JP2009123897A - Ceramic electronic part, its manufacturing method and its packaging method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic electronic part capable of discriminating the direction of the lamination of an internal electrode layer. <P>SOLUTION: The ceramic electronic part C1 has a chip element assembly 2 and external electrodes 3 and 4. The chip element assembly 2 has two mutually opposed end faces 2a and 2b, a first side face 2c and a second side face 2d being vertical to both end faces 2a and 2b and being mutually opposed and a third side face 2e and a fourth side face 2f being vertical to both end faces 2a and 2b and the first and second side faces 2c and 2d and being mutually opposed while the internal electrode layer is fitted on the inside of the chip element assembly 2. The external electrodes 3 and 4 are formed to the end faces 2a and 2b of the chip element assembly 2 respectively. The third side face 2e and fourth side face 2f of the chip element assembly 2 are composed of the same ceramic material as the first and second side faces 2c and 2d, and have different colors by the difference of the sintering degrees of the first and second side faces 2c and 2d. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a ceramic electronic component, a method for manufacturing a ceramic electronic component, and a method for packing a ceramic electronic component.

A ceramic electronic component comprising a chip body formed in a rectangular parallelepiped shape, a plurality of conductor layers disposed so as to face the inside of the chip body, and external electrodes respectively formed on end surfaces of the chip body. is there. The ceramic electronic components are respectively housed and packed in a plurality of recesses formed in the packing material (see Patent Document 1 below).
Japanese Patent Laid-Open No. 61-217317

  When mounting the packaged ceramic electronic component, the upper side surface of the ceramic electronic component exposed from the recess of the packing material is sucked by the suction conveyance device, and the ceramic electronic component is taken out of the packing material and mounted on the mounting board. Put. Then, the ceramic electronic component is mounted on the mounting board with the attracted side face up. In this case, the electric capacity between the conductor layer and the external conductor component, the magnetic field by the conductor layer, and the like differ depending on whether the opposing direction of the conductor layer is parallel to or perpendicular to the mounting substrate. Therefore, the electrical characteristics differ depending on the direction in which the conductor layer of the ceramic electronic component faces the mounting board, and there is a problem because the electrical characteristics vary from mounting board to mounting board.

  In addition, not only when a plurality of conductor layers are arranged opposite to each other inside the chip body, ceramic electronic components having conductors formed inside the chip body have electrical characteristics depending on the arrangement direction of the conductors. There is a problem because it varies. Therefore, in order to mount on the substrate so that the conductors are arranged in the same direction, it is required to package the conductors in the same direction.

  However, in the completed ceramic electronic component, since the conductor disposed inside the chip body is covered with the ceramic and the external electrode, its direction cannot be visually recognized. In particular, when the end surface on which the external electrode is formed is a square, since the side surfaces of the chip body have the same shape, the arrangement direction of the conductors cannot be determined by the shape.

  Accordingly, the present invention relates to a ceramic electronic component capable of determining the arrangement direction of a conductor arranged inside a chip body, a method for manufacturing the same, and a packaging method for a ceramic electronic component capable of packaging with the conductor arrangement direction aligned. The purpose is to provide.

  The ceramic electronic component of the present invention includes a first set of surfaces facing each other, a second set of side surfaces that are perpendicular to the first set of surfaces and facing each other, and a first set of surfaces and a second set of side surfaces that are perpendicular to each other. A chip body having a third set of side surfaces facing each other and having a conductor disposed therein, and an external electrode formed on each of the first set of surfaces of the chip body, It is made of ceramic, and the firing degree of at least one side surface of one set of the second set side surface and the third set side surface of the chip body is different from the firing level of the other set side surface, so The color of the side surface is different from the color of the other side surface.

  In the ceramic electronic component of the present invention, the color of at least one side surface of one set of the second set side surface and the third set side surface of the chip body is different from the color of the other set side surface. Accordingly, it is possible to determine which two of the four side surfaces are the second set side surfaces or the third set side surfaces based on the color. Therefore, if it is known which set of side surfaces are parallel or perpendicular to the conductor arrangement direction, the conductor arrangement direction can be easily determined. Further, since the firing degree of at least one side surface of one set of the second set side surface and the third set side surface of the chip body is different from the firing degree of the other set side surface, the second set and the second set Despite the fact that the three sets of sides are made of the same ceramic material, the color of at least one side of one set can be easily different from the color of the other set.

  In the ceramic electronic component of the present invention, preferably, the particle size of the ceramic particles on at least one side is different from the particle size of the ceramic particles on the other set of sides. In this case, since at least one of the first and second side surfaces has a different degree of sintering from the other set of side surfaces, the color of at least one of the first and second side surfaces is the other side surface. Different from the color. Therefore, the arrangement direction of the conductor can be easily determined based on the difference in color.

