JPH07501093A - Curable sealing compound - Google Patents
Curable sealing compoundInfo
- Publication number
- JPH07501093A JPH07501093A JP5508863A JP50886393A JPH07501093A JP H07501093 A JPH07501093 A JP H07501093A JP 5508863 A JP5508863 A JP 5508863A JP 50886393 A JP50886393 A JP 50886393A JP H07501093 A JPH07501093 A JP H07501093A
- Authority
- JP
- Japan
- Prior art keywords
- sealing compound
- epoxy
- weight
- resins
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Abstract
(57)【要約】本公報は電子出願前の出願データであるため要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 硬化性封止用コンパウンド 従来の技術 継目もしくは空隙の充填のための封止用コンパウンドは、公知技術水準では広く 普及している。多くの使用の際に封止用コンパウンドは、封止後に比較的高い温 度にさらされる０例えば、コイルとケーシングの間に存在する空間が良好に熱を 伝導する封止用コンパウンドで充填される、水冷ジェネレータの場合がその例で ある。発生した熱は、この方法で迅速に周囲の冷却液に排出され、かつ過熱は回 避される。また１点火コイル、ダイオード及び、薄膜混成集積回路（Ｓｃｈｉｃ ｈｔｈｙｂｒｉｄｅ）を含む半導体のためにも相応する性質プロフィールを存す る封止用コンパウンドは必要である。[Detailed description of the invention] Curable sealing compound Conventional technology Sealing compounds for filling seams or voids are widely available in the state of the art. It is widespread. In many applications, the encapsulating compound is exposed to relatively high temperatures after encapsulation. For example, the space between the coil and the casing is well exposed to heat. An example is a water-cooled generator that is filled with a conductive sealing compound. be. In this way, the heat generated is quickly dissipated into the surrounding coolant, and overheating is avoided. avoided. There is also one ignition coil, diode and thin film hybrid integrated circuit (Schic). A corresponding property profile also exists for semiconductors containing A sealing compound is required.
この種の使用には、実際、注入後に化学反応によって硬化する封止用コンパウン ドのみが適当である。このために公知の反応樹脂、例えばフェノール−ホルムア ルデヒド樹脂、不飽和ポリエステル樹脂、エポキシ樹脂、シリコーン樹脂もしく はポリウレタンが使用され、これらの樹脂は、物理的かつ経済的な理由から通常 、充填剤を含有している。強く特許の保護が請求されうる封止用コンパウンドは 、次の一連の性質を満足させなければならない −良好な流動性、即ち、 加工の際の十分に低い粘性 −十分な開放時間（ｏｆｆｅｎｅ Ｚｅｉｔ）、即ち、良好な貯蔵安定性 −短い時間での十分な硬化 −硬化の際の僅かな収縮及び僅かな亀裂形成性−高い熱伝導性 −高い熱負荷能力 − 低い熱膨張係数。This type of use actually requires a sealing compound that hardens by a chemical reaction after injection. Only C is appropriate. For this purpose, known reactive resins, such as phenol-formamic resins, are used. aldehyde resin, unsaturated polyester resin, epoxy resin, silicone resin or polyurethane is used; these resins are usually used for physical and economic reasons. , contains fillers. Sealing compounds for which strong patent protection can be claimed are , must satisfy the following set of properties - good flowability, i.e. Sufficiently low viscosity during processing - sufficient opening time, i.e. good storage stability; - Sufficient curing in a short time - Low shrinkage and low cracking during curing - High thermal conductivity -High heat load capacity − Low coefficient of thermal expansion.
これまで公知の封止用コンパウンドは、それぞれの場合に上記パラメータの１個 もしくはそれ以上に関して欠点を有しており、即ち、全体として満足のできる性 質を示していない。Hitherto known sealing compounds have in each case one of the above parameters. or more defects, i.e., overall satisfactory performance. Doesn't show quality.
