JPS5744620A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5744620A JPS5744620A JP12040380A JP12040380A JPS5744620A JP S5744620 A JPS5744620 A JP S5744620A JP 12040380 A JP12040380 A JP 12040380A JP 12040380 A JP12040380 A JP 12040380A JP S5744620 A JPS5744620 A JP S5744620A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- pref
- silica fine
- resin
- cure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To prepare the titled composition composed of an epoxy resin, a curing agent and a cure accelerator in powder form, etc., having excellent storage stability, capable of keeping high insulation resistance under humid conditions, and curable rapidly by heating, by adsorbing the cure acceleraor to silica fine powder prior to compounding.
CONSTITUTION: A powdery epoxy resin composition is prepared by kneading and forming (A) an epoxy resin having two or more epoxy groups in a molecule (e.g. phenolic novolak-type epoxy resin pref. solid at normal temperaure), (B) a curing agen consisting of a phenolic resin [a resin obtained by the reaction of phenol and (para)formaldehyde, and pref. having a molecular weight of about 550W850], and (C) a cure accelerator adsorbed to silica fine powder (having ≥0.3ml/g pore volume and composed of primry particles of ≤20mμ in diameter and bonded together three-dimensionally through siloxane linkage).
USE: Suitable for transfer molding.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12040380A JPS5744620A (en) | 1980-08-29 | 1980-08-29 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12040380A JPS5744620A (en) | 1980-08-29 | 1980-08-29 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5744620A true JPS5744620A (en) | 1982-03-13 |
Family
ID=14785343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12040380A Pending JPS5744620A (en) | 1980-08-29 | 1980-08-29 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5744620A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012052089A (en) * | 2010-08-05 | 2012-03-15 | Sumitomo Bakelite Co Ltd | Functional particle, filler, resin composition for electronic part, electronic part, and semiconductor device |
-
1980
- 1980-08-29 JP JP12040380A patent/JPS5744620A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012052089A (en) * | 2010-08-05 | 2012-03-15 | Sumitomo Bakelite Co Ltd | Functional particle, filler, resin composition for electronic part, electronic part, and semiconductor device |
JP2012052088A (en) * | 2010-08-05 | 2012-03-15 | Sumitomo Bakelite Co Ltd | Composition and method for producing the same, filler, resin composition for electronic part, electronic part, and semiconductor device |
JP2012052087A (en) * | 2010-08-05 | 2012-03-15 | Sumitomo Bakelite Co Ltd | Functional particle group, filler, resin composition for electronic part, electronic part, and semiconductor device |
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