SU537096A1 - Epoxy composition - Google Patents

Description

(54) EPOXY COMPOSITION

one

This invention relates to the field of producing epoxy compositions based on diurethane epoxides used as casting and sealing compounds in electronics, electrical engineering and other industries.

The epoxy composition based on diurethane epoxide, epoxy resin and amine type 1 hardener is known.

A disadvantage of the known composition is the low viability after the introduction of the hardener (up to 3 hours at room temperature), which does not allow preparing the composition in large quantities and creates difficulties in pouring large-sized products with a complex profile.

The purpose of the present invention is to increase the viability of the composition.

The goal is achieved by the fact that the composition as a hardener contains a silicone compound of the general formula

RSi (OR) n (OCOR) 3-n,

where R is alkyl with

aryl with sd;

R is alkyl with

R is normal or iso-alkyl with C1-4 and

, 1, in the following ratio of components, weight. including:

Oligodiurethane epoxides80-100

Epoxy Dianova resin15-20

Silicone Compound 5-10

After mixing the components of the composition, mixing and evacuating it, it can be stored at room temperature for up to two weeks. During storage, there is a slight increase in viscosity (up to 50%) compared to the original.

Example 1. A mixture of 100 wt. including oligodienediurepan epoxide (PDI-ZA) with the content of epoxy groups of 2.12% and 10 weight. including methyltriacetoxysilane CHz51 (OOSNz) s mix and vacuum at 40 ° C and 1 mm RT. Art. for 6 hours (viscosity 460 pz), then stored at room temperature for 6 days. On the seventh day, the composition had a viscosity of 613 pz. The composition is cured at 130 ° C for 1 hour.

The physicomechanical characteristics of the cured composition (in comparison with the known) are given in the table.

Example 2. For 2.5 hours, a mixture of 80 wt. h. PDI-FOR, 20 wt. including epoxy resin ED-5 and 10 wt. including methyltriacetoxysilap. The initial viscosity is 440 pz, on the seventh day - 604 pz. Curing at 100 ° C for 40 hours (see table).

Example 3. Within 2 hours, mix and vacuum the mixture of 80 weight. h. PDI-FOR, 20 wt. including epoxy resin and 5 wt. including methyltriacetoxysilane. The initial viscosity is 421 pz, on the eighth day — 568 pz. Curing at 100 ° C for 105 hours (table).

Example 4. For 2 hours, mix and vacuum (2 mm RT. Art.) A mixture of 100 weight. including PDI-FOR with the content of epoxy groups of 3.85% and 10 weight. including methyltriisobutyloxysilane CH3-51 OOSCH (CH3) Initial viscosity 463 pz, on the fifth day - 528 pz. Curing at 100 ° C for 17 hours (Table 1).

Example 5. For 2 hours, mix and vacuum (2 mm RT. Art.) A mixture of 100 weight. including diurethane epoxide PEF-ZA with an epoxy content of 6.27% and 10 wt. including methyltriacetoxysilane. The initial viscosity is 130 pz, on the seventh day, 183 pz. Curing at 100 ° C for 10 hours (table).

Example 6. For 2 hours, mix and vacuum (2 mm RT. Art.) A mixture of 100 weight. including PEF-ZA and 5 wt. including methyltriacetoxysilane. The initial viscosity is 128 pz, on the eighth day, 161 pz. Curing at 100 ° C for 10 hours (table).

Example 7. Within 2 hours, mix and vacuum (2 mm Hg. Art.) A mixture of 100 in. including PEF-ZA and 10 wt. including methylbutoxydiocetoxysilane CH3-Si (OC4H9) - (OCOH3) 2. The initial viscosity is 114 pz, on the fourteenth day, 128 pz. Curing at 100 ° C for 24 hours (table).

Example 8. Within 2 hours, mix and vacuum (2 mm RT. Art.) A mixture of 100 weight. h. PDI-ZA and 10 wt. including phenyltributyroxysilane CsHsSi- (OOSzN7) h. The initial viscosity is 440 pz, on the sixth day - 548 pz.

Curing at 100 ° C for 24 hours (table).