  In the ceramic electronic component of the present invention, preferably, the third set of side surfaces is a surface formed by cutting and firing a laminated body formed by laminating ceramic green layers. The particle size is greater than the ceramic particle size in the second set of sides. In this case, in the green chip formed by cutting the laminated body, the surface density of one set of cut surfaces becomes higher than the surface density of the other set by cutting. That is, the other set of side surfaces is a side surface formed of a part of the main surface of the stacked body perpendicular to the stacking direction. Therefore, when the green chip is fired, the side surface of one set has a higher surface density, and thus the firing proceeds more than the side surface of the other set, and the degree of firing is increased. Therefore, the color of the side surface of one set can be easily formed so as to be different from the color of the side surface of the other set.

  The method for producing a ceramic electronic component of the present invention includes a laminate forming step of forming a laminate in which a plurality of ceramic green layers including ceramic raw material particles are laminated and an electrode pattern is provided therein, and the laminate in the stacking direction. The first set of surfaces facing each other, the second set of side surfaces perpendicular to each other of the first set of surfaces, and the first set of surfaces and the second set of side surfaces, respectively. A third set of side surfaces that are perpendicular to each other and facing each other, and the surface density of the ceramic particles on at least one of the second set of side surfaces and the third set of side surfaces is the other set. A green chip forming step of forming a green chip having a surface density different from the surface density of the side surface, and firing the green chip, the degree of firing of at least one side surface is different from the degree of firing of the other set of side surfaces, A firing step for forming a chip body having a color on at least one side different from a color on the other side, and an external electrode forming step for forming an external electrode on each of the first set of surfaces of the chip body. It is characterized by providing.

  In the method for manufacturing a ceramic electronic component according to the present invention, in the green chip forming step, the surface density on at least one side surface of one set of the second set and the third set is set to be the surface on the other set. A green chip having a different density is formed. When such a green chip is fired, the surface density of at least one of the side surfaces of one set is high, so that the firing of the at least one side surface proceeds more than the side surfaces of the other set and the degree of sintering becomes high. Therefore, in the firing step, it is possible to easily form a chip body in which the degree of sintering on at least one side surface of one set is different from the degree of sintering on the side surface of the other set. The ceramic electronic component having such a chip body can determine which two of the four side surfaces are the second set of side surfaces or the second set of side surfaces based on the color. Therefore, if it is known which set of side surfaces are parallel or perpendicular to the conductor arrangement direction, the conductor arrangement direction can be easily determined.

  In the method for manufacturing a ceramic electronic component of the present invention, preferably, in the green chip forming step, the laminated body is cut to form the first set of surfaces and the third set of side surfaces, and of the third set of side surfaces, The cutting speed of the laminate is set so that the surface density of at least one side surface is different from the surface density of the second set of side surfaces. In this case, in the green chip forming step, it is possible to easily form a green chip in which the surface density of the third set of side surfaces is higher than the surface density of the second set of side surfaces. Therefore, in the firing step, firing on the third set of side surfaces proceeds more than firing on the side surfaces on the second set of side surfaces, and the degree of firing on the third set of side surfaces is higher than the degree of firing on the second side surface. That is, the color of the third set of side faces in the chip body is blacker than the color of the second set of side faces. Therefore, it is possible to easily form a ceramic electronic component capable of discriminating the arrangement direction of the conductor based on the difference in the color of the side surface.

  In the method for manufacturing a ceramic electronic component according to the present invention, preferably, in the green chip forming step, at least one of the two principal surfaces perpendicular to the lamination direction in the laminated body is roughened and then laminated. By cutting the body, a second set of side surfaces comprising a part of each of the two main surfaces is provided, and the surface density of at least one of the second set of side surfaces is different from the surface density of the third set of side surfaces. Form a green chip. Thus, by increasing the surface roughness of at least one main surface of the two main surfaces, the surface density of at least one side surface of the second set of side surfaces consisting of a part of each of the main surfaces is It can be made lower than the surface density of the third set of side surfaces. Therefore, it is possible to easily form a green chip in which the surface density of at least one of the second set of side surfaces is lower than the surface density of the third set of side surfaces. Therefore, in the firing step, firing on the third set of side faces proceeds from firing of the side faces on at least one side face of the second set of side faces, and the firing degree on the third set side face is on at least one of the second side faces. It becomes higher than the degree of firing. That is, the color of the third set of side faces in the chip body is blacker than the color of at least one side face of the second set of side faces. Therefore, it is possible to easily form a ceramic electronic component capable of discriminating the arrangement direction of the conductor based on the difference in the color of the side surface.

  The method for packing ceramic electronic components according to the present invention is based on the preparation step of preparing a plurality of the ceramic electronic components described above and the difference in color between at least one side surface and the other set of side surfaces. And a packing step of arranging and packing a plurality of ceramic electronic components so that the stacking directions determined in the determination step face the same direction.

