JPS6438427A - Epoxy resin molding material - Google Patents

Epoxy resin molding material

Info

Publication number
JPS6438427A
JPS6438427A JP19393087A JP19393087A JPS6438427A JP S6438427 A JPS6438427 A JP S6438427A JP 19393087 A JP19393087 A JP 19393087A JP 19393087 A JP19393087 A JP 19393087A JP S6438427 A JPS6438427 A JP S6438427A
Authority
JP
Japan
Prior art keywords
epoxy resin
agent
optionally
mixture
reacted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19393087A
Other languages
Japanese (ja)
Inventor
Munetomo Torii
Koji Ikeda
Yasuhiro Kyotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP19393087A priority Critical patent/JPS6438427A/en
Publication of JPS6438427A publication Critical patent/JPS6438427A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the title material which is excellent in mechanical strengths and does not form mold-flash during molding, by mixing a mixture of an epoxy resin with a phenolic resin at least either of which has been reacted with a modified silicone oil with, optionally, a crosslinking, agent, a curing agent, etc. CONSTITUTION:A curable epoxy resin (A) having at least two epoxy groups in the molecule and/or a phenolic resin (B) are reacted with 0.05-0.5wt.%, based on the obtained material, modified silicone oil (C) to obtain a reaction product. A mixture of components (A) with (B) at least either of which is said reaction product is mixed with, optionally, a crosslinking agent, a cure accelerator, a curing agent, a mold release, a colorant, a coupling agent, a filler, etc. (D), and the obtained mixture is kneaded, ground and optionally granulated to obtain the title material.
JP19393087A 1987-08-03 1987-08-03 Epoxy resin molding material Pending JPS6438427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19393087A JPS6438427A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19393087A JPS6438427A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Publications (1)

Publication Number Publication Date
JPS6438427A true JPS6438427A (en) 1989-02-08

Family

ID=16316108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19393087A Pending JPS6438427A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Country Status (1)

Country Link
JP (1) JPS6438427A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234625A (en) * 1988-07-25 1990-02-05 Toshiba Chem Corp Sealing resin composition
JPH0362844A (en) * 1989-02-27 1991-03-18 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234625A (en) * 1988-07-25 1990-02-05 Toshiba Chem Corp Sealing resin composition
JPH0362844A (en) * 1989-02-27 1991-03-18 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device

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