JPS5463300A - Manufacrure of electric device - Google Patents

Abstract

PURPOSE: To raise the heat shock strength by treating element with a thermal setting resin compound to which is added a fixed amount of a filler powder having a fixed grain size of a fixed expansion coefficient so that the difference in expansion coefficient between the resin compound and the element becomes less than a fixed value.

CONSTITUTION: Element is treated with a thermal setting resin compound to which is added 40 to 95 volumetric % an inorganic filler and 1 to 30 volumetric % lead oxide powder, a linear expansion coefficient of less than 0.8×10^-5/°C and a grain size composed of a 1:1.5 ratio of more than 100 micron particles:less than 60 micron particles, so that the difference inlinear expansion coefficient between the element² and the cured resin 5 becomes less than 1.5×10^-5/°C. For example, epoxy resin is mixed with 35% zircon of a 200 to 400 micron grain size, 15% zircon of a less than 50 micron grain size, and minimum, and then the resin compound is used in casting the silicon transistor 2 to form the cast molding 5 cured. Thus, it is possible to enhance the heat shock strength by making the difference in thermal expansion coefficient smaller, as well as improve workability by making the fluidity of resin better.

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