  In the method of packaging ceramic electronic components according to the present invention, if it is known which set of side surfaces are parallel or perpendicular to the conductor arrangement direction, the conductor arrangement direction can be easily determined in the determination step. it can. Subsequently, in the packaging process, a plurality of ceramic electronic components can be arranged and packaged so that the arrangement directions of the conductors face the same direction.

  In the ceramic electronic component packaging method of the present invention, preferably, in the determination step, the color difference between at least one side surface and the other set of side surfaces is determined by measuring the brightness. In this case, since the color difference can be determined with high accuracy, the arrangement direction of the conductor can be determined with high accuracy.

  ADVANTAGE OF THE INVENTION According to this invention, the ceramic electronic component which can discriminate | determine the arrangement direction of a conductor, its manufacturing method, and the packaging method of the ceramic electronic component which can arrange and arrange the arrangement direction of a conductor can be provided.

  The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are assigned to the same elements, and duplicate descriptions are omitted.

  FIG. 1 is a perspective view of a ceramic electronic component according to this embodiment. The ceramic electronic component C1 according to this embodiment is a multilayer chip capacitor. The ceramic electronic component C1 has a substantially rectangular parallelepiped shape, a height of about 2.5 mm, a width of about 2.5 mm, and a depth of about 3.2 mm. The height dimension and the lateral dimension are substantially equal. The end surfaces where the external electrodes are formed are square.

  The ceramic electronic component C1 includes a substantially rectangular parallelepiped chip body 2 and first and second external electrodes 3 and 4 formed on both end faces 2a and 2b (first set of surfaces) of the chip body 2, respectively. . In the chip body 2, both end faces 2 a and 2 b face each other. The chip body 2 includes a first side surface 2c and a second side surface 2d (second set of side surfaces) that face each other and are perpendicular to both end surfaces 2a and 2b. The chip body 2 is opposite to each other, and is perpendicular to both end faces 2a and 2b and the first and second side faces 2c and 2d. The third side face 2e and the fourth side face 2f are opposite to each other. Side).

  The first external electrode 3 is formed on the end face 2a of the chip body 2, covers the entire end face 2a, and covers a part of the first to fourth side faces 2c to 2f on the end face 2a side. The second external electrode 4 is formed on the end surface 2b of the chip body 2, covers the entire end surface 2b, and covers a part of the first to fourth side surfaces 2c to 2f on the end surface 2b side.

  The chip body 2 will be described with reference to FIG. FIG. 2 is a cross-sectional view of the ceramic electronic component according to the present embodiment. The cross-sectional view shown in FIG. 2 is a cross section parallel to both end faces 2a and 2b of the ceramic electronic component C1. This cross section has a square shape in the present embodiment. That is, the first to fourth side surfaces 2c to 2f have the same shape and the same size. The chip body 2 is made of ceramic, and a plurality of internal electrode layers 7 (conductors) are formed therein.

  A plurality of internal electrode layers 7 are laminated with a ceramic layer formed of ceramic therebetween. The plurality of internal electrode layers 7 are shifted to the end face 2a side so that the end face of the internal electrode layer 7 is exposed at the end face 2a, and shifted to the end face 2b side to be shifted to the end face 2b. The internal electrode layers 7 are arranged so as to expose the end faces thereof, and are laminated alternately. The end face of the internal electrode layer 7 shifted to the end face 2a side is electrically and mechanically connected to the first external electrode 3, and the end face of the internal electrode layer 7 shifted to the end face 2b side is connected to the second external electrode 4. Are electrically and mechanically connected.

  The third and fourth side surfaces 2e and 2f are surfaces formed by cutting and firing a laminate formed by laminating ceramic green layers. The third and fourth side surfaces 2e and 2f have a higher degree of firing than the first and second side surfaces 2c and 2d. Accordingly, the third and fourth side surfaces 2e and 2f are blacker than the first and second side surfaces 2c and 2d, and the lightness L of the L * a * b * color system (JIS Z8729) is low. The difference between the brightness L of the third and fourth side faces 2e, 2f and the brightness L of the first and second side faces 2c, 2d is preferably 1.0 or more.

  The first to fourth side surfaces 2c to 2f include the same ceramic particles. Since the third and fourth side surfaces 2e and 2f have a higher degree of firing than the first and second side surfaces 2c and 2d, the particle sizes of the ceramic particles on the third and fourth side surfaces 2e and 2f are the first and second side surfaces 2e and 2f, respectively. It is larger than the particle size of the ceramic particles on the second side surfaces 2c and 2d. That is, the firing degree can be compared by comparing the particle sizes of the ceramic particles.

