JPS6438421A - Epoxy resin molding material - Google Patents

Epoxy resin molding material

Info

Publication number
JPS6438421A
JPS6438421A JP19392187A JP19392187A JPS6438421A JP S6438421 A JPS6438421 A JP S6438421A JP 19392187 A JP19392187 A JP 19392187A JP 19392187 A JP19392187 A JP 19392187A JP S6438421 A JPS6438421 A JP S6438421A
Authority
JP
Japan
Prior art keywords
epoxy resin
optionally
agent
spherical silica
molding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19392187A
Other languages
Japanese (ja)
Inventor
Hideki Okabe
Hirohiko Kagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP19392187A priority Critical patent/JPS6438421A/en
Publication of JPS6438421A publication Critical patent/JPS6438421A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the title material excellent in thermal conductivity and less abrasive to a mold, by mixing an epoxy resin with specified BN and spherical silica and optionally a crosslinking agent, a cure accelerator, a curing agent, a colorant, a coupling agent, etc. CONSTITUTION:A curable epoxy resin (A) having at least two epoxy groups in the molecule is mixed with BN and spherical silica (B) of a mean particle diameter <=10mu, preferably surface-treated with an organosiloxane, and optionally a cure accelerator based on a phosphorus compound and/or a tert. amine, a crosslinking agent, a curing agent, a mold release, a coupling agent, a filler other than component B, etc., and the obtained mixture is kneaded, ground and optionally granulated.
JP19392187A 1987-08-03 1987-08-03 Epoxy resin molding material Pending JPS6438421A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19392187A JPS6438421A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19392187A JPS6438421A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Publications (1)

Publication Number Publication Date
JPS6438421A true JPS6438421A (en) 1989-02-08

Family

ID=16315955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19392187A Pending JPS6438421A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Country Status (1)

Country Link
JP (1) JPS6438421A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008179724A (en) * 2007-01-25 2008-08-07 Nitto Denko Corp Epoxy resin composition for semiconductor packaging and semiconductor device obtained by using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008179724A (en) * 2007-01-25 2008-08-07 Nitto Denko Corp Epoxy resin composition for semiconductor packaging and semiconductor device obtained by using the same

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