本発明の利点 本発明による封止用コンパウンドは、公知技術水準における欠点を回避する。該 封止用コンパウンドは、約６０〜８０℃の常用の加工温度で高い程度に流動可能 であり、ひいては、複雑な形状および到達困難である領域を有した空隙を充填す る。該封止用コンパウンドは、数か月にわたって、例えば１２が月まで実質的な 品質損失なしに貯蔵することができる。硬化時間は、合理的な製造に対する要求 に相応している。硬化された封止用コンパウンドは、発生した熱を十分に迅速に かつ確実に導出し、その結果、安定した定常的な１度状態が生じる。該封止用コ ンパウンドの熱膨張係数は僅かであり、その結果、通常に設計された器具、機械 もしくは装置にとって許容困難である圧が生じない。Advantages of the invention The sealing compound according to the invention avoids the disadvantages of the prior art. Applicable The sealing compound is highly flowable at common processing temperatures of approximately 60-80°C. and, by extension, to fill voids with complex shapes and areas that are difficult to reach. Ru. The sealing compound is applied over a period of several months, e.g. up to 12 months. Can be stored without quality loss. Curing time is subject to reasonable manufacturing requirements It corresponds to The cured encapsulant compound dissipates the generated heat quickly enough. and is reliably derived, resulting in a stable and steady one-degree state. The sealing The coefficient of thermal expansion of the compound is small, and as a result, it is difficult to Or pressures that are difficult for the device to tolerate do not occur.
硬化された封止用コンパウンドは、例えば２００℃及びそれ以上の温度での持続 する高い熱負荷に耐え、かつ急激な冷却の際の顕著に減少された亀裂形成傾向を 示す、高い熱安定性と亀裂形成に対する十分な抵抗性との結合を新規の封止用コ ンパウンドは特に示している。The cured encapsulating compound can last for example at temperatures of 200°C and above. withstand high thermal loads and have a markedly reduced tendency to crack formation upon rapid cooling. The novel encapsulation coating combines high thermal stability with sufficient resistance to crack formation. The pound is especially shown.
本発明の説明 特許請求項に記載の封止用コンパウンドは、記載された有利な性質プロフィール を有している。封止用コンパウンドに添加されていてもよい成分（１）として有 利に、ビスフェノールＡ（２，２−ビス−（４′−ヒドロキシフェニル）−プロ パン）のエポキシ樹脂、ビスフェノールＦ（ビス−（４−ヒドロキシフェニル） −メタン）のエポキシ樹脂又は脂環式エポキシ樹脂、例えば式 で示される脂環”式エポキシ樹脂は使用される。Description of the invention The encapsulating compound according to the patent claims has the advantageous property profile described. have. Component (1) that may be added to the sealing compound In particular, bisphenol A (2,2-bis-(4'-hydroxyphenyl)-propylene) Bread) epoxy resin, bisphenol F (bis-(4-hydroxyphenyl) - methane) or cycloaliphatic epoxy resins, e.g. A cycloaliphatic epoxy resin represented by is used.
これらのエポキシ樹脂のエポキシ当量は、有利に１００〜２５０である。上記種 類の種々の樹脂の混合物を使用することも当然のことながら可能である。樹脂の グラム分子量は通常、〉２５０であり、該グラム分子量は有利に２７５〜１５０ ０である。樹脂が硬化の際に十分に高いグラム分子量を有する生成物を生じるた めに、樹脂のエポキシ官能価は、１分子につき少なくとも１．２個、有利に１． ５〜２．５個のエポキシ基を有していなければならない、樹脂が化学的に単一の 物質ではないため、前記の官能価は、グラム分子量の場合と同様に統計的な平均 値である。適当なエポキシ樹脂は、容易に購入することができる。封止用コンパ ウンド中のエポキシ樹脂の含量は、有利に５〜３０重量％である。The epoxy equivalent weight of these epoxy resins is preferably from 100 to 250. Above species It is of course also possible to use mixtures of different resins of the same class. of resin The gram molecular weight is usually >250, and the gram molecular weight is advantageously between 275 and 150. It is 0. The resin, upon curing, produces a product with a sufficiently high gram molecular weight. For this purpose, the epoxy functionality of the resin is at least 1.2, preferably 1.2 per molecule. Must have 5 to 2.5 epoxy groups, if the resin is chemically single Since it is not a substance, the functionality described above is a statistical average, similar to the case of gram molecular weight. It is a value. Suitable epoxy resins can be readily purchased. Comparator for sealing The content of epoxy resin in the powder is preferably from 5 to 30% by weight.