  For example, the particle size R1 of the ceramic particles on the first and second side surfaces 2c, 2d is about 0.30 to 0.34 μm, and the particle size R2 of the ceramic particles on the third and fourth side surfaces 2e, 2f is 0. It is about 35 to 0.41 μm. In order to make the difference between the lightness L of the third and fourth side faces 2e, 2f and the lightness L of the first and second side faces 2c, 2d 1.0 or more, the first and second side faces 2c, 2d The difference between the particle size R1 of the ceramic particles at and the particle size R2 of the ceramic particles at the third and fourth side surfaces 2e, 2f is preferably about 0.04 μm or more.

  In the ceramic electronic component C <b> 1, the plurality of internal electrode layers 7 are conductors arranged inside the chip body 2. The plurality of internal electrode layers 7 are disposed symmetrically with respect to three surfaces that pass through the center of the chip body 2 and are parallel to the end surface 2a, the first side surface 2c, and the third side surface 2e. The arrangement direction of the conductor can be indicated by the stacking direction of the internal electrode layers 7. In the present embodiment, the stacking direction of the internal electrode layers 7 is a direction perpendicular to the first and second side surfaces 2c and 2d.

  In the ceramic electronic component C1 according to the present embodiment described above, the third side surface 2e and the fourth side surface 2f of the chip body 2 are different in color from the first side surface 2c and the second side surface 2d. Accordingly, it is possible to determine which side of the four side surfaces is the first or second side surface 2c, 2d based on the color. Further, it can be determined based on the color which side of the four side surfaces is the third or fourth side surface 2e, 2f. Since it is known that the first and second side surfaces 2c and 2d are perpendicular to the stacking direction of the internal electrode layer 7, the stacking direction of the internal electrode layer 7 can be easily determined. In addition, since the third and fourth side surfaces 2e, 2f and the first and second side surfaces are different in degree of sintering, the first to fourth side surfaces 2c to 2f are made of the same ceramic material. Nevertheless, the colors of both can be easily changed.

  Further, in the ceramic electronic component C1 according to the present embodiment, the particle size of the ceramic particles on the third side surface 2e and the fourth side surface 2f of the chip body 2 is the same as that of the ceramic on the first side surface 2c and the second side surface 2d. Different from particle size. That is, since the first and second side surfaces 2c and 2d are different in degree of sintering from the third and fourth side surfaces 2e and 2f, the lamination direction of the internal electrode layer 7 is easily determined based on the difference in color. be able to.

  In the ceramic electronic component C1 according to the present embodiment, the third side surface 2e and the fourth side surface 2f are cut surfaces formed by cutting a laminated body formed by laminating ceramic green layers. The particle size R2 of the ceramic particles on the third side surface 2e and the fourth side surface 2f is larger than the particle size R1 of the ceramic particles on the first side surface 2c and the second side surface 2d. In the green chip formed by cutting the laminated body, the surface density of the third side surface 2e and the fourth side surface 2f becomes higher than the surface density of the first side surface 2c and the second side surface 2d by cutting. Therefore, when the green chip is fired, the third side face 2e and the fourth side face 2f have a higher surface density, so that the firing proceeds more than the first side face 2c and the second side face 2d, and the degree of firing becomes higher. Therefore, the colors of the third side surface 2e and the fourth side surface 2f can be easily formed so that the brightness is lower than that of the first side surface 2c and the second side surface 2d.

The surface density A [%] can be defined as in Expression (1).

A = 100 × _Σ m / B (1)

As shown in FIG. 3, the reference length B in the equation (1) is a length set along the reference line L. The sum _Σm is the length m1, m2 of the portion where the ceramic particle P and the reference line L overlap in the range of the reference length B of the reference line L on the target surface when viewed from the direction perpendicular to the target surface. , M3, m4.

  Then, the manufacturing method and packing method of the ceramic electronic component C1 which concern on this embodiment are demonstrated. FIG. 4 is a flowchart showing the steps of the method for manufacturing and packing the ceramic electronic component according to the present embodiment. The method for manufacturing a ceramic electronic component according to the present embodiment includes a multilayer body forming step S1, a green chip forming step S2, a firing step S3, and an external electrode forming step S4. A plurality of the ceramic electronic components C1 described above are formed by these steps S1 to S4 (preparation step). Each step will be described.

In the laminated body forming step S1, as shown in FIG. 5, a laminated body 10 in which a plurality of ceramic green layers 21 are laminated and a plurality of electrode patterns 17 are provided therein is formed. FIG. 5 shows a cross section perpendicular to the stacking direction in the stacked body 10. First, the ceramic green layer 21 is formed on the PET film. The ceramic green layer 21 is obtained by applying a ceramic slurry obtained by adding an additive to a main component and further adding and mixing a binder resin (for example, an organic binder resin), a solvent, a plasticizer, and the like on a PET film. Formed by drying. The main component of the ceramic green layer 21 is ceramic raw material particles that become ceramic particles after firing, and is, for example, BaTiO ₃ . Examples of the additive include MgO, Y ₂ O ₃ , MnO, V ₂ O ₅ , BaSiO ₃ , and CaSiO ₃ .

