JPS57119921A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS57119921A JPS57119921A JP515181A JP515181A JPS57119921A JP S57119921 A JPS57119921 A JP S57119921A JP 515181 A JP515181 A JP 515181A JP 515181 A JP515181 A JP 515181A JP S57119921 A JPS57119921 A JP S57119921A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- copolymer
- alkenylphenol
- curable resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To obtain a curable resin composition which is excellent in curability and moldability and gives cured product prominent in heat resistance, adhesion and dimensional stability, by compounding a copolymer composed of a basic monomer and alkenylphenol as essential components to an epoxy resin.
CONSTITUTION: A copolymer is obtd. by the copolymn. of 0.01W20wt% basic polymerizable monomer (e.g. N,N-dimethylamino-ethyl acrylate), 5W90wt% alkenylphenol and, if necessary, other polymerizable monomer (e.g. styrene). The resulting copolymer is compounded with an epoxy resin (e.g. bisphenol A type epoxy resin) in such a way that phenolic OH group/epoxy group ratio is between 0.2 and 5, to give the titled composition.
USE: Molding material, laminating material (copper laminate using glass cloth as base), coating (varnish, powder), adhesive.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP515181A JPS57119921A (en) | 1981-01-19 | 1981-01-19 | Curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP515181A JPS57119921A (en) | 1981-01-19 | 1981-01-19 | Curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57119921A true JPS57119921A (en) | 1982-07-26 |
JPS6337813B2 JPS6337813B2 (en) | 1988-07-27 |
Family
ID=11603267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP515181A Granted JPS57119921A (en) | 1981-01-19 | 1981-01-19 | Curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57119921A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61252223A (en) * | 1985-04-11 | 1986-11-10 | ピ−ピ−ジ−・インダストリ−ズ・インコ−ポレイテツド | Curable composition |
US5179172A (en) * | 1988-10-06 | 1993-01-12 | Henkel Research Corporation | Epichlorohydrin or chlorine-containing vinyl or acrylate (co)polymer-modified amines |
US7226976B2 (en) | 2001-05-16 | 2007-06-05 | Ajinomoto Co., Inc. | Latent curing agent for epoxy resin, and curable epoxy resin composition |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53114900A (en) * | 1977-03-15 | 1978-10-06 | Cosmo Co Ltd | Polyalkenyl phenolic resin composition |
-
1981
- 1981-01-19 JP JP515181A patent/JPS57119921A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53114900A (en) * | 1977-03-15 | 1978-10-06 | Cosmo Co Ltd | Polyalkenyl phenolic resin composition |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61252223A (en) * | 1985-04-11 | 1986-11-10 | ピ−ピ−ジ−・インダストリ−ズ・インコ−ポレイテツド | Curable composition |
US5179172A (en) * | 1988-10-06 | 1993-01-12 | Henkel Research Corporation | Epichlorohydrin or chlorine-containing vinyl or acrylate (co)polymer-modified amines |
US7226976B2 (en) | 2001-05-16 | 2007-06-05 | Ajinomoto Co., Inc. | Latent curing agent for epoxy resin, and curable epoxy resin composition |
Also Published As
Publication number | Publication date |
---|---|
JPS6337813B2 (en) | 1988-07-27 |
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