本発明による封止用コンパウンドの重要な特徴は、該封止用コンパウンドの、有 利に１８０〜４００エポキシ当量、特に２２０〜３２０エポキシ当量を有する、 エラストマーにより改質されたエポキシ樹脂（２）の含量である。例えば、ゴム により改質されたエポキシ樹脂は使用することができる。有利に、例えばドイツ 連邦共和国特許明細書第３６３４０８４号明細書から公知である、弾性シリコー ンによって改質された樹脂は使用される。該明細書には、ポリオルガノシロキサ ンゴムの表面で活性である基、例えばアミノ基、カルボキシ基もしくは無水カル ボン酸基を有しかつ従って後加工前もしくは後加工の際に反応樹脂と化学反応を 起こす、粒度０．０１〜５０μｍを有する、三次元に架橋されたポリオルガノシ ロキサンゴムが挿入されている、エポキシ樹脂も含む反応樹脂が記載されている 。An important feature of the sealing compound according to the invention is that the sealing compound has preferably having an epoxy equivalent weight of 180 to 400, in particular an epoxy equivalent weight of 220 to 320, Content of epoxy resin (2) modified by elastomer. For example, rubber Epoxy resins modified by can be used. Advantageously, for example Germany The elastic silicone known from Federal Republic of Patent Specification No. 3,634,084 The resin modified by this method is used. In the specification, polyorganosiloxa groups that are active on the surface of rubber, such as amino groups, carboxy groups or anhydrous carboxylic groups. It has a bonic acid group and therefore undergoes a chemical reaction with the reactive resin before or during post-processing. three-dimensionally crosslinked polyorganosylene with a particle size of 0.01 to 50 μm Reactive resins are described, including epoxy resins, in which loxane rubber is inserted. .
シリコーンゴムの含量は、広い範囲内で変動してもよく、該含量は通常、成分（ ２）に対して２０〜５０重量％である。The content of silicone rubber may vary within a wide range and is usually determined by the components ( 2) is 20 to 50% by weight.
成分（１）及び（２）の最適な量比は、とりわけそれぞれの場合に解決すべき課 題、選択された樹脂及び殊に該樹脂の官能価ならびに成分（２）のエラストマー 含量に依存する。この最適な量比は、予備試験によって容易に確認することがで きる。必要とされる封止用コンパウンドの性質プロフィールに応じて成分（１） は、より少ないＩで使用することもできるし、完全に省略することもできる。The optimal quantitative ratio of components (1) and (2) depends, inter alia, on the issues to be solved in each case. the selected resins and in particular their functionality and the elastomer of component (2); Depends on content. This optimal ratio can be easily confirmed by preliminary tests. Wear. Ingredients (1) depending on the required property profile of the sealing compound. can be used with less I or omitted entirely.
硬化剤として、この目的に常用の、エポキシ反応性基〉１の官能価を有する物質 、例えばポリアミンならびにポリカルボン酸又はこれらの無水物は使用される。As hardeners, substances with a functionality of epoxy-reactive groups〉1, which are customary for this purpose. , for example polyamines as well as polycarboxylic acids or their anhydrides.
適当な硬化剤は、例えば無水ジカルボン酸、例えば無水フタル酸である。硬化剤 は有利にほぼ化学量論的量で使用されるが、しかしながら、例えば２０当量％ま での過剰量もしくは不足量は、封止用コンパウンドの性質に特筆すべき程度には 影響を及ぼさない。Suitable curing agents are, for example, dicarboxylic anhydrides, such as phthalic anhydride. hardening agent is advantageously used in approximately stoichiometric amounts, however, for example up to 20 equivalent % The excess or deficiency in the properties of the sealing compound is not significant. No effect.
