JPS6438426A - Epoxy resin molding material - Google Patents

Epoxy resin molding material

Info

Publication number
JPS6438426A
JPS6438426A JP19392887A JP19392887A JPS6438426A JP S6438426 A JPS6438426 A JP S6438426A JP 19392887 A JP19392887 A JP 19392887A JP 19392887 A JP19392887 A JP 19392887A JP S6438426 A JPS6438426 A JP S6438426A
Authority
JP
Japan
Prior art keywords
pack
epoxy resin
mixture
optionally
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19392887A
Other languages
Japanese (ja)
Inventor
Yasuhiro Kyotani
Munetomo Torii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP19392887A priority Critical patent/JPS6438426A/en
Publication of JPS6438426A publication Critical patent/JPS6438426A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the title material excellent in cracking resistance, by mixing a mixture of an epoxy resin with a phenolic resin at least either of which has been reacted with a two-pack curable silicone rubber with, optionally, a crosslinking agent, a curing agent, etc. CONSTITUTION:A curable epoxy resin (a) having at least two epoxy groups in the molecule and/or a phenolic resin (b) are reacted by heating with a two- pack curable silicone rubber (c) comprising pack A comprising a functional group-terminated diorganosiloxane and pack B comprising an at least trifunctional silane for linking and crosslinking base polysiloxanes into a three- dimensional rubbery elastomer and a catalyst to obtain a reaction product. A mixture of components (a) with (b) at least either of which is said reaction product is optionally mixed with a cure accelerator based on a phosphorus compound and/or a tert. amine, a crosslinking agent, a curing agent, a mold release, a colorant, a coupling agent, a filler, etc. (d), and the obtained mixture is kneaded, ground and optionally granulated.
JP19392887A 1987-08-03 1987-08-03 Epoxy resin molding material Pending JPS6438426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19392887A JPS6438426A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19392887A JPS6438426A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Publications (1)

Publication Number Publication Date
JPS6438426A true JPS6438426A (en) 1989-02-08

Family

ID=16316075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19392887A Pending JPS6438426A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Country Status (1)

Country Link
JP (1) JPS6438426A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234625A (en) * 1988-07-25 1990-02-05 Toshiba Chem Corp Sealing resin composition
JPH0362844A (en) * 1989-02-27 1991-03-18 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627723A (en) * 1985-07-03 1987-01-14 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS63241021A (en) * 1987-03-27 1988-10-06 Hitachi Chem Co Ltd Epoxy resin molding material for sealing electronic component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627723A (en) * 1985-07-03 1987-01-14 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS63241021A (en) * 1987-03-27 1988-10-06 Hitachi Chem Co Ltd Epoxy resin molding material for sealing electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234625A (en) * 1988-07-25 1990-02-05 Toshiba Chem Corp Sealing resin composition
JPH0362844A (en) * 1989-02-27 1991-03-18 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device

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