JPS6438420A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPS6438420A JPS6438420A JP19392687A JP19392687A JPS6438420A JP S6438420 A JPS6438420 A JP S6438420A JP 19392687 A JP19392687 A JP 19392687A JP 19392687 A JP19392687 A JP 19392687A JP S6438420 A JPS6438420 A JP S6438420A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- optionally
- agent
- aln
- colorant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To obtain the title material excellent in thermal conductivity and reliability of moisture resistance, by mixing an epoxy resin with a specified AlN and optionally a crosslinking agent, a curing agent, a cure accelerator, a mold release, a colorant, a coupling agent, etc. CONSTITUTION:A curable epoxy resin (A) having at least two epoxy groups in the molecule is mixed with AlN (B) of a mean particle diameter of 1-50mu, preferably surface-treated with an organopolysiloxane, and optionally a cure accelerator based on a phosphorus compound and/or tert. amine, a crosslinking agent, a curing agent, a mold release, a colorant, a coupling agent, a filler other than component B, etc. and the obtained mixture is kneaded, and ground and optionally granulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19392687A JPS6438420A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19392687A JPS6438420A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6438420A true JPS6438420A (en) | 1989-02-08 |
Family
ID=16316041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19392687A Pending JPS6438420A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6438420A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03126765A (en) * | 1989-10-02 | 1991-05-29 | Siemens Ag | Composite material resistant to high temperature |
| JPH03287654A (en) * | 1990-04-05 | 1991-12-18 | Shin Etsu Chem Co Ltd | Epoxy resin composition for semiconductor sealing and semiconductor device sealed therewith |
| JPH03295863A (en) * | 1990-04-10 | 1991-12-26 | Toyo Alum Kk | Production of spherical aluminum nitride powder |
| JPH04124006A (en) * | 1990-09-14 | 1992-04-24 | Kawasaki Steel Corp | Fine spherical sintered compact of aln and its production |
| JP2003128956A (en) * | 2001-07-12 | 2003-05-08 | National Cheng Kung Univ | Method for treating surface in order to prepare water- resistant aluminum nitride powder |
| WO2014208352A1 (en) * | 2013-06-25 | 2014-12-31 | 味の素株式会社 | Resin composition |
-
1987
- 1987-08-03 JP JP19392687A patent/JPS6438420A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03126765A (en) * | 1989-10-02 | 1991-05-29 | Siemens Ag | Composite material resistant to high temperature |
| JPH03287654A (en) * | 1990-04-05 | 1991-12-18 | Shin Etsu Chem Co Ltd | Epoxy resin composition for semiconductor sealing and semiconductor device sealed therewith |
| JPH03295863A (en) * | 1990-04-10 | 1991-12-26 | Toyo Alum Kk | Production of spherical aluminum nitride powder |
| JPH04124006A (en) * | 1990-09-14 | 1992-04-24 | Kawasaki Steel Corp | Fine spherical sintered compact of aln and its production |
| JP2003128956A (en) * | 2001-07-12 | 2003-05-08 | National Cheng Kung Univ | Method for treating surface in order to prepare water- resistant aluminum nitride powder |
| WO2014208352A1 (en) * | 2013-06-25 | 2014-12-31 | 味の素株式会社 | Resin composition |
| JPWO2014208352A1 (en) * | 2013-06-25 | 2017-02-23 | 味の素株式会社 | Resin composition |
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