DE3229558C2 - Impregnation casting compound for electrical components - Google Patents
Impregnation casting compound for electrical componentsInfo
- Publication number
- DE3229558C2 DE3229558C2 DE19823229558 DE3229558A DE3229558C2 DE 3229558 C2 DE3229558 C2 DE 3229558C2 DE 19823229558 DE19823229558 DE 19823229558 DE 3229558 A DE3229558 A DE 3229558A DE 3229558 C2 DE3229558 C2 DE 3229558C2
- Authority
- DE
- Germany
- Prior art keywords
- potting
- filler
- viscosity
- hardener
- accelerator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Es wird eine aushärtbare Vergußmasse vorgeschlagen, die dem Imprägnieren und Vergießen elektrischer Bauteile dient und aus einem Harz, einem Härter, einem Beschleuniger und einem Füllstoff besteht. Als Harz wird ein Epoxid auf Basis Bisphenol A und Cycloaliphat mit einer Viskosität < 5000 mPas bei 25 ° C, als Härter ein modifiziertes Dicarbonsäureanhydrid, als Beschleuniger ein Imidazol und als Füllstoff Kreide eingesetzt. Der Füllstoff ist vorzugsweise in einer Menge von mehr als 53 Gew.-%, bezogen auf die Gesamtmasse, enthalten. Die vorgeschlagene Vergußmasse weist eine niedrige Viskosität auf, so daß sich Imprägnieren und Vergießen in einem einzigen Arbeitsgang durchführen lassen. Der thermische Ausdehnungskoeffizient sowie der Volumenschwund sind kleiner als bei im Handel erhältlichen Massen und die Vergußmasse weist einen hohen Glasübergangspunkt auf, was zu einer hohen Wärme- und Temperaturwechselbeständigkeit der Masse führt. wird der Kunstpenis mit den Gefühlssonden in die Scheide eingeführt, um das glA hardenable potting compound is proposed which is used for impregnating and potting electrical components and consists of a resin, a hardener, an accelerator and a filler. An epoxy based on bisphenol A and cycloaliphatic with a viscosity of <5000 mPas at 25 ° C is used as the resin, a modified dicarboxylic acid anhydride as the hardener, an imidazole as the accelerator and chalk as the filler. The filler is preferably contained in an amount of more than 53% by weight, based on the total mass. The proposed potting compound has a low viscosity, so that impregnation and potting can be carried out in a single operation. The coefficient of thermal expansion and the volume shrinkage are smaller than in the case of commercially available compounds and the potting compound has a high glass transition point, which leads to a high resistance to heat and temperature changes in the compound. the artificial penis with the sensory probes is inserted into the vagina to remove the gl
Description
6060
Verwendet wird ein Epoxidharz auf Basis Bisphenol A und einem Cycloolefln Im Verhältnis 70:30 Gew.-Tellen, das bei 25'C eine Viskosität kleiner als 5000 mPa · s hat. Dazu wird ein modifiziertes Dlcarbonsäureanhydrld, z. B. Phialsäureanhydrld als Härter, sowie ein Imidazol, z. B. Pyrazol als Beschleuniger und Kreide alsAn epoxy resin based on bisphenol is used A and a cycloolefin in a ratio of 70:30 parts by weight, which at 25 ° C has a viscosity of less than 5000 mPa · s has. For this purpose, a modified carboxylic acid anhydride is used, z. B. Phialsäureanhydrld as a hardener, and an imidazole, z. B. pyrazole as an accelerator and chalk as
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19823229558 DE3229558C2 (en) | 1982-08-07 | 1982-08-07 | Impregnation casting compound for electrical components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19823229558 DE3229558C2 (en) | 1982-08-07 | 1982-08-07 | Impregnation casting compound for electrical components |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3229558A1 DE3229558A1 (en) | 1984-02-09 |
DE3229558C2 true DE3229558C2 (en) | 1984-11-08 |
Family
ID=6170398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19823229558 Expired DE3229558C2 (en) | 1982-08-07 | 1982-08-07 | Impregnation casting compound for electrical components |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3229558C2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0668012B2 (en) * | 1987-09-15 | 1994-08-31 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Encapsulating composition and electronic device using the composition |
US5189080A (en) * | 1989-04-25 | 1993-02-23 | Robert Bosch Gmbh | Epoxy resin composition for encapsulating electric circuit components |
DE4138411C2 (en) * | 1991-11-22 | 1995-01-26 | Bosch Gmbh Robert | Curing potting compounds |
HU220297B (en) * | 1994-07-01 | 2001-11-28 | Robert Bosch Gmbh. | Epoxy resin casting composition |
DE19523897C2 (en) * | 1995-06-30 | 2002-10-24 | Bosch Gmbh Robert | Use of silicone-modified epoxy resins as casting compounds for electrotechnical or electronic components |
US6001902A (en) * | 1996-03-27 | 1999-12-14 | Ciba Specialty Chemicals Corp. | Wollastonite-containing curable epoxy resin mixture |
EP0984463B1 (en) | 1997-05-23 | 2003-03-19 | Hitachi, Ltd. | Ignition coil unit for engine and engine provided with plastic head cover |
-
1982
- 1982-08-07 DE DE19823229558 patent/DE3229558C2/en not_active Expired
Non-Patent Citations (1)
Title |
---|
NICHTS-ERMITTELT |
Also Published As
Publication number | Publication date |
---|---|
DE3229558A1 (en) | 1984-02-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |