JPS6438417A - Epoxy resin molding material - Google Patents

Epoxy resin molding material

Info

Publication number
JPS6438417A
JPS6438417A JP19392587A JP19392587A JPS6438417A JP S6438417 A JPS6438417 A JP S6438417A JP 19392587 A JP19392587 A JP 19392587A JP 19392587 A JP19392587 A JP 19392587A JP S6438417 A JPS6438417 A JP S6438417A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin molding
molding material
reaction product
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19392587A
Other languages
Japanese (ja)
Inventor
Koji Ikeda
Hideki Okabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP19392587A priority Critical patent/JPS6438417A/en
Publication of JPS6438417A publication Critical patent/JPS6438417A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To obtain an epoxy resin molding material which does not form mold-flash during molding and gives a molding improved in cracking resistance, by adding a reaction product comprising four specified components to an epoxy resin. CONSTITUTION:A reaction product comprising a phenolic resin, a modified silicone oil, a surfactant and silica is added to an epoxy resin molding material formed by optionally adding additives such as a crosslinking agent, a curing agent, a cure accelerator, a mold release, a colorant, a coupling agent and a filler to an epoxy resin. By the addition of said reaction product, the obtained epoxy resin molding material does not form mold-flash, can be improved in cracking resistance, and can be used chiefly as a resin molding for sealing electrical and electronic components.
JP19392587A 1987-08-03 1987-08-03 Epoxy resin molding material Pending JPS6438417A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19392587A JPS6438417A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19392587A JPS6438417A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Publications (1)

Publication Number Publication Date
JPS6438417A true JPS6438417A (en) 1989-02-08

Family

ID=16316022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19392587A Pending JPS6438417A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Country Status (1)

Country Link
JP (1) JPS6438417A (en)

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