  Next, a plurality of electrode patterns 17 are formed on the upper surface of the ceramic green layer 21. The electrode pattern 17 is formed by printing an electrode paste on the upper surface of the ceramic green layer 21 and then drying it. The electrode paste is a paste-like composition obtained by mixing a binder resin, a solvent, or the like with a metal powder such as Ni, Ag, or Pd. For example, screen printing or the like is used as the printing means.

  A plurality of ceramic green layers 21 on which the electrode patterns 17 are formed are stacked. A plurality of ceramic green layers 21 on which the electrode pattern 17 is not formed are stacked on the upper and lower sides with a plurality of ceramic green layers 21 on which the electrode pattern 17 is formed interposed therebetween. Thereby, the laminated body 10 is formed.

  Next, in the green chip forming step S2, the stacked body 10 is cut in a direction parallel to the stacking direction to form the green chip 12 as shown in FIG. Cutting is performed using a dicer. A fine diamond is attached to the blade of the dicer, and this blade is cut at a high speed. The green chip 12 to be formed has two end faces 12a and 12b facing each other, a first side face 12c and a second side face 12d that are perpendicular to the two end faces 12a and 12b and face each other, and two end faces 12a and 12b. And a third side surface 12e and a fourth side surface 12f which are perpendicular to the first and second side surfaces 12c and 12d and face each other.

  The two end surfaces 12a and 12b are cut surfaces, and end portions of the electrode pattern are exposed. The first and second side surfaces 12c and 12d are surfaces perpendicular to the stacking direction, and are surfaces corresponding to the main surfaces 10c and 10d facing each other perpendicular to the stacking direction in the stacked body 10. The third and fourth side surfaces 12e and 12f are cut surfaces.

  When forming the third and fourth side surfaces 12e and 12f by cutting, the surface density of the third and fourth side surfaces 12e and 12f is made different from the surface density of the first and second side surfaces 12c and 12d. The laminate 10 is cut at the set cutting speed. The cutting speed is set so that the surface density of the third and fourth side surfaces 12e and 12f is smaller than the surface density of the first and second side surfaces 12c and 12d.

  For example, the surface density of the first and second side surfaces 12c and 12d is about 83%, whereas the surface density of the third and fourth side surfaces 12e and 12f is about 84.5 to 86.5%. It is preferable to set the cutting speed. For example, the cutting speed is preferably about 5 to 25 m / min.

  Next, in the firing step S3, the binder contained in the ceramic green layer 21 is removed and fired. By firing, the ceramic green layer 21 of the green chip 12 becomes ceramic, the electrode pattern 17 becomes the internal electrode layer 7, and the green chip 12 becomes the chip body 2.

  During firing, if the surface density is different in the first to fourth side surfaces 12c to 12f of the green chip 12, the degree of progress of sintering is different. In the present embodiment, in the green chip 12, the surface density of the third and fourth side surfaces 12e and 12f is larger than the surface density of the first and second side surfaces 12c and 12d. The degree of sintering of the third and fourth side faces 2e, 2f is higher than the degree of sintering of the third and fourth side faces 12e, 12f. Thereby, the 3rd and 4th side surfaces 2e and 2f in the chip | tip body 2 after baking are blacker than the 1st and 2nd side surfaces 12c and 12d, and the lightness L is low. Further, the particle size R2 of the ceramic particles on the third and fourth side surfaces 2e, 2f in the chip body 2 is larger than the particle size R1 of the ceramic particles on the first and second side surfaces 12c, 12d.

  Next, in the external electrode forming step S4, the first external electrode 3 and the second external electrode 4 are formed on both end faces 2a and 2b of the chip body 2 respectively. As a result, the internal electrode layer 7 is electrically connected to the first external electrode 3 or the second external electrode 4. Through the steps described above, a plurality of ceramic electronic components C1 are completed.

  Subsequently, a method for packing ceramic electronic components according to the present embodiment will be described. The ceramic electronic component packaging method according to the present embodiment includes a preparation process, a determination process S5, and a packaging process S6. First, as a preparation step, the above-described steps S1 to S4 are performed to prepare a plurality of ceramic electronic components C1.

  Next, in the discriminating step S5, the stacking direction of the internal electrode layer 7 in the ceramic electronic component C1 is based on the color difference between the first or second side surface 2c, 2d and the third or fourth side surface 2e, 2f. Is determined. Among the first to fourth side surfaces 2c to 2f excluding the end surfaces 2a and 2b where the external electrodes 3 and 4 are formed in the ceramic electronic component C1, for example, the colors of two adjacent side surfaces are measured using a color measuring device. taking measurement. Based on the difference in the lightness L, it is identified whether the measured side surface is the first or second side surface 2c, 2d, or the third or fourth side surface 2e, 2f.

