JPS6438418A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPS6438418A JPS6438418A JP19392987A JP19392987A JPS6438418A JP S6438418 A JPS6438418 A JP S6438418A JP 19392987 A JP19392987 A JP 19392987A JP 19392987 A JP19392987 A JP 19392987A JP S6438418 A JPS6438418 A JP S6438418A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- resin molding
- silicone rubber
- coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To obtain an epoxy resin molding material improved in cracking resistance without increasing its coefficient of linear expansion, by adding a two-pack curable silicone rubber to an epoxy resin. CONSTITUTION:A two-pack curable silicone rubber (e.g., a condensed silicone rubber prepared by adding a trifunctional silane and a platinum compound to a diorganosiloxane having terminal functional groups) is added to an epoxy resin molding material prepared by adding additives such as a crosslinking agent, a cure accelerator, a mold release, a colorant, a coupling agent and a filler to an epoxy resin. This molding material is improved in cracking resistance without increasing its coefficient of linear expansion, and is used chiefly for a resin molding for sealing electrical and electronic components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19392987A JPS6438418A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19392987A JPS6438418A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6438418A true JPS6438418A (en) | 1989-02-08 |
Family
ID=16316091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19392987A Pending JPS6438418A (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6438418A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5872194A (en) * | 1996-07-08 | 1999-02-16 | Dow Corning Toray Silicone Co., Ltd. | Curable liquid-form composition, cured product of the same, and electronic part |
-
1987
- 1987-08-03 JP JP19392987A patent/JPS6438418A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5872194A (en) * | 1996-07-08 | 1999-02-16 | Dow Corning Toray Silicone Co., Ltd. | Curable liquid-form composition, cured product of the same, and electronic part |
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