JPS5744620A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5744620A
JPS5744620A JP12040380A JP12040380A JPS5744620A JP S5744620 A JPS5744620 A JP S5744620A JP 12040380 A JP12040380 A JP 12040380A JP 12040380 A JP12040380 A JP 12040380A JP S5744620 A JPS5744620 A JP S5744620A
Authority
JP
Japan
Prior art keywords
epoxy resin
pref
silica fine
resin
cure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12040380A
Other languages
Japanese (ja)
Inventor
Kazuo Iko
Mikio Aizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP12040380A priority Critical patent/JPS5744620A/en
Publication of JPS5744620A publication Critical patent/JPS5744620A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prepare the titled composition composed of an epoxy resin, a curing agent and a cure accelerator in powder form, etc., having excellent storage stability, capable of keeping high insulation resistance under humid conditions, and curable rapidly by heating, by adsorbing the cure acceleraor to silica fine powder prior to compounding.
CONSTITUTION: A powdery epoxy resin composition is prepared by kneading and forming (A) an epoxy resin having two or more epoxy groups in a molecule (e.g. phenolic novolak-type epoxy resin pref. solid at normal temperaure), (B) a curing agen consisting of a phenolic resin [a resin obtained by the reaction of phenol and (para)formaldehyde, and pref. having a molecular weight of about 550W850], and (C) a cure accelerator adsorbed to silica fine powder (having ≥0.3ml/g pore volume and composed of primry particles of ≤20mμ in diameter and bonded together three-dimensionally through siloxane linkage).
USE: Suitable for transfer molding.
COPYRIGHT: (C)1982,JPO&Japio
JP12040380A 1980-08-29 1980-08-29 Epoxy resin composition Pending JPS5744620A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12040380A JPS5744620A (en) 1980-08-29 1980-08-29 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12040380A JPS5744620A (en) 1980-08-29 1980-08-29 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5744620A true JPS5744620A (en) 1982-03-13

Family

ID=14785343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12040380A Pending JPS5744620A (en) 1980-08-29 1980-08-29 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5744620A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012052089A (en) * 2010-08-05 2012-03-15 Sumitomo Bakelite Co Ltd Functional particle, filler, resin composition for electronic part, electronic part, and semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012052089A (en) * 2010-08-05 2012-03-15 Sumitomo Bakelite Co Ltd Functional particle, filler, resin composition for electronic part, electronic part, and semiconductor device
JP2012052088A (en) * 2010-08-05 2012-03-15 Sumitomo Bakelite Co Ltd Composition and method for producing the same, filler, resin composition for electronic part, electronic part, and semiconductor device
JP2012052087A (en) * 2010-08-05 2012-03-15 Sumitomo Bakelite Co Ltd Functional particle group, filler, resin composition for electronic part, electronic part, and semiconductor device

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