  For example, a spectral color difference meter can be used as the color measuring device. The lightness L of the L * a * b * color system (JIS Z8729) is measured with this spectral color difference meter. In the present embodiment, the side surface with the lower lightness L is the third or fourth side surface 2e, 2f, and the side surface with the higher lightness L is the first or second side surface 2c, 2d. The direction perpendicular to the first or second side surface 2c, 2d is the stacking direction of the internal electrode layers 7.

  Next, as shown in FIG. 7, in the packing step S <b> 6, the plurality of ceramic electronic components C <b> 1 are arranged and packaged so that the determined lamination direction of the internal electrode layers 7 faces the same direction. The packing material includes a packing material 31 and a packing material 32. The packing material 31 is formed with a plurality of concave portions 31a having a quadrangular cross section in a two-dimensional array. Ceramic electronic components C1 are accommodated in the recesses 31a, respectively.

  The ceramic electronic component C1 is accommodated in the recess 31a so that the first and second side surfaces 2c and 2d are perpendicular to the depth direction of the recess 31a. That is, the ceramic electronic component C1 is accommodated in the recess 31a so that the stacking direction of the internal electrode layers 7 is parallel to the depth direction of the recess 31a. Thereafter, the opening of the recess 31a is covered with the packing material 32, and the packing is completed.

  In the ceramic electronic component manufacturing method according to the present embodiment described above, the surface density of the third and fourth side surfaces 2e and 2f is different from that of the first and second side surfaces 2c and 2d in the green chip forming step S2. A green chip 12 is formed. When such a green chip 12 is baked, the side surface having a higher surface density is baked more than the other side surface, and the degree of sintering is increased. Therefore, in the firing step S3, it is possible to easily form the chip body 2 in which the degree of sintering on the third and fourth side faces 2e, 2f is different from the degree of sintering on the first and second side faces 2c, 2d. it can. The ceramic electronic component C1 having such a chip body 2 can determine which side of the four side surfaces is the first or second side surface 2c, 2d based on the color. Further, it can be determined based on the color which side of the four side surfaces is the third or fourth side surface 2e, 2f. Therefore, since it is known that the first and second side surfaces 2c and 2d are perpendicular to the stacking direction of the internal electrode layer 7, the stacking direction of the internal electrode layer 7 can be easily determined. Moreover, since the color is varied by varying the degree of sintering, it can be easily formed.

  In the method of manufacturing a ceramic electronic component according to the present embodiment, in the green chip forming step S2, the surface density of the third and fourth side surfaces 2e and 2f is different from that of the first and second side surfaces 2c and 2d. The cutting speed at the time of cutting the laminated body 10 is set. Thereby, the side surface from which an area density differs can be formed easily.

  In the packaging method of the ceramic electronic component according to the present embodiment, the stacking direction of the internal electrode layers 7 can be easily determined by determining the side surface based on the color difference in the determination step S5. Subsequently, in the packaging step S6, a plurality of ceramic electronic components C1 can be arranged and packaged so that the stacking direction of the internal electrode layers 7 faces the same direction.

  Further, in the ceramic electronic component packaging method according to the present embodiment, the difference between the colors of the first and second side surfaces 2c and 2d and the colors of the third and fourth side surfaces 2e and 2f in the determination step S5 is as follows. Discrimination is made by measuring the difference in brightness. Thereby, since the difference in color can be determined with high accuracy, the stacking direction of the internal electrode layers can be determined with high accuracy.

  By arranging and packing the plurality of ceramic electronic components C1 so that the internal electrode layers 7 are laminated in the same direction, the internal electrode layers 7 can be mounted on the substrate in the same direction. Therefore, variation in electrical characteristics of the ceramic electronic component C1 and the electronic component on the substrate can be suppressed.

  Further, in the ceramic electronic component packaging method according to the present embodiment, the difference between the color of the third or fourth side surface 2e, 2f and the color of the first or second side surface 2c, 2d is L in the discrimination step S5. * A * b * Determined by measuring the difference in lightness L of the color system. Thereby, since the difference in color can be determined with high accuracy, the stacking direction of the internal electrode layer 7 can be determined with high accuracy.

  In general, the chip body of the ceramic electronic component has first and second side surfaces that are perpendicular to the stacking direction of the internal electrode layers, and third and fourth side surfaces that are parallel to the stacking direction. It becomes concave. Therefore, the installation state of the ceramic electronic component is different between the case where the first or second side surface is mounted on the mounting substrate side and the case where the third or fourth side surface is mounted on the mounting substrate side. If the case where the side surface on the mounting substrate side is the first or second side surface and the case where the side surface is the third or fourth side surface coexists, the installation accuracy varies, which is a problem.

  On the other hand, according to the method for packing ceramic electronic components according to the present embodiment, the stacking directions of the internal electrode layers 7 are aligned and packed. Thus, by mounting the ceramic electronic component C1 taken out from the packing material without changing the stacking direction of the internal electrode layers 7, it is possible to suppress variations in the installation accuracy of the ceramic electronic component C1.

