JPS6331557U - - Google Patents

Info

Publication number
JPS6331557U
JPS6331557U JP1986124763U JP12476386U JPS6331557U JP S6331557 U JPS6331557 U JP S6331557U JP 1986124763 U JP1986124763 U JP 1986124763U JP 12476386 U JP12476386 U JP 12476386U JP S6331557 U JPS6331557 U JP S6331557U
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting device
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986124763U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986124763U priority Critical patent/JPS6331557U/ja
Publication of JPS6331557U publication Critical patent/JPS6331557U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第1の実施例を示す断面図、
第2図は第1の実施例の製造方法を示す構成図、
第3図は本考案の第2の実施例の製造方法を示す
構成図、第4図は第3図の方法で用いる治具33
を示す上面図である。 1……発光素子パツケージ、2……発光素子で
あるLEDチツプ、4……モールド樹脂部、5…
…透光性遮水性コーテイングであるコート層。
FIG. 1 is a sectional view showing a first embodiment of the present invention;
FIG. 2 is a configuration diagram showing the manufacturing method of the first embodiment;
FIG. 3 is a block diagram showing the manufacturing method of the second embodiment of the present invention, and FIG. 4 is a jig 33 used in the method of FIG. 3.
FIG. DESCRIPTION OF SYMBOLS 1...Light emitting element package, 2...LED chip which is a light emitting element, 4...Mold resin part, 5...
...A coating layer that is a translucent and water-blocking coating.

補正 昭61.9.25 実用新案登録請求の範囲を次のように補正する
Amendment September 25, 1986 The scope of claims for utility model registration is amended as follows.

【実用新案登録請求の範囲】 (1) 発光素子を内部に収容するモールド樹脂部
の表面に透光性遮水性コーテイングを全面あるい
は部分的に施したことを特徴とする発光素子パツ
ケージ。 (2) 実用新案登録請求の範囲第1項において、
前記透光性遮水性コーテイングはダイヤモンド構
造を含むカーボン薄膜であることを特徴とする発
光素子パツケージ。 (3) 実用新案登録請求の範囲第1項または第2
項において、前記発光素子は発光ダイオードであ
ることを特徴とする発光素子パツケージ。 (4) 実用新案登録請求の範囲第3項において、
前記発光ダイオードはG発光ダイオー
ドであることを特徴とする発光素子パツケージ。 図面の簡単な説明を次のように補正する。 明細書第10頁第9行の「第1の」を「一」に
改める。 明細書第10頁第10行の「第1の実施例の」
を「前記実施例の第1の」に改める。 明細書第10頁第11行の「本考案の第2の実
施例の」を「前記実施例の第2の」に改める。
[Claims for Utility Model Registration] (1) A light-emitting device package characterized in that a light-transmitting, water-blocking coating is applied entirely or partially to the surface of a molded resin portion that accommodates a light-emitting device inside. (2) In paragraph 1 of the claims for utility model registration,
A light emitting device package, wherein the light-transmitting water-blocking coating is a carbon thin film containing a diamond structure. (3) Scope of claims for utility model registration, paragraph 1 or 2
2. The light emitting device package according to item 1, wherein the light emitting device is a light emitting diode. (4) In paragraph 3 of claims for utility model registration,
A light emitting device package, wherein the light emitting diode is a GaAlAs light emitting diode. The brief description of the drawing has been amended as follows. "First" on page 10, line 9 of the specification will be changed to "one". “For the first embodiment” on page 10, line 10 of the specification
be changed to "the first of the above embodiments". On page 10, line 11 of the specification, "the second embodiment of the present invention" is changed to "the second embodiment of the invention".

Claims (1)

【実用新案登録請求の範囲】 (1) 発光素子を内部に収容するモールド樹脂部
の表面に透光性遮水性コーテイングを全面あるい
は部分的に施したことを特徴とする発光素子パツ
ケージ。 (2) 実用新案登録請求の範囲第1項において、
前記透光性遮水性コーテイングはダイヤモンド構
造を含むカーボン薄膜であることを特徴とする発
光素子パツケージ。 (3) 実用新案登録請求の範囲第1項または第2
項において、前記発光素子は発光ダイオードであ
ることを特徴とする発光素子パツケージ。 (4) 実用新案登録請求の範囲第3項において、
前記発光ダイオードはGA,AL,AS,発光ダ
イオードであることを特徴とする発光素子パツケ
ージ。
[Claims for Utility Model Registration] (1) A light-emitting device package characterized in that a light-transmitting, water-blocking coating is applied entirely or partially to the surface of a molded resin portion that accommodates a light-emitting device inside. (2) In paragraph 1 of the claims for utility model registration,
A light emitting device package, wherein the light-transmitting water-blocking coating is a carbon thin film containing a diamond structure. (3) Scope of claims for utility model registration, paragraph 1 or 2
2. The light emitting device package according to item 1, wherein the light emitting device is a light emitting diode. (4) In paragraph 3 of claims for utility model registration,
A light emitting element package, wherein the light emitting diode is a GA, AL, AS, or light emitting diode.
JP1986124763U 1986-08-14 1986-08-14 Pending JPS6331557U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986124763U JPS6331557U (en) 1986-08-14 1986-08-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986124763U JPS6331557U (en) 1986-08-14 1986-08-14

Publications (1)

Publication Number Publication Date
JPS6331557U true JPS6331557U (en) 1988-03-01

Family

ID=31017079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986124763U Pending JPS6331557U (en) 1986-08-14 1986-08-14

Country Status (1)

Country Link
JP (1) JPS6331557U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (en) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. Solid element device and method for manufacture thereof
JPWO2004082036A1 (en) * 2003-03-10 2006-06-15 豊田合成株式会社 Solid element device and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196780A (en) * 1984-10-17 1986-05-15 Stanley Electric Co Ltd Coating method of lead chip

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196780A (en) * 1984-10-17 1986-05-15 Stanley Electric Co Ltd Coating method of lead chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (en) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. Solid element device and method for manufacture thereof
JPWO2004082036A1 (en) * 2003-03-10 2006-06-15 豊田合成株式会社 Solid element device and manufacturing method thereof

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