JP3506423B2 - Sealing resin composition and semiconductor sealing device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for encapsulating electronic parts such as semiconductors and a semiconductor encapsulation device encapsulated with the resin composition. More specifically, it relates to a thermosetting epoxy resin containing a polyglycerin fatty acid ester and an epoxy resin composition containing an inorganic filler as a main component, and a semiconductor encapsulation device.

[0002]

2. Description of the Related Art Semiconductors and electronic parts are sealed with a ceramic package or a resin package to protect them from the external environment. Synthetic resin compositions containing agents have become widespread.

This synthetic resin composition comprises a thermosetting resin such as an epoxy resin, an inorganic filler such as silica, and an additive such as silicone oil. Silicone oil has a releasability at the time of molding a package. On the other hand, since the compatibility with the resin is poor, there is a problem in moldability such as stains on the surface of the semiconductor package and blistering. Further, a polyether-modified silicone oil having a good compatibility with a resin has a drawback that it has a low moldability but a low electric resistance.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and is a thermosetting encapsulation excellent in moldability and electrical characteristics and suitable for continuous productivity and workability. A resin composition for semiconductors and a semiconductor encapsulation device are provided.

[0005]

Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventors have found that the epoxy resin composition is blended with a polyglycerin fatty acid ester to improve the compatibility with the resin. The present invention has been completed by finding out that the above objects have been improved and the above objects have been achieved.

That is, the present invention relates to (A) epoxy resin,
(B) Phenolic resin, (C) polyglycerin fatty acid ester and (D) inorganic filler as essential components, and 0.01 to 2.0% by weight of the polyglycerin fatty acid ester of (C) with respect to the resin composition. %, And the inorganic filler of (D) above in an amount of 50 to 95% by weight, which is a thermosetting encapsulating resin composition. A semiconductor encapsulation device is obtained by encapsulating a semiconductor chip with a cured product of the encapsulating resin composition.

The present invention will be described in detail below.

The encapsulating resin composition of the present invention comprises a polyglycerin fatty acid ester and an inorganic filler mixed with an epoxy resin and a phenol resin curing agent.

The epoxy resin (A) used in the present invention is not particularly limited in molecular structure and molecular weight as long as it is a compound having two or more epoxy groups in its molecule, and it is generally used as a material for sealing electronic parts. What is done can be widely included. For example, bisphenol A type epoxy resin,
Examples thereof include bisphenol F type epoxy resin, brominated bisphenol A type epoxy resin, alicyclic epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, and epoxy resin represented by the following general formula. The resins may be used alone or in combination of two or more.

[0010]

[Chemical 1] (However, in the formula, R ¹ and R ² represent a hydrogen atom or an alkyl group, and n represents 0 or an integer of 1 or more, respectively). It is not particularly limited as long as it has two or more phenolic hydroxyl groups capable of reacting,
It can broadly include those generally used as a material for encapsulating electronic components. For example, those represented by the following general formula can be given.

[0011]

[Chemical 2] (However, in the formula, n represents 0 or an integer of 1 or more)

[Chemical 3] (However, in the formula, n represents 0 or an integer of 1 or more.) These phenol resins are used alone or in combination of two or more kinds. The compounding ratio of the phenol resin is such that the equivalent ratio [(a) / (b)] of the epoxy group (a) of the epoxy resin and the phenolic hydroxyl group (b) of the phenol resin is in the range of 0.1 to 10. Is desirable. When the equivalent ratio is less than 0.1 or exceeds 10, heat resistance, moisture resistance,
Molding workability and electric properties of the cured product deteriorate, which is not preferable in any case. Therefore, it is preferable to limit it within the above range.

The polyglycerin fatty acid ester (C) used in the present invention is represented by the following structural formula.

[0013]

[Chemical 4] (However, in the formula, R represents a hydrogen atom or an aliphatic acyl group,
Represents 0 or an integer of 1 or more. Specifically, for example, decaglyceryl pentaoleate and the like can be mentioned. The mixing ratio of these polyglycerin fatty acid ester is 0.01 to the whole resin composition.
It is desirable to contain 2.0% by weight, preferably 0.05 to 1.5% by weight. If this ratio is less than 0.01% by weight, sufficient moldability cannot be obtained, and if it exceeds 2.0% by weight, the moisture resistance decreases and the working life is poor, which is not suitable for practical use.

