JPS6490252A - Epoxy resin composition for semiconductor sealing - Google Patents

Epoxy resin composition for semiconductor sealing

Info

Publication number
JPS6490252A
JPS6490252A JP24671387A JP24671387A JPS6490252A JP S6490252 A JPS6490252 A JP S6490252A JP 24671387 A JP24671387 A JP 24671387A JP 24671387 A JP24671387 A JP 24671387A JP S6490252 A JPS6490252 A JP S6490252A
Authority
JP
Japan
Prior art keywords
epoxy resin
flexibilizer
inorganic filler
curing agent
cure accelerator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24671387A
Other languages
Japanese (ja)
Inventor
Yukio Takigawa
Kota Nishii
Azuma Matsuura
Yoshihiro Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP24671387A priority Critical patent/JPS6490252A/en
Publication of JPS6490252A publication Critical patent/JPS6490252A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the title composition low in stress and excellent in moisture resistance, heat resistance, mechanical properties, etc., by mixing a novolac epoxy resin with a curing agent, a cure accelerator, a coupling agent, an inorganic filler and a specified flexibilizer. CONSTITUTION:An ethylene/propylene/diene terpolymer (a) as a matrix is graft- copolymerized with a short nylon fiber (b) of an average fiber diameter of 0.1-0.5mum as a reinforcing agent to obtain a flexibilizer (B) comprising a short fiber rubber. 100pts.wt. novolac epoxy resin (A) (e.g., cresol epoxy resin) is mixed with 5-30pts.wt. component B, 25-75pts.wt. curing agent (C) (e.g., phenol novolac resin), 0.5-5pts.wt. cure accelerator (D) (e.g., triphenylphosphine), 50-85wt.%, based on the obtained composition, inorganic filler (F) (e.g., fused silica powder) and, optionally, a mold release, a flame retardant, a pigment, etc. (G).
JP24671387A 1987-09-30 1987-09-30 Epoxy resin composition for semiconductor sealing Pending JPS6490252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24671387A JPS6490252A (en) 1987-09-30 1987-09-30 Epoxy resin composition for semiconductor sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24671387A JPS6490252A (en) 1987-09-30 1987-09-30 Epoxy resin composition for semiconductor sealing

Publications (1)

Publication Number Publication Date
JPS6490252A true JPS6490252A (en) 1989-04-06

Family

ID=17152537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24671387A Pending JPS6490252A (en) 1987-09-30 1987-09-30 Epoxy resin composition for semiconductor sealing

Country Status (1)

Country Link
JP (1) JPS6490252A (en)

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