JPS6331557U - - Google Patents
Info
- Publication number
- JPS6331557U JPS6331557U JP1986124763U JP12476386U JPS6331557U JP S6331557 U JPS6331557 U JP S6331557U JP 1986124763 U JP1986124763 U JP 1986124763U JP 12476386 U JP12476386 U JP 12476386U JP S6331557 U JPS6331557 U JP S6331557U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting device
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
第1図は本考案の第1の実施例を示す断面図、
第2図は第1の実施例の製造方法を示す構成図、
第3図は本考案の第2の実施例の製造方法を示す
構成図、第4図は第3図の方法で用いる治具33
を示す上面図である。
1……発光素子パツケージ、2……発光素子で
あるLEDチツプ、4……モールド樹脂部、5…
…透光性遮水性コーテイングであるコート層。
FIG. 1 is a sectional view showing a first embodiment of the present invention;
FIG. 2 is a configuration diagram showing the manufacturing method of the first embodiment;
FIG. 3 is a block diagram showing the manufacturing method of the second embodiment of the present invention, and FIG. 4 is a jig 33 used in the method of FIG. 3.
FIG. DESCRIPTION OF SYMBOLS 1...Light emitting element package, 2...LED chip which is a light emitting element, 4...Mold resin part, 5...
...A coating layer that is a translucent and water-blocking coating.
補正 昭61.9.25
実用新案登録請求の範囲を次のように補正する
。Amendment September 25, 1986 The scope of claims for utility model registration is amended as follows.
【実用新案登録請求の範囲】
(1) 発光素子を内部に収容するモールド樹脂部
の表面に透光性遮水性コーテイングを全面あるい
は部分的に施したことを特徴とする発光素子パツ
ケージ。
(2) 実用新案登録請求の範囲第1項において、
前記透光性遮水性コーテイングはダイヤモンド構
造を含むカーボン薄膜であることを特徴とする発
光素子パツケージ。
(3) 実用新案登録請求の範囲第1項または第2
項において、前記発光素子は発光ダイオードであ
ることを特徴とする発光素子パツケージ。
(4) 実用新案登録請求の範囲第3項において、
前記発光ダイオードはGaAlAs発光ダイオー
ドであることを特徴とする発光素子パツケージ。
図面の簡単な説明を次のように補正する。
明細書第10頁第9行の「第1の」を「一」に
改める。
明細書第10頁第10行の「第1の実施例の」
を「前記実施例の第1の」に改める。
明細書第10頁第11行の「本考案の第2の実
施例の」を「前記実施例の第2の」に改める。[Claims for Utility Model Registration] (1) A light-emitting device package characterized in that a light-transmitting, water-blocking coating is applied entirely or partially to the surface of a molded resin portion that accommodates a light-emitting device inside. (2) In paragraph 1 of the claims for utility model registration,
A light emitting device package, wherein the light-transmitting water-blocking coating is a carbon thin film containing a diamond structure. (3) Scope of claims for utility model registration, paragraph 1 or 2
2. The light emitting device package according to item 1, wherein the light emitting device is a light emitting diode. (4) In paragraph 3 of claims for utility model registration,
A light emitting device package, wherein the light emitting diode is a GaAlAs light emitting diode. The brief description of the drawing has been amended as follows. "First" on page 10, line 9 of the specification will be changed to "one". “For the first embodiment” on page 10, line 10 of the specification
be changed to "the first of the above embodiments". On page 10, line 11 of the specification, "the second embodiment of the present invention" is changed to "the second embodiment of the invention".
Claims (1)
の表面に透光性遮水性コーテイングを全面あるい
は部分的に施したことを特徴とする発光素子パツ
ケージ。 (2) 実用新案登録請求の範囲第1項において、
前記透光性遮水性コーテイングはダイヤモンド構
造を含むカーボン薄膜であることを特徴とする発
光素子パツケージ。 (3) 実用新案登録請求の範囲第1項または第2
項において、前記発光素子は発光ダイオードであ
ることを特徴とする発光素子パツケージ。 (4) 実用新案登録請求の範囲第3項において、
前記発光ダイオードはGA,AL,AS,発光ダ
イオードであることを特徴とする発光素子パツケ
ージ。[Claims for Utility Model Registration] (1) A light-emitting device package characterized in that a light-transmitting, water-blocking coating is applied entirely or partially to the surface of a molded resin portion that accommodates a light-emitting device inside. (2) In paragraph 1 of the claims for utility model registration,
A light emitting device package, wherein the light-transmitting water-blocking coating is a carbon thin film containing a diamond structure. (3) Scope of claims for utility model registration, paragraph 1 or 2
2. The light emitting device package according to item 1, wherein the light emitting device is a light emitting diode. (4) In paragraph 3 of claims for utility model registration,
A light emitting element package, wherein the light emitting diode is a GA, AL, AS, or light emitting diode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986124763U JPS6331557U (en) | 1986-08-14 | 1986-08-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986124763U JPS6331557U (en) | 1986-08-14 | 1986-08-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6331557U true JPS6331557U (en) | 1988-03-01 |
Family
ID=31017079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986124763U Pending JPS6331557U (en) | 1986-08-14 | 1986-08-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6331557U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004082036A1 (en) * | 2003-03-10 | 2004-09-23 | Toyoda Gosei Co., Ltd. | Solid element device and method for manufacture thereof |
JPWO2004082036A1 (en) * | 2003-03-10 | 2006-06-15 | 豊田合成株式会社 | Solid element device and manufacturing method thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6196780A (en) * | 1984-10-17 | 1986-05-15 | Stanley Electric Co Ltd | Coating method of lead chip |
-
1986
- 1986-08-14 JP JP1986124763U patent/JPS6331557U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6196780A (en) * | 1984-10-17 | 1986-05-15 | Stanley Electric Co Ltd | Coating method of lead chip |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004082036A1 (en) * | 2003-03-10 | 2004-09-23 | Toyoda Gosei Co., Ltd. | Solid element device and method for manufacture thereof |
JPWO2004082036A1 (en) * | 2003-03-10 | 2006-06-15 | 豊田合成株式会社 | Solid element device and manufacturing method thereof |
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