充填剤は通常、４０〜７５重量％、特に５０〜６５重量％の量で使用される。水 冷ジェネレータに使用される場合には、充填剤５５〜６０重量％を含有する封止 用コンパウンドは特に有効である。常用の無機物質、例えば珪砂もしくは石英粉 末、タルク、白亜、酸化アルミニウムまたは水酸化アルミニウムは、それぞれの 場合にそれ自体もしくは相互の混合物の形で使用される。例えば、有利に、２４ ０〜２６０℃の温度に１５〜２０時間加熱されることによって、あらかじめ部分 脱水された水酸化アルミニウムは、好適である。充填剤は通常、粒度０．５〜７ ００μｍで使用される。充填剤の種類及び量ならびに該充填剤の粒度分布は、加 工の際の流れ挙動にばかりではなく、硬化された封止用コンパウンドの性質、例 えば熱伝導性又は靭性、即ち、亀裂形成を阻止する作用を有する所望の性質にも 影響を及ぼす、使用される有機成分を考慮した、与えられた使用目的に最適な充 填剤のパラメータは、予備試験によって容易に確認することができる。Fillers are usually used in amounts of 40 to 75% by weight, especially 50 to 65% by weight. water When used in cold generators, seals containing 55-60% by weight of filler Compounds are particularly effective. Commonly used inorganic substances, such as silica sand or quartz powder powder, talc, chalk, aluminum oxide or aluminum hydroxide. used on their own or in mixtures with each other. For example, advantageously, 24 Partially prepared in advance by being heated to a temperature of 0-260°C for 15-20 hours Dehydrated aluminum hydroxide is preferred. Fillers usually have a particle size of 0.5-7 00 μm is used. The type and amount of filler and the particle size distribution of the filler In addition to the flow behavior during processing, the properties of the cured sealing compound, e.g. For example, thermal conductivity or toughness, i.e. desired properties that have the effect of inhibiting crack formation, may also be used. Optimum filling for a given purpose, taking into account the organic components used, which Filler parameters can be easily confirmed by preliminary tests.
本発明による封止用コンパウンドは、成分（１）〜（４）からなることもできる が、しかし該封止用コンパウンドは、なお別の成分を含有していてもよい、この ようにして、常用の促進剤の１つとの共用によって、該封止用コンパウンドの硬 化に必要な時間を短縮することができる。この目的に常用の物質、例えばイミダ ゾールもしくは第三級アミンが、成分（１）〜（４）の合計に対して有利に０． １〜０．５重量％である量で使用される。The sealing compound according to the invention can also consist of components (1) to (4) However, the sealing compound may also contain further ingredients. In this way, the hardness of the sealing compound can be increased by co-use with one of the commonly used accelerators. The time required for conversion can be shortened. Substances commonly used for this purpose, such as imida The sol or tertiary amine is preferably present in an amount of 0.0, based on the sum of components (1) to (4). It is used in an amount ranging from 1 to 0.5% by weight.
必要に応じて封止用コンパウンドは、無機もしくは有機の着色剤が顔料、顔料ペ ーストもしくは一溶液として混入されることによって、着色することができる。If necessary, the encapsulant compound may contain inorganic or organic colorants, pigments, pigment pigments, etc. Coloring can be achieved by mixing as a yeast or a solution.
着色剤は、場合によっては、成分（１）〜（４）の合計に対して通常０．１〜２ ．５重量％である量で添加される。The coloring agent may be used in an amount of usually 0.1 to 2, based on the total of components (1) to (4). ．． It is added in an amount of 5% by weight.
新規の封止用コンパウンドは、常法で製造され、この場合、成分は、例えば常用 の強力ミキサー中で完全に混合される。さらに該封止用コンパウンドは、常法で 空隙の充填に使用され、即ち、該封止用コンパウンドは通常、空気の排除下で空 隙中に注入されるか又は噴霧される。硬化は、場合によっては種々の温度段階に 加熱することによって行われる。硬化は通常、樹脂、硬化剤及び促進剤に応じて ８時間までを必要とする。The new encapsulating compound is manufactured in a conventional manner, in which case the ingredients are e.g. Mix thoroughly in a high-power mixer. Furthermore, the sealing compound can be prepared in a conventional manner. used to fill voids, i.e. the sealing compound is typically used to fill voids with the exclusion of air. Injected or sprayed into the void. Curing may take place at various temperature stages. This is done by heating. Curing usually depends on the resin, hardener and accelerator Requires up to 8 hours.
この場合には温度は、有利に９０〜１８０℃である。In this case the temperature is preferably between 90 and 180°C.
本発明による封止用コンパウンドは通常、６０℃で粘度約２０００〜約１０００ ０ ｍ Ｐ ａ −ｓを有する。Sealing compounds according to the invention typically have a viscosity of about 2000 to about 1000 at 60°C. It has 0 m P a -s.
