JPS6438427A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPS6438427A JPS6438427A JP19393087A JP19393087A JPS6438427A JP S6438427 A JPS6438427 A JP S6438427A JP 19393087 A JP19393087 A JP 19393087A JP 19393087 A JP19393087 A JP 19393087A JP S6438427 A JPS6438427 A JP S6438427A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- agent
- optionally
- mixture
- reacted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To obtain the title material which is excellent in mechanical strengths and does not form mold-flash during molding, by mixing a mixture of an epoxy resin with a phenolic resin at least either of which has been reacted with a modified silicone oil with, optionally, a crosslinking, agent, a curing agent, etc. CONSTITUTION:A curable epoxy resin (A) having at least two epoxy groups in the molecule and/or a phenolic resin (B) are reacted with 0.05-0.5wt.%, based on the obtained material, modified silicone oil (C) to obtain a reaction product. A mixture of components (A) with (B) at least either of which is said reaction product is mixed with, optionally, a crosslinking agent, a cure accelerator, a curing agent, a mold release, a colorant, a coupling agent, a filler, etc. (D), and the obtained mixture is kneaded, ground and optionally granulated to obtain the title material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19393087A JPS6438427A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19393087A JPS6438427A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6438427A true JPS6438427A (en) | 1989-02-08 |
Family
ID=16316108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19393087A Pending JPS6438427A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6438427A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0234625A (en) * | 1988-07-25 | 1990-02-05 | Toshiba Chem Corp | Sealing resin composition |
JPH0362844A (en) * | 1989-02-27 | 1991-03-18 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device |
-
1987
- 1987-08-03 JP JP19393087A patent/JPS6438427A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0234625A (en) * | 1988-07-25 | 1990-02-05 | Toshiba Chem Corp | Sealing resin composition |
JPH0362844A (en) * | 1989-02-27 | 1991-03-18 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0419003A3 (en) | Thermosetting powder coating composition | |
MX9606181A (en) | Curable compositions. | |
JPS6438424A (en) | Epoxy resin molding material | |
DE3568787D1 (en) | Method of producing moulded parts by compressing fibrous material with simultaneous bonding | |
JPS6438427A (en) | Epoxy resin molding material | |
JPS6438420A (en) | Epoxy resin molding material | |
ATE151098T1 (en) | EPOXY MATTRICE HARDENED WITH POLYIMIDE THERMOPLASTIC RESIN | |
JPS6438426A (en) | Epoxy resin molding material | |
JPS6438422A (en) | Epoxy resin molding material | |
JPS6438421A (en) | Epoxy resin molding material | |
JPS6479253A (en) | Epoxy resin molding material for sealing electronic component | |
JPS6438423A (en) | Epoxy resin molding material | |
JPS57116628A (en) | Vulcanization bonding method for rubber and reinforcing material | |
JPS55133438A (en) | Polyolefin resin composition | |
JPS5213537A (en) | Preparation of plastic molding composition with improved dimensional r estoration | |
EP0338694A3 (en) | Process for preparation of cured resin molded article and reactive curable molding composition used therefor | |
JPS5749624A (en) | Preparation of thermoplastic resin composition | |
JPS6438416A (en) | Epoxy resin molding material | |
EP0348225A3 (en) | Epoxy resin molded article with marbled pattern | |
JPS6438425A (en) | Epoxy resin molding material | |
JPS6438419A (en) | Epoxy resin molding material | |
JPS6438417A (en) | Epoxy resin molding material | |
JPS6460623A (en) | Epoxy resin composition for semiconductor sealing | |
JPS53127573A (en) | Manufacture of fiber reinforced composite material | |
JPH01185353A (en) | Production of epoxy resin molding material |