JPS6438421A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPS6438421A JPS6438421A JP19392187A JP19392187A JPS6438421A JP S6438421 A JPS6438421 A JP S6438421A JP 19392187 A JP19392187 A JP 19392187A JP 19392187 A JP19392187 A JP 19392187A JP S6438421 A JPS6438421 A JP S6438421A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- optionally
- agent
- spherical silica
- molding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To obtain the title material excellent in thermal conductivity and less abrasive to a mold, by mixing an epoxy resin with specified BN and spherical silica and optionally a crosslinking agent, a cure accelerator, a curing agent, a colorant, a coupling agent, etc. CONSTITUTION:A curable epoxy resin (A) having at least two epoxy groups in the molecule is mixed with BN and spherical silica (B) of a mean particle diameter <=10mu, preferably surface-treated with an organosiloxane, and optionally a cure accelerator based on a phosphorus compound and/or a tert. amine, a crosslinking agent, a curing agent, a mold release, a coupling agent, a filler other than component B, etc., and the obtained mixture is kneaded, ground and optionally granulated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19392187A JPS6438421A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19392187A JPS6438421A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6438421A true JPS6438421A (en) | 1989-02-08 |
Family
ID=16315955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19392187A Pending JPS6438421A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6438421A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008179724A (en) * | 2007-01-25 | 2008-08-07 | Nitto Denko Corp | Epoxy resin composition for semiconductor packaging and semiconductor device obtained by using the same |
-
1987
- 1987-08-03 JP JP19392187A patent/JPS6438421A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008179724A (en) * | 2007-01-25 | 2008-08-07 | Nitto Denko Corp | Epoxy resin composition for semiconductor packaging and semiconductor device obtained by using the same |
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