups of F are essential components, and the above (F>1
A seal that is designed to contain 30 to 90 t'Q A% of 11ffi optical journal material! This is a resin composition for L.

As long as the (Δ)1 boxy resin used in the present invention is a compound having at least two epoxy resins in its molecule,
- There are no particular restrictions on the molecular structure, molecular cloth, etc., and a wide range of commonly used ones can be included. For example, aromatic compounds such as bisphenols, alicyclic systems such as derivatives of cyclohexane, and alicyclic systems such as derivatives of bisphenols, and 1. Examples include dinovolak-based resins.

(In the formula, R1 represents a hydrogen atom, a halogen atom, or an alkyl group, R2 represents a hydrogen atom or an alkyl group, and n represents an integer of 1 or more.) These epoxy resins may be used alone or in combination of two or more. I can do it.

The (R3) novolak-type 71-nol resin used in the present invention includes novolak-type phenol resins which can be obtained by reacting formaldehyde or paraformal γ-human with phenols such as phenols and alkyl phenols, and modified resins thereof; Examples include epoxidized or butylated novolac type phenolic resins.

The formulation of novolac type phenolic resin (1) is as described above (△
) Epoxy group (a) of epoxy resin and ([3) phenolic external water 1'lQ grass (b
) It is desirable that the E ratio (a, b) be in the range of 0.1 to 10. When the molar ratio is less than 0.1 or more than 10, moisture resistance, molding workability, J5, and hardening are achieved. limited within the above range.

(C) Alkaline earth metal oxide used in the present invention'((
Examples include oxides of beryllium, magnesium, calcium, sulfonium, and barium.

(l (treewise r; a O, Ca O,, F3a O,
Ba 02, MqO1~'I[+(tsu,, Be Ol[
In 3e02, etc., calcium, magnesium, and barium-based oxides are preferable. The shape of the oxide is particularly limited to 0.01
~3f1m (preferably unpaid. This combination... is 0.
05-3000% is preferable; if it is less than 1.0.05ton Φ%, 10/1 adhesion will not be achieved, and if it exceeds 3ffT%, workability will decrease when constructing a tan flit cap product. ,
Flow DJ performance is poor, K is not good, L is not good, Contains metal oxides on alkali (〈) (5, 1 (Hydrophilicity 15 increases, and these improve the adhesion with metals) It is assumed that.

(D) used in the present invention, an epoxy group, an amine group,
Organopolysiloxane having one or more groups selected from carboxyl groups [1 Kirin and C is the molecular structure, molecular weight, viscosity, etc., as long as the basic skeleton structure is dimethylpolysiloxane etc. There are no particular restrictions. For example, organopolysiloxanes represented by the following general formula can be mentioned.

+R'-)-N+1,, +R'+OH.
Indicates one or more functional groups selected from +R'+CN +. R3 is an alkyl group or a phenyl group, R AtL+ OI
+, ±, k is an integer of 0 or 1 or more, x, y is an integer of 1 or more. , which has the effect of further reducing stress.

As the inorganic filler (E) used in the present invention, Si II/
J powder, 1 Luminor, antimony trioxide, talc, Y
R19 /J Luciu 11, titanium white, clay, asbeth 1, mica, red iron, glass fiber, carbon $1
1ff, etc., and silica powder or alumino are particularly preferred. The blending ratio of the terophore filler is 3% of the resin composition.
It is necessary to contain 0 to 90%. If the weight is less than 30%, it is effective for moisture resistance and stress reduction. No, 90
It is unsuitable for practical use because it has a large bulk that exceeds the weight percentage, and the coloring property is poor.

The sealing resin composition of the present invention includes (A>epoxy resin, (
[3] Novolac type phenolic resin, (C) Cal 1 metal oxide, ([)) epoxy group in the molecule, one or two selected from No2MinoHari, Carboxyl Cyano Grass Uri (E) An inorganic filler is an essential component, but if necessary, for example, natural waxes, synthetic waxes, metal salts of straight chain fatty acids, etc. may be added. Fil
Mold release agents such as l amides, esters, paraffins, chlorinated paraffins, flame retardants such as bromo-1-luene, hexabromobenzene, antimony trioxide, colorants such as carbon black and red iron, silane coupling agents, gods A curing accelerator and the like may be appropriately added and blended.

