JPS6361164U - - Google Patents

Info

Publication number
JPS6361164U
JPS6361164U JP1986155486U JP15548686U JPS6361164U JP S6361164 U JPS6361164 U JP S6361164U JP 1986155486 U JP1986155486 U JP 1986155486U JP 15548686 U JP15548686 U JP 15548686U JP S6361164 U JPS6361164 U JP S6361164U
Authority
JP
Japan
Prior art keywords
emitting diode
diode lamp
light
heat dissipation
dissipation member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986155486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986155486U priority Critical patent/JPS6361164U/ja
Publication of JPS6361164U publication Critical patent/JPS6361164U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の発光ダイオードランプの一実
施例の断面図、第２図は第１図に示したＬＥＤラ
ンプの放熱部材の形成方法の一例を示す側面図、
第３図は第１図に示したＬＥＤランプを自動車の
ハイマウント・ストツプランプに使用すべく基板
に取付けた時の一部破断平面図、第４図は第３図
に示した基板を自動車のハイマウント・ストツプ
ランプのケーシングに組み込んだ時の斜視図、第
５図は通常のＬＥＤランプの断面図、第６図は通
常のＬＥＤランプの製法の一例を示す側面図であ
る。 Ｌ：発光ダイオードランプ、１：発光ダイオー
ドチツプ、２，３：リード線、４：ワイヤ、５：
樹脂モールド、７：放熱部材。 FIG. 1 is a sectional view of an embodiment of the light emitting diode lamp of the present invention, and FIG. 2 is a side view showing an example of a method for forming the heat dissipation member of the LED lamp shown in FIG. 1.
Figure 3 is a partially cutaway plan view of the LED lamp shown in Figure 1 installed on a board for use in a high-mount stop light for an automobile, and Figure 4 is a partially cutaway plan view of the LED lamp shown in Figure 3 installed on a board for use in a high-mount stop light for an automobile. FIG. 5 is a sectional view of an ordinary LED lamp, and FIG. 6 is a side view showing an example of a manufacturing method of an ordinary LED lamp. L: Light emitting diode lamp, 1: Light emitting diode chip, 2, 3: Lead wire, 4: Wire, 5:
Resin mold, 7: Heat dissipation member.

Claims (1)

【実用新案登録請求の範囲】 (1) 発光ダイオードランプのリード線に放熱部
材を取付けてなることを特徴とする発光ダイオー
ドランプ。 (2) 前記放熱部材が発光ダイオードランプ製造
時に使用したタイバーから形成したものであるこ
とを特徴とする実用新案登録請求の範囲第(1)項
記載の発光ダイオードランプ。[Claims for Utility Model Registration] (1) A light-emitting diode lamp characterized in that a heat dissipation member is attached to the lead wire of the light-emitting diode lamp. (2) The light emitting diode lamp according to claim 1, wherein the heat dissipation member is formed from a tie bar used in manufacturing the light emitting diode lamp.
JP1986155486U 1986-10-09 1986-10-09 Pending JPS6361164U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986155486U JPS6361164U (en) 1986-10-09 1986-10-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986155486U JPS6361164U (en) 1986-10-09 1986-10-09

Publications (1)

Publication Number Publication Date
JPS6361164U true JPS6361164U (en) 1988-04-22

Family

ID=31076237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986155486U Pending JPS6361164U (en) 1986-10-09 1986-10-09

Country Status (1)

Country Link
JP (1) JPS6361164U (en)

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