JPS6438418A - Epoxy resin molding material - Google Patents

Epoxy resin molding material

Info

Publication number
JPS6438418A
JPS6438418A JP19392987A JP19392987A JPS6438418A JP S6438418 A JPS6438418 A JP S6438418A JP 19392987 A JP19392987 A JP 19392987A JP 19392987 A JP19392987 A JP 19392987A JP S6438418 A JPS6438418 A JP S6438418A
Authority
JP
Japan
Prior art keywords
epoxy resin
molding material
resin molding
silicone rubber
coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19392987A
Other languages
Japanese (ja)
Inventor
Yasuhiro Kyotani
Hirohiko Kagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP19392987A priority Critical patent/JPS6438418A/en
Publication of JPS6438418A publication Critical patent/JPS6438418A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain an epoxy resin molding material improved in cracking resistance without increasing its coefficient of linear expansion, by adding a two-pack curable silicone rubber to an epoxy resin. CONSTITUTION:A two-pack curable silicone rubber (e.g., a condensed silicone rubber prepared by adding a trifunctional silane and a platinum compound to a diorganosiloxane having terminal functional groups) is added to an epoxy resin molding material prepared by adding additives such as a crosslinking agent, a cure accelerator, a mold release, a colorant, a coupling agent and a filler to an epoxy resin. This molding material is improved in cracking resistance without increasing its coefficient of linear expansion, and is used chiefly for a resin molding for sealing electrical and electronic components.
JP19392987A 1987-08-03 1987-08-03 Epoxy resin molding material Pending JPS6438418A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19392987A JPS6438418A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19392987A JPS6438418A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Publications (1)

Publication Number Publication Date
JPS6438418A true JPS6438418A (en) 1989-02-08

Family

ID=16316091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19392987A Pending JPS6438418A (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Country Status (1)

Country Link
JP (1) JPS6438418A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872194A (en) * 1996-07-08 1999-02-16 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872194A (en) * 1996-07-08 1999-02-16 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part

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