得られた硬化成形材料は、次の性質プロフィールを示すニ ー 線熱膨張係数α ３０〜５０・１Ｏ−６（１／’Ｃ） −ガラス転移温度Ｔｇ １３０〜２００℃−熱伝導性 ０．８−１．８Ｗ／ｍＫ −線収縮 Ｏ〜０．４％ 実施例 次の表にｎ載された個々の成分を撹拌容器中で強力に混合した。パーセントの記 載は、重量パーセントを表わす。The resulting cured molding material has the following property profile: - Linear thermal expansion coefficient α 30-50・1O-6 (1/’C) -Glass transition temperature Tg 130-200℃ -Thermal conductivity 0.8-1.8W/mK - Linear shrinkage O ~ 0.4% Example The individual ingredients listed in the table below were mixed intensively in a stirred vessel. percentage The weight percentage is expressed as a percentage by weight.
表 個々の成分 −ビスフェノール −一１５％ Ａエポキシ樹脂（７ ０％）と前記式の脂 環式ＥＰ樹脂（３０ ％）からの混合物 −脂環式エポキシ ２５．５％ −− 樹脂（１）”、Ｓｉ −エラストマーによ り改質された − 脂環式エポキシ ２６％ − 樹脂（ＩＩ）”、 Ｓｉ−エラストマー により改質された − メチルテトラヒ − −１５％ ドロフタル酸無水物 −メチルナト酸無 １７．３％ １７６０％ −水物（メチル−エン ドメチレンテトラヒ ドロフタル酸無水物） − イミダゾール ０．１％ ０．１％ ０．１％−石英粉末 −−３３％ −水酸化アルミニウム −３６，９％ −酸化アルミニウム ５７．１％ −−一 部分脱水された ５６．９ − 水酸化アルミニウム （Ａ１００）Ｉ） １ 使用されたエポキシ樹脂： 封止用コンパウンドを硬化させたところ、該封止用コンパウンドは、次の性質を 示したニ ー 線熱膨張係数 ５０ ３６ ３０ （１０−６（１／’Ｃ） − ガラス転移温度Ｔｇ １６３ １９５ １２９（’Ｃ） −熱伝導性 ０．９７ ０．８５ １．４９亀裂形成傾向を温度変化試験によっ て測定した。この測定のために試験体を急速に１２０℃に加熱し、かつ急激に一 ４０℃に冷却した１例１及び２の流し込みコンパウンドからなる試験体は、５回 の後でもまったく亀裂形成を示さなかったが、その一方で例３による試験体は、 ６０℃に加熱されたにすぎなくとも、最初の回の後でさえ既に亀裂を有していた 。table individual ingredients -Bisphenol -15% A epoxy resin (7 0%) and the fat of the above formula Cyclic EP resin (30 %) mixture from -Alicyclic epoxy 25.5%-- Resin (1)”, Si - Due to elastomer modified - Cycloaliphatic epoxy 26% - Resin (II)”, Si-elastomer modified by - Methyltetrahy - -15% Dolphthalic anhydride -Methylnathoic acid free 17.3% 1760% -Hydrate (methyl-ene Domethylenetetrahy Dolphthalic anhydride) - Imidazole 0.1% 0.1% 0.1% - Quartz powder --33% -Aluminum hydroxide -36.9% - Aluminum oxide 57.1% - Partially dehydrated 56.9 - aluminum hydroxide (A100)I) 1 Epoxy resin used: When the encapsulating compound is cured, it exhibits the following properties: Shown - Linear thermal expansion coefficient 50 36 30 (10-6(1/’C) - Glass transition temperature Tg 163 195 129 ('C) -Thermal conductivity 0.97 0.85 1.49 Crack formation tendency was determined by temperature change test. It was measured using For this measurement, the specimen was rapidly heated to 120°C and then rapidly cooled down. A test specimen consisting of the pouring compounds of Examples 1 and 2 cooled to 40°C was tested five times. The specimen according to Example 3, on the other hand, did not show any crack formation even after Even after the first round, it already had cracks, even though it was only heated to 60°C. .