Examples of the inorganic filler (D) used in the present invention include silica powder, talc, clay, mica, quartz powder, silicon nitride powder, pumice powder, calcium carbonate,
Examples thereof include barium sulfate, zinc oxide, glass beads, and alumina powder, which can be used alone or in combination of two or more.

The blending ratio of the inorganic filler is preferably 50 to 95% by weight based on the total resin composition. If the proportion is less than 50% by weight, the heat resistance, reliability and moldability will be poor, and if it exceeds 95% by weight, the dryness will be large and the moldability will be poor, making it unsuitable for practical use.

The encapsulating resin composition of the present invention contains an epoxy resin, a phenol resin, a polyglycerin fatty acid ester and an inorganic filler as essential components, but to the extent that the object of the present invention is not impaired, and if necessary. , For example, release agents such as natural waxes, synthetic waxes and esters,
A stress reducing component such as an elastomer, a coloring agent such as carbon black, a treatment agent for an inorganic filler such as a silane coupling agent, various curing accelerators, and other additives can be appropriately added and blended.

As a general method for preparing the encapsulating resin composition of the present invention as a molding material, epoxy resin, phenol resin, polyglycerin fatty acid ester,
After blending the inorganic filler and other components and mixing them sufficiently evenly with a mixer or the like, melt mixing treatment with a hot roll or mixing treatment with a kneader etc. is further performed, followed by cooling and solidification, and crushing to an appropriate size. It can be a molding material. The molding material thus obtained is used to seal electronic parts or electrical parts such as semiconductor devices,
If applied to coating, insulation, etc., excellent characteristics and reliability can be imparted.

The semiconductor encapsulation device of the present invention can be easily manufactured by encapsulating a semiconductor chip using the encapsulating resin obtained as described above. The most general method of sealing is a low-pressure transfer molding method, but sealing by injection molding, compression molding, casting or the like is also possible. The encapsulating resin composition is heated and cured during encapsulation, and finally a semiconductor encapsulating device encapsulated with the cured product of the composition is obtained. Curing by heating is 150
It is desirable to heat it to ℃ or above to cure it. The semiconductor device to be sealed is not particularly limited to, for example, an integrated circuit, a large scale integrated circuit, a transistor, a thyristor, a diode and the like.

[0019]

The encapsulating resin composition and the semiconductor encapsulating device of the present invention have desired characteristics by using polyglycerin fatty acid ester as a compounding component. That is, by blending the polyglycerin fatty acid ester, it is possible to mold an electronic component such as a semiconductor encapsulation device which has good filling properties and workability and has improved appearance without lowering the electrical resistance of the cured product.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Next, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples. In the following examples and comparative examples, “%” means “% by weight”.

Example 1 Cresol novolac type epoxy resin (softening point 80 ° C.,
Epoxy equivalent 200) 14.3%, tetrabromobisphenol A type epoxy resin (softening point 70 ° C., epoxy equivalent 400) 1%, novolac type phenol resin (softening point 80 ° C., hydroxyl equivalent 105) 7.7%, pentaolein Decaglyceryl acid 1%, fused silica powder (average particle size 20
75% and carnauba wax 1% were mixed, kneaded by a roll mill at room temperature, further kneaded at 90 to 95 ° C., and cooled and ground to produce a molding material.

The thus-produced molding material was transfer-injected into a mold heated to 175 ° C. and cured to prepare a molded product (sealed product). About this product High temperature volume
Tests of resistivity, moisture resistance and continuous formability were conducted, and the results are shown in Table 1.

Example 2 Cresol novolac type epoxy resin (softening point 80 ° C.,
Epoxy equivalent 200) 13.4%, tetrabromobisphenol A type epoxy resin (softening point 70 ° C, epoxy equivalent 400) 1%, novolac type phenol resin (softening point 80 ° C, phenol equivalent 105) 8.6%, pentaolein Decaglyceryl acid 1%, fused silica powder (average particle size 20 μm) 75% and carnauba wax 1% were mixed and kneaded with a roll mill at room temperature, and further 90 to 95 ° C.
Was kneaded and cooled and pulverized to produce a molding material.

The molding material thus produced was transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product). About this product High temperature volume
Tests of resistivity, moisture resistance and continuous formability were conducted, and the results are shown in Table 1.

