JPH0292953U - - Google Patents
Info
- Publication number
- JPH0292953U JPH0292953U JP1989001016U JP101689U JPH0292953U JP H0292953 U JPH0292953 U JP H0292953U JP 1989001016 U JP1989001016 U JP 1989001016U JP 101689 U JP101689 U JP 101689U JP H0292953 U JPH0292953 U JP H0292953U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- plating layer
- metal plating
- display element
- reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第１図は本考案実施例の部分断面構造を示す図
、第２図は本考案実施例の正面構造を示す図、第
３図は本考案実施例の側面構造を示す図、第４図
は本考案実施例の断面構造を示す図、第５図は本
考案実施例の上面構造を示す図、第６図は従来例
の斜視構造を示す図、第７図と第８図は従来例の
製造方法を説明する図である。
１，２，３……リードフレーム、４……反射器
、５……透明樹脂、６……ＬＥＤチツプ、７……
金線、８……金属メツキ層。
Fig. 1 is a diagram showing a partial cross-sectional structure of an embodiment of the invention, Fig. 2 is a diagram showing a front structure of an embodiment of the invention, Fig. 3 is a diagram showing a side structure of an embodiment of the invention, and Fig. 4 is a diagram showing a side structure of an embodiment of the invention. FIG. 5 is a diagram showing the top structure of the embodiment of the present invention, FIG. 6 is a diagram showing the perspective structure of the conventional example, and FIGS. 7 and 8 are the diagrams of the conventional example. It is a figure explaining a manufacturing method. 1, 2, 3...Lead frame, 4...Reflector, 5...Transparent resin, 6...LED chip, 7...
Gold wire, 8...Metal plating layer.
Claims (1)
部にＬＥＤチツプが搭載され、上記反射器とＬＥ
Ｄチツプとが透明樹脂によりモールドされた構造
のＬＥＤ表示素子において、上記リードフレーム
が樹脂であり、その表面に下地となる金属メツキ
層と良導電性である金属メツキ層とを有する構造
であるＬＥＤ表示素子。 An LED chip is mounted on the bottom of a reflector that is continuous to the end of the lead frame, and the LED chip is connected to the reflector above.
An LED display element having a structure in which the D-chip is molded with a transparent resin, wherein the lead frame is made of resin and has a metal plating layer serving as a base and a metal plating layer having good conductivity on its surface. display element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001016U JPH0525255Y2 (en) | 1989-01-09 | 1989-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001016U JPH0525255Y2 (en) | 1989-01-09 | 1989-01-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0292953U true JPH0292953U (en) | 1990-07-24 |
| JPH0525255Y2 JPH0525255Y2 (en) | 1993-06-25 |
Family
ID=31200535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989001016U Expired - Lifetime JPH0525255Y2 (en) | 1989-01-09 | 1989-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525255Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005020336A1 (en) * | 2003-08-25 | 2005-03-03 | Tabuchi Electric Co., Ltd. | Process for producing light emitting diode |
-
1989
- 1989-01-09 JP JP1989001016U patent/JPH0525255Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005020336A1 (en) * | 2003-08-25 | 2005-03-03 | Tabuchi Electric Co., Ltd. | Process for producing light emitting diode |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525255Y2 (en) | 1993-06-25 |