JPS56152861A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS56152861A
JPS56152861A JP5675280A JP5675280A JPS56152861A JP S56152861 A JPS56152861 A JP S56152861A JP 5675280 A JP5675280 A JP 5675280A JP 5675280 A JP5675280 A JP 5675280A JP S56152861 A JPS56152861 A JP S56152861A
Authority
JP
Japan
Prior art keywords
silica
powder
inorg
epoxy resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5675280A
Other languages
Japanese (ja)
Inventor
Kiyohiro Kondo
Kazuhiko Urano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP5675280A priority Critical patent/JPS56152861A/en
Publication of JPS56152861A publication Critical patent/JPS56152861A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To obtain a resin composition suitable for sealing a semiconductor, which wears little a metal mold during molding and has excellent mechanical strength and electrical characteristics, by the addition of a silica-based inorg.powder together with a non-silica-based inorg. powder as a filler to an epoxy resin and a cure accelerator, followed by mixing.
CONSTITUTION: An epoxy resin composition comprising (A) 100pts.wt. epoxy resin, (B) 100W600pts.wt. inorg. filler consisting of (a) 10W40wt% nonsilica-based inorg. powder (e.g., talc,haolin or gypsum) of Mohs' hardness ≤2 and (b) 90W 60wt% cilica-based inorg. powder (e.g., fused silica or crystalline silica) contg. 80W100wt% of particles of size ≤44μm and 20W0wt% of particles 44W150μm in size and (C) a catalytic amt. of cure accelerator (e.g., bisphenol A or resorcinol). It is possible to accomplish molding with reduced wear of a metal mold and without disadvantage such as deterioration in strength of a cured product or high cost, by mixing the silica-based inorg. powder together with the non silica-based inorg. powder as a filler.
COPYRIGHT: (C)1981,JPO&Japio
JP5675280A 1980-04-28 1980-04-28 Epoxy resin composition Pending JPS56152861A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5675280A JPS56152861A (en) 1980-04-28 1980-04-28 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5675280A JPS56152861A (en) 1980-04-28 1980-04-28 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS56152861A true JPS56152861A (en) 1981-11-26

Family

ID=13036247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5675280A Pending JPS56152861A (en) 1980-04-28 1980-04-28 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS56152861A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726120A (en) * 1993-09-22 1995-01-27 Nitto Denko Corp Semiconductor-sealed device
JPH08239557A (en) * 1996-02-15 1996-09-17 Nitto Denko Corp Device for sealing semiconductor
JPH08239556A (en) * 1996-02-15 1996-09-17 Nitto Denko Corp Device for sealing semiconductor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726120A (en) * 1993-09-22 1995-01-27 Nitto Denko Corp Semiconductor-sealed device
JPH08239557A (en) * 1996-02-15 1996-09-17 Nitto Denko Corp Device for sealing semiconductor
JPH08239556A (en) * 1996-02-15 1996-09-17 Nitto Denko Corp Device for sealing semiconductor

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