JPS6490252A - Epoxy resin composition for semiconductor sealing - Google Patents
Epoxy resin composition for semiconductor sealingInfo
- Publication number
- JPS6490252A JPS6490252A JP24671387A JP24671387A JPS6490252A JP S6490252 A JPS6490252 A JP S6490252A JP 24671387 A JP24671387 A JP 24671387A JP 24671387 A JP24671387 A JP 24671387A JP S6490252 A JPS6490252 A JP S6490252A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- flexibilizer
- inorganic filler
- curing agent
- cure accelerator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To obtain the title composition low in stress and excellent in moisture resistance, heat resistance, mechanical properties, etc., by mixing a novolac epoxy resin with a curing agent, a cure accelerator, a coupling agent, an inorganic filler and a specified flexibilizer. CONSTITUTION:An ethylene/propylene/diene terpolymer (a) as a matrix is graft- copolymerized with a short nylon fiber (b) of an average fiber diameter of 0.1-0.5mum as a reinforcing agent to obtain a flexibilizer (B) comprising a short fiber rubber. 100pts.wt. novolac epoxy resin (A) (e.g., cresol epoxy resin) is mixed with 5-30pts.wt. component B, 25-75pts.wt. curing agent (C) (e.g., phenol novolac resin), 0.5-5pts.wt. cure accelerator (D) (e.g., triphenylphosphine), 50-85wt.%, based on the obtained composition, inorganic filler (F) (e.g., fused silica powder) and, optionally, a mold release, a flame retardant, a pigment, etc. (G).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24671387A JPS6490252A (en) | 1987-09-30 | 1987-09-30 | Epoxy resin composition for semiconductor sealing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24671387A JPS6490252A (en) | 1987-09-30 | 1987-09-30 | Epoxy resin composition for semiconductor sealing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6490252A true JPS6490252A (en) | 1989-04-06 |
Family
ID=17152537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24671387A Pending JPS6490252A (en) | 1987-09-30 | 1987-09-30 | Epoxy resin composition for semiconductor sealing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6490252A (en) |
-
1987
- 1987-09-30 JP JP24671387A patent/JPS6490252A/en active Pending
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