Example 3 Cresol novolac type epoxy resin (softening point 80 ° C.,
Epoxy equivalent 200) 14.6%, tetrabromobisphenol A type epoxy resin (softening point 70 ° C, epoxy equivalent 400) 1%, novolac type phenol resin (softening point 80 ° C, phenol equivalent 105) 7.9%, pentaolein Decaglyceryl acid 0.5%, fused silica powder (average particle size 20 μm) 75% and carnauba wax 1% were mixed and kneaded with a roll mill at room temperature, and further 90-95.
Kneading was performed at 0 ° C., and the mixture was cooled and ground to produce a molding material.

The molding material thus produced was transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product). About this product High temperature volume
Tests of resistivity, moisture resistance and continuous formability were conducted, and the results are shown in Table 1.

Comparative Example 1 Cresol novolac type epoxy resin (softening point 80 ° C.,
Epoxy equivalent 200) 14.3%, tetrabromobisphenol A type epoxy resin (softening point 70 ° C, epoxy equivalent 400) 1%, novolac type phenol resin (softening point 80 ° C, phenol equivalent 105) 7.7%, polyether Modified silicone oil 1%, fused silica powder (average particle size 20 μm) 75% and carnauba wax 1% were mixed and kneaded with a roll mill at room temperature, and further 90 to 95 ° C.
Was kneaded and cooled and pulverized to produce a molding material.

The molding material thus produced was transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product). About this product High temperature volume
Tests of resistivity, moisture resistance and continuous formability were conducted, and the results are shown in Table 1.

Comparative Example 2 Cresol novolac type epoxy resin (softening point 80 ° C.,
Epoxy equivalent 200) 14.6%, tetrabromobisphenol A type epoxy resin (softening point 70 ° C, epoxy equivalent 400) 1%, novolac type phenol resin (softening point 80 ° C, hydroxyl equivalent 105) 7.9%, polyether Modified silicone oil 0.5%, fused silica powder (average particle size 20 μm) 75% and carnauba wax 1% were blended, kneaded with a roll mill at room temperature, and further 90 to 95 ° C.
Was kneaded and cooled and pulverized to produce a molding material.

The molding material thus produced was transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product). About this product High temperature volume
Tests of resistivity, moisture resistance and continuous formability were conducted, and the results are shown in Table 1.

[0031]

[Table 1] * 1: Measured under conditions of 150 ° C. and 500 V for a molded and cured product molded under the conditions of 175 ° C. and 2 minutes.

* 2: A silicon chip (test element) having aluminum wiring is adhered to a copper frame by using a molding material, transfer molded at 175 ° C. for 2 minutes, and a TO-
After making 92 molded products and post-curing at 175 ° C. for 4 hours, 50 samples were subjected to PCT in saturated steam at 127 ° C. and 2.5 atmospheric pressure, and the number of defective conduction due to disconnection was counted. And the number of defects.

* 3: TO-92 continuous productivity was evaluated by transfer molding under molding conditions of 175 ° C. for 60 seconds, and the number of molding shots until appearance failure of the package was counted.

[0034]

As is apparent from the above description and Table 1, the encapsulating resin composition of the present invention has excellent moldability, electrical characteristics, filling properties and workability. By using the composition for encapsulating an electronic component, it is possible to improve both workability and performance of the semiconductor encapsulation device.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI H01L 23/31 (56) Reference JP 2002-80695 (JP, A) JP 9-286844 (JP, A) JP Flat 4-202429 (JP, A) JP 10-237318 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C08L 63/00-63/10 C08G 59/62 C08K 5 / 103 H01L 23/29

Claims (2)

(57) [Claims] 1. A resin composition comprising (A) an epoxy resin, (B) a phenol resin, (C) a polyglycerin fatty acid ester and (D) an inorganic filler as essential components, and said (C) polyglycerin fatty acid. 0.0 to ester
1 to 2.0% by weight, and (D) the inorganic filler in 50
A resin composition for encapsulation, characterized in that it is contained in a proportion of ˜95% by weight. 2. A resin composition comprising (A) an epoxy resin, (B) a phenol resin, (C) a polyglycerin fatty acid ester and (D) an inorganic filler as essential components, wherein the (C) polyglycerin fatty acid is added to the resin composition. 0.0 to ester
1 to 2.0% by weight, and (D) the inorganic filler in 50
A semiconductor encapsulation device, which is obtained by encapsulating a semiconductor chip with a cured product of a resin composition for encapsulation that is contained in a proportion of ˜95 wt%.