  Further, when the ceramic electronic component C1 is taken out from the packing material, the ceramic electronic component C1 is sucked out by using a negative pressure. At this time, since the side surface on the opening side of the packing material is adsorbed and taken out, the convex side surface is easier to adsorb than the concave shape. In the ceramic electronic component packaging method of the present embodiment, the first or second side surface 2c, 2d is positioned on the opening side of the packaging material, and thus the convex first or second side surface 2c, 2d will be adsorbed. Therefore, suction conveyance can be performed easily.

  The present invention is not limited to the above embodiment, and various modifications can be made. For example, the ceramic electronic component C1 according to the present embodiment is a chip capacitor. However, the ceramic electronic component C1 is not limited thereto, and may be a multilayer piezoelectric body, a varistor, an inductor, or the like. In the ceramic electronic component C1 according to the above embodiment, a plurality of conductors (internal electrode layer 7) are stacked. However, the number of conductors may be one.

  Further, for example, in the ceramic electronic component C1 according to the present embodiment, the degree of firing of the third and fourth side faces 2e, 2f is different from the degree of firing of the first and second side faces 2c, 2d. Not limited to this. You may make it the baking degree of any one side surface of the 3rd and 4th side surfaces 2e and 2f differ from the baking degree of the 1st and 2nd side surfaces 2c and 2d. In this case, the speed of cutting to form the third side face 12e is different from the speed of cutting to form the fourth side face 12f, and one of the third and fourth side faces 2e, 2f is changed. The firing degree of the side surfaces can be made different from the firing degree of the first and second side surfaces 2c and 2d.

  Further, for example, in the method for manufacturing a ceramic electronic component according to the present embodiment, the surface density of at least one of the third and fourth side surfaces 12e and 12f is the surface density of the first and second side surfaces 12c and 12d. Although the cutting speed of the laminated body 10 in the green chip forming step S2 is set differently, it is not limited to this. In the green chip forming step S2, before cutting the stacked body 10, at least one of the two main surfaces 10c and 10d perpendicular to the stacking direction in the stacked body 10 may be roughened. By polishing, the polished side surface can be roughened, and the surface density of the side surface can be made lower than the surface density of the first and second side surfaces 2c and 2d. Therefore, a green chip in which at least one of the third and fourth side surfaces 2e and 2f has a surface density different from the surface density of the first and second side surfaces 2c and 2d can be easily formed.

(Example)
Subsequently, examples will be described. Examples 1 to 4 are ceramic electronic components in which the cutting speed in the green chip forming step S2 is set in a range of 5 [m / min] or more and less than 25 [m / min]. Comparative Examples 1 to 3 are ceramic electronic components in which the cutting speed in the green chip forming step S2 is set to a range of less than 5 [m / min] or 25 [m / min] or more. Others were produced in the same manner as in the production method described above in both Examples and Comparative Examples.

FIG. 8 shows the cutting speed, green chip surface density, color of each side, color difference, particle size after firing, chip peeling, and discrimination for the ceramic electronic components of Examples 1 to 4 and Comparative Examples 1 to 3. Results are shown. The cutting speed is the cutting speed in the green chip forming step S2. The green chip surface density is a surface density between the first or second side surface and the third or fourth side surface of the green chip 12. The color of each side surface is a measurement result by a spectral color difference meter, and is indicated by the L * a * b * color system. The spectral color difference meter used is a fine surface spectral color difference meter VSS 400 manufactured by Nippon Denshoku Industries Co., Ltd. Difference in color is the difference _delta L lightness L. In the corresponding column, ○ is described when the color difference can be accurately discriminated including an error.

  The particle size after firing is the particle size of the ceramic particles on the side surface of the chip body after firing. R2-R1 indicates the difference between the particle size R1 of the ceramic particles on the first or second side surface and the particle size S2 of the ceramic particles on the third or fourth side surface. The chip peeling indicates the rate at which the chip is peeled off from the adhesive sheet fixing the green chip 12 at the time of cutting. The discrimination result is OK when the color difference can be discriminated including an error and no chip peeling occurs.

As shown in FIG. 8, the difference _ΔL between the lightness L of the third or fourth side surface 2e, 2f and the lightness L of the first or second side surface 2c, 2d in the chip body 2 is 1.0 or more. In some cases, color differences including errors can be accurately determined. Therefore, the stacking direction can be accurately determined. In order to set the color difference _ΔL to 1.0 or more, the difference R2-R1 between the particle size R1 of the ceramic particles on the first or second side surface and the particle size S2 of the ceramic particles on the third or fourth side surface Is preferably 0.04 μm or more.

