JPH02101559U - - Google Patents
Info
- Publication number
- JPH02101559U JPH02101559U JP886789U JP886789U JPH02101559U JP H02101559 U JPH02101559 U JP H02101559U JP 886789 U JP886789 U JP 886789U JP 886789 U JP886789 U JP 886789U JP H02101559 U JPH02101559 U JP H02101559U
- Authority
- JP
- Japan
- Prior art keywords
- mini
- led lamp
- resin
- molded
- chip led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図Ａ，Ｂ，Ｃは本考案の一実施例を示す正
面図、右側面図、平面断面図、第２図Ａ，Ｂは従
来例を示す正面断面図、側面図、第３図Ａ，Ｂは
従来の他の素子例を示す正面図、側面図、第４図
及び第５図は第２図と第３図素子のそれぞれの基
板への実施例を示す正面図である。
１……樹脂モールド部、２ａ，２ｂ……リード
フレーム、３……ＬＥＤチツプ、４……ワイヤ。
Figures 1A, B, and C are a front view, right side view, and plan sectional view showing an embodiment of the present invention; Figures 2A and B are a front sectional view, side view, and a side view showing a conventional example; Figure 3A; , B are a front view and a side view showing other examples of conventional elements, and FIGS. 4 and 5 are front views showing examples of the elements shown in FIGS. 2 and 3 being applied to respective substrates. 1... Resin mold part, 2a, 2b... Lead frame, 3... LED chip, 4... Wire.
Claims (1)
した対向配置のリードフレームを備え、前記先端
部周辺を透光性樹脂により樹脂モールドしたミニ
モールドチツプＬＥＤランプにおいて、前記樹脂
モールド部から左右に出されるリードフレームを
、直線状態のまま前記樹脂モールド部根本より樹
脂モールド部下方へ折り曲げてなることを特徴と
するミニモールドチツプＬＥＤランプ。 In a mini-molded chip LED lamp, the mini-molded chip LED lamp includes lead frames disposed facing each other with an LED chip mounted on at least one tip, and the periphery of the tip is resin-molded with a translucent resin. A mini-mold chip LED lamp, characterized in that the mini-mold chip LED lamp is formed by bending the resin mold part downward from the base of the resin mold part in a straight state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP886789U JPH02101559U (en) | 1989-01-26 | 1989-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP886789U JPH02101559U (en) | 1989-01-26 | 1989-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101559U true JPH02101559U (en) | 1990-08-13 |
Family
ID=31215107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP886789U Pending JPH02101559U (en) | 1989-01-26 | 1989-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101559U (en) |
-
1989
- 1989-01-26 JP JP886789U patent/JPH02101559U/ja active Pending