JPH0289815U - - Google Patents

Info

Publication number
JPH0289815U
JPH0289815U JP1988170601U JP17060188U JPH0289815U JP H0289815 U JPH0289815 U JP H0289815U JP 1988170601 U JP1988170601 U JP 1988170601U JP 17060188 U JP17060188 U JP 17060188U JP H0289815 U JPH0289815 U JP H0289815U
Authority
JP
Japan
Prior art keywords
electrode lead
insulating resin
resin body
electronic component
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988170601U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988170601U priority Critical patent/JPH0289815U/ja
Publication of JPH0289815U publication Critical patent/JPH0289815U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例のチツプ状電子部品
の樹脂体の表面状態を示す斜視図、第２図、第３
図、第４図は、それぞれ本考案の第２、第３、第
４の実施例によるチツプ状電子部品の樹脂体の表
面状態を示す斜視図、第５図ａ，ｂは従来例のチ
ツプ状電子部品の構造を示す側面断面図及び斜視
図である。 １，２１……絶縁性樹脂体、１ａ……梨地状の
樹脂体側面部、１ｂ，１ｃ……部分的に梨地状の
樹脂体側面部、１ｄ……梨地と鏡面の部分を縦縞
状に交互に配した樹脂体側面部、２１ａ……樹脂
体側面、２１ｅ……樹脂体底面、２……電極リー
ド、３……電子部品素子。 FIG. 1 is a perspective view showing the surface condition of a resin body of a chip-shaped electronic component according to an embodiment of the present invention, FIGS.
Fig. 4 is a perspective view showing the surface state of the resin body of the chip-shaped electronic component according to the second, third, and fourth embodiments of the present invention, respectively, and Fig. 5 a and b are the chip-shaped parts of the conventional example. FIG. 2 is a side sectional view and a perspective view showing the structure of an electronic component. 1, 21... Insulating resin body, 1a... Resin body side part with satin finish, 1b, 1c... Partially satin finish resin body side part, 1d... Satin finish and mirror surface parts alternate in vertical stripes. 21a...resin body side surface, 21e...resin body bottom surface, 2...electrode lead, 3...electronic component element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品素子に洋白、鉄、ニツケル等導電性板
状金属よりなる電極リードを接続し、かつその周
囲を絶縁性樹脂で包含し、前記絶縁性樹脂体より
導出してなる電極リードを折り曲げ、切断等成形
してなるチツプ状電子部品において、前記絶縁性
樹脂体の少なくとも１面以上の表面に面粗度の著
しく異なる部品を有することを特徴とするチツプ
状電子部品。 Connecting an electrode lead made of a conductive plate metal such as nickel silver, iron, or nickel to an electronic component element, surrounding the electrode lead with an insulating resin, and bending the electrode lead led out from the insulating resin body, A chip-shaped electronic component formed by cutting or molding, characterized in that the insulating resin body has components having significantly different surface roughness on at least one surface.
JP1988170601U 1988-12-27 1988-12-27 Pending JPH0289815U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988170601U JPH0289815U (en) 1988-12-27 1988-12-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988170601U JPH0289815U (en) 1988-12-27 1988-12-27

Publications (1)

Publication Number Publication Date
JPH0289815U true JPH0289815U (en) 1990-07-17

Family

ID=31461692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988170601U Pending JPH0289815U (en) 1988-12-27 1988-12-27

Country Status (1)

Country Link
JP (1) JPH0289815U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025852A (en) * 2000-07-07 2002-01-25 Matsushita Electric Ind Co Ltd Electronic component
JP2007059477A (en) * 2005-08-22 2007-03-08 Nichicon Corp Solid electrolytic capacitor
JP2009123897A (en) * 2007-11-14 2009-06-04 Tdk Corp Ceramic electronic part, its manufacturing method and its packaging method
JP2012227214A (en) * 2011-04-15 2012-11-15 Taiyo Yuden Co Ltd Chip shaped electronic component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592369A (en) * 1982-06-28 1984-01-07 Fujitsu Ltd Semiconductor device
JPS6134736B2 (en) * 1978-10-30 1986-08-09 Teijin Ltd

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134736B2 (en) * 1978-10-30 1986-08-09 Teijin Ltd
JPS592369A (en) * 1982-06-28 1984-01-07 Fujitsu Ltd Semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025852A (en) * 2000-07-07 2002-01-25 Matsushita Electric Ind Co Ltd Electronic component
JP2007059477A (en) * 2005-08-22 2007-03-08 Nichicon Corp Solid electrolytic capacitor
JP4637682B2 (en) * 2005-08-22 2011-02-23 ニチコン株式会社 Solid electrolytic capacitor
JP2009123897A (en) * 2007-11-14 2009-06-04 Tdk Corp Ceramic electronic part, its manufacturing method and its packaging method
JP4670856B2 (en) * 2007-11-14 2011-04-13 Ｔｄｋ株式会社 Packaging method for ceramic electronic components
JP2012227214A (en) * 2011-04-15 2012-11-15 Taiyo Yuden Co Ltd Chip shaped electronic component

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