フロントページの続き （５１） Ｉｎｔ、 Ｃ１，’ 識別記号 庁内整理番号ＨＯＩＬ ２３／３１ （７２）発明者 レオ、クリスチアン ドイツ連邦共和国 Ｄ−７１５１プルクシュデンチン １ ゲーテシュトラーセ ５ＩContinuation of front page (51) Int, C1,' Identification symbol Internal reference number HOIL 23/31 (72) Inventor: Leo, Christian Federal Republic of Germany D-7151 Purgschdentin 1 Goethestrasse 5I
Claims (1)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4138411.3 | 1991-11-22 | ||
| DE19914138411 DE4138411C2 (en) | 1991-11-22 | 1991-11-22 | Curing potting compounds |
| PCT/DE1992/000889 WO1993010540A1 (en) | 1991-11-22 | 1992-10-23 | Direct-hardening sealing compounds |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07501093A true JPH07501093A (en) | 1995-02-02 |
Family
ID=6445342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5508863A Pending JPH07501093A (en) | 1991-11-22 | 1992-10-23 | Curable sealing compound |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0613581A1 (en) |
| JP (1) | JPH07501093A (en) |
| DE (1) | DE4138411C2 (en) |
| WO (1) | WO1993010540A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020079344A (en) * | 2018-11-12 | 2020-05-28 | 株式会社ダイセル | Curable composition |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW430685B (en) * | 1996-07-30 | 2001-04-21 | Nippon Kayaku Kk | Epoxy resin liquid composition for semiconductor encapsulation |
| DE10057111C1 (en) * | 2000-11-16 | 2002-04-11 | Bosch Gmbh Robert | Casting composition for removing thermal energy from electrical or electronic device, comprises epoxide resin, silicone, filler and initiator and cures by chemical reaction, has specified thermal conductivity |
| DE10131116A1 (en) * | 2001-06-28 | 2003-01-23 | Siemens Linear Motor Systems G | Cast part for linear motor e.g. for machine tool, has functional elements embedded in cast body of material containing lower coefficient of thermal expansion particles |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55137125A (en) * | 1979-04-12 | 1980-10-25 | Nippon Soda Co Ltd | Production of polybutadiene-modified epoxy resin |
| DE3229558C2 (en) * | 1982-08-07 | 1984-11-08 | Robert Bosch Gmbh, 7000 Stuttgart | Impregnation casting compound for electrical components |
| US4529755A (en) * | 1982-10-23 | 1985-07-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Epoxy resin composition for encapsulating semiconductor |
| JPS6064483A (en) * | 1983-09-20 | 1985-04-13 | Toshiba Corp | Resin sealed light-emitting device |
| US4518631A (en) * | 1983-11-14 | 1985-05-21 | Dow Corning Corporation | Thixotropic curable coating compositions |
| US4665111A (en) * | 1984-10-12 | 1987-05-12 | Siemens Aktiengesellschaft | Casting compound for electrical and electronic components and modules |
| JPS61192720A (en) * | 1985-02-22 | 1986-08-27 | Nippon Oil Co Ltd | Resin composition for laminated sheet |
| DE3634084A1 (en) * | 1986-10-07 | 1988-04-21 | Hanse Chemie Gmbh | MODIFIED REACTION RESIN, METHOD FOR PRODUCING IT AND ITS USE |
| JPS63273624A (en) * | 1987-05-01 | 1988-11-10 | Ube Ind Ltd | Epoxy resin composition |
| JPH01113454A (en) * | 1987-10-26 | 1989-05-02 | Matsushita Electric Works Ltd | Production of epoxy composition |
| EP0370531B1 (en) * | 1988-11-25 | 1997-08-27 | Kanegafuchi Chemical Industry Co., Ltd. | Two pack type curable composition comprising epoxy resin and silicon-containing elastomeric polymer |
| DE3913488C2 (en) * | 1989-04-25 | 1994-02-03 | Bosch Gmbh Robert | Potting compound for electrical and electronic components |
-
1991
- 1991-11-22 DE DE19914138411 patent/DE4138411C2/en not_active Expired - Fee Related
-
1992
- 1992-10-23 WO PCT/DE1992/000889 patent/WO1993010540A1/en not_active Application Discontinuation
- 1992-10-23 EP EP92922502A patent/EP0613581A1/en not_active Withdrawn
- 1992-10-23 JP JP5508863A patent/JPH07501093A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020079344A (en) * | 2018-11-12 | 2020-05-28 | 株式会社ダイセル | Curable composition |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4138411A1 (en) | 1993-05-27 |
| WO1993010540A1 (en) | 1993-05-27 |
| EP0613581A1 (en) | 1994-09-07 |
| DE4138411C2 (en) | 1995-01-26 |
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