A general method for preparing the sealing resin composition of the present invention as a molding material is to mix epoxy resin, novolac type phenol resin, synthetic rubber or its derivatives, organopolysiloxane, inorganic filler, etc. After sufficiently uniformly mixing the mixture using a roller or the like, the mixture is further melted and mixed using a heated roll or mixed using a kneader, etc., and then cooled and solidified and ground to an appropriate size to obtain a molding material.

can be done. If this molding material is applied to seal, cover, insulate, etc. electronic or electrical components, excellent characteristics and reliability can be imparted.

[Effect of the invention 1 The resin composition for use in the month 11 of the present invention has good adhesion and moisture resistance.
One-for-one, the stress applied to the semiconductor pellet is small! In addition, when used for sealing large pellets associated with convex integration or device pellets with high-density packaging, reliability can be significantly improved.

[Example J of the Invention The present invention will be explained in detail with reference to Examples, but the present invention is not limited to the following Examples.

In the following Examples and Comparative Examples, "%" means 1% by weight.

Example 1 Cresol novolak epoxy resin (epoxy equivalent weight 21
5) 18%, novolak type phenolic resin () fit per 1 mol 107) 10%, calcium oxide 1%,
1% dimethylpolysiloquiline with carbo-1 yl group
, 69% of silica powder, and 1% of n-class fatty acid ester were mixed at room temperature, kneaded at 90 to 95°C, cooled and crushed, and a molding material was obtained. The obtained molding material is tabreso l-
The molded product was preheated and poured into a mold heated to 170°C by transfer molding to avoid curing. This molded article was subjected to fjlM characteristics, glass transition point, moisture resistance test, and wet/cold Nicle test, which are shown in Table 1.

Implementation W42 Cresol novolak epoxy resin (epoxy 1 fine 21
5) 17.5%, novolac type phenolic resin (phenol equivalent: 107) 10%, magnesium oxide 0.5
%, hydroxyl group-containing dimethylpolysiloxane 1%,
Example 1: 69% silica powder, 1% high-grade fat weight-resistant stellium
A molding material was obtained by mixing and kneading in the same manner as above. Next, a molded article was obtained using the same molding material, and the molded article was tested for the same characteristics, which are shown in Table 1.

Comparative Example 1 Cresol novolac epoxy resin (121% per epoxy
5) A molding material was prepared by mixing and kneading 18%, novolac type phenol resin (phenol equivalent fi +07), 1% calcium oxide, 70% silica powder, and 1% higher fatty acid ester in the same manner as in Example 1. .

Next, a molded article was made, and various properties of this molded article were tested and are shown in Table 1.

Comparative Example 2 Cresol novolak epoxy resin (epoxy equivalent: 21
5) 18%, novolac type phenolic resin (phenol ffi 107) 10%, hydroxyl foundation 1
Dimer 1 Rubori Shiro-1 Phosphorus 1%, Silica Powder 10%,
A molding material and a molded article were obtained using 1% sprue of higher fatty acids in the same manner as in Example 1, and then various properties were tested and are shown in Table 1.

Table 1 *1: Using the sealing resin composition, an electric component having two aluminum wirings was transfer-molded at 170°C for 3 minutes, and then cured at 180°C with an opening at 8 o'clock. Thus, 100 electrical components were subjected to a moisture resistance test by applying a voltage of 15 V in high-pressure steam at 120° C., and the time required for 50% disconnection (defect occurrence) due to aluminum corrosion was evaluated.

*2; The number of cracks is the It' of a molded product of 30 x 25 x 5 nha (a copper plate of 25 x 25 x 3 ms is embedded in the surface, placed in a constant temperature bath of -40℃ and 200℃ for 30 minutes each, 10 recycles < 1.) Returned (spring's (0 (so-called greasy crack) -1-t, !,:.

Claims (1)

[Scope of Claims] 1 (A) Epoxy resin, (B) Novolak phenol resin, (C) Alkaline earth metal oxide, (D) Epoxy group, amino group, carboxyl group, hydroxyl group, and cyano group in the molecule An organopolysiloxane having one or more groups selected from the following and (E) an inorganic filler are essential components, and the amount of the (E) inorganic filler is 30 to 90% by weight based on the resin composition. % of the sealing resin composition. 2. Claim 1, wherein the molar ratio (a/b) between the epoxy group (a) of the epoxy resin and the phenolic hydroxyl group (b) of the novolac type phenol resin is within the range of 0.1 to 10. A resin composition for sealing.