JPS56152861A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS56152861A JPS56152861A JP5675280A JP5675280A JPS56152861A JP S56152861 A JPS56152861 A JP S56152861A JP 5675280 A JP5675280 A JP 5675280A JP 5675280 A JP5675280 A JP 5675280A JP S56152861 A JPS56152861 A JP S56152861A
- Authority
- JP
- Japan
- Prior art keywords
- silica
- powder
- inorg
- epoxy resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To obtain a resin composition suitable for sealing a semiconductor, which wears little a metal mold during molding and has excellent mechanical strength and electrical characteristics, by the addition of a silica-based inorg.powder together with a non-silica-based inorg. powder as a filler to an epoxy resin and a cure accelerator, followed by mixing.
CONSTITUTION: An epoxy resin composition comprising (A) 100pts.wt. epoxy resin, (B) 100W600pts.wt. inorg. filler consisting of (a) 10W40wt% nonsilica-based inorg. powder (e.g., talc,haolin or gypsum) of Mohs' hardness ≤2 and (b) 90W 60wt% cilica-based inorg. powder (e.g., fused silica or crystalline silica) contg. 80W100wt% of particles of size ≤44μm and 20W0wt% of particles 44W150μm in size and (C) a catalytic amt. of cure accelerator (e.g., bisphenol A or resorcinol). It is possible to accomplish molding with reduced wear of a metal mold and without disadvantage such as deterioration in strength of a cured product or high cost, by mixing the silica-based inorg. powder together with the non silica-based inorg. powder as a filler.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5675280A JPS56152861A (en) | 1980-04-28 | 1980-04-28 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5675280A JPS56152861A (en) | 1980-04-28 | 1980-04-28 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56152861A true JPS56152861A (en) | 1981-11-26 |
Family
ID=13036247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5675280A Pending JPS56152861A (en) | 1980-04-28 | 1980-04-28 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56152861A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0726120A (en) * | 1993-09-22 | 1995-01-27 | Nitto Denko Corp | Semiconductor-sealed device |
JPH08239557A (en) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | Device for sealing semiconductor |
JPH08239556A (en) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | Device for sealing semiconductor |
-
1980
- 1980-04-28 JP JP5675280A patent/JPS56152861A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0726120A (en) * | 1993-09-22 | 1995-01-27 | Nitto Denko Corp | Semiconductor-sealed device |
JPH08239557A (en) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | Device for sealing semiconductor |
JPH08239556A (en) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | Device for sealing semiconductor |
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