  By making the surface density of the third and fourth side surfaces in the green chip 12 1.5% or more higher than the surface density of the first and second side surfaces, the difference R2-R1 is set to 0.04 μm or more. Can do. By setting the cutting speed to 5 [m / min] or more, the surface density of the third and fourth side surfaces of the green chip 12 is made 1.5 [%] or more higher than the surface density of the first and second side surfaces. be able to.

  Further, as shown in FIG. 8, when the cutting speed is increased to 25 [m / min], the chip may be peeled off from the adhesive sheet fixing the green chip 12 at the time of cutting. Therefore, the cutting speed is preferably less than 25 [m / min].

It is a perspective view of the ceramic electronic component which concerns on this embodiment. It is sectional drawing of the ceramic electronic component which concerns on this embodiment. It is a figure which shows the definition of areal density. It is a flowchart which shows the procedure of the manufacturing method and packing method of the ceramic electronic component which concern on this embodiment. It is sectional drawing of the laminated body formed in the manufacturing method of the ceramic electronic component which concerns on this embodiment. It is a perspective view of the green chip formed in the manufacturing method of the ceramic electronic component concerning this embodiment. It is sectional drawing which shows the packing state of the ceramic electronic component which concerns on this embodiment. It is a figure which shows the Example of the ceramic electronic component which concerns on this embodiment.

Explanation of symbols

  C1 ... ceramic electronic component, 2 ... chip body, 2a, 2b ... end surface, 2c ... first side surface, 2d ... second side surface, 2e ... third side surface, 2f ... fourth side surface, 3 ... first External electrode, 4 ... second external electrode, 7 ... internal electrode layer (conductor), 10 ... laminate, 10c, 10d ... main surface, 12 ... green chip, 12a, 12b ... end face, 12c ... first side surface , 12d, second side, 12e, third side, 12f, fourth side, 17, electrode pattern, 21, ceramic green layer.

Claims (8)

A first set of surfaces facing each other, a second set of side surfaces facing each other perpendicular to the first set of surfaces, and a third set of surfaces facing each other perpendicular to the first set of surfaces and the second set of side surfaces. A chip body having a pair of side surfaces and a conductor disposed therein,
An external electrode formed on each of the first set of surfaces of the chip body;
With
The chip body is made of ceramic,
The firing degree of at least one side surface of one set of the second set of side surfaces and the third set of side surfaces of the chip body is different from the firing level of the other set of side surfaces. The color of the side surface is different from the color of the side surface of the other set.   2. The ceramic electronic component according to claim 1, wherein a particle size of the ceramic particles on the at least one side surface is different from a particle size of the ceramic particles on the other set of side surfaces. The side surfaces of the third set are surfaces formed by cutting and firing a laminate formed by laminating ceramic green layers,
3. The ceramic electronic component according to claim 1, wherein a particle size of the ceramic particles on the third set of side surfaces is larger than a particle size of the ceramic particles on the second set of side surfaces. 4. A laminate forming step of forming a laminate in which a plurality of ceramic green layers containing ceramic raw material particles are laminated and an electrode pattern is provided therein,
The laminated body is cut in a direction parallel to the laminating direction, and a first set of faces facing each other, a second set of side faces perpendicular to each other of the first set of faces, and the first set of faces A third set of side faces that are perpendicular to each other and face each other, and at least one of the second set of side faces and the third set of side faces. A green chip forming step of forming a green chip in which the surface density of the ceramic particles on the side surface is different from the surface density on the other side surface;
The green chip is fired, and the degree of firing of the at least one side is different from the degree of firing of the other set of side faces, whereby the color of the at least one side is different from the color of the side of the other set. A firing step of forming an element body;
Forming an external electrode on each of the first set of surfaces of the chip body;
A method for producing a ceramic electronic component comprising: In the green chip forming step, the first set of surfaces and the third set of side surfaces are formed by cutting the laminate.
The cutting speed of the laminate is set so that the surface density of the at least one side surface of the third set of side surfaces is different from the surface density of the second set of side surfaces. Of manufacturing ceramic electronic parts.   In the green chip forming step, by cutting the stacked body after roughening the surface roughness of at least one of the two main surfaces perpendicular to the stacking direction in the stacked body, The green chip is provided with the second set of side surfaces formed of a part of each main surface, and the surface density of the at least one side surface of the second set of side surfaces is different from the surface density of the third set of side surfaces. 6. The method of manufacturing a ceramic electronic component according to claim 4, wherein the ceramic electronic component is manufactured. A preparation step of preparing a plurality of ceramic electronic components according to any one of claims 1 to 3,
A determination step of determining a stacking direction of the internal electrode layer in the ceramic electronic component based on a color difference between the at least one side surface and the other set of side surfaces;
A packing step of arranging and packing the plurality of ceramic electronic components so that the stacking direction determined in the determination step faces the same direction;
A method for packing ceramic electronic components.   The method for packing ceramic electronic components according to claim 7, wherein, in the determining step, the color difference between the at least one side surface and the other set of side surfaces is determined by measuring brightness.

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