JPH05208373A - Abrasive cutting wheel and cutting method - Google Patents

Abrasive cutting wheel and cutting method

Info

Publication number
JPH05208373A
JPH05208373A JP4014403A JP1440392A JPH05208373A JP H05208373 A JPH05208373 A JP H05208373A JP 4014403 A JP4014403 A JP 4014403A JP 1440392 A JP1440392 A JP 1440392A JP H05208373 A JPH05208373 A JP H05208373A
Authority
JP
Japan
Prior art keywords
cutting
small
diameter
diameter abrasive
abrasive grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4014403A
Other languages
Japanese (ja)
Other versions
JP2679509B2 (en
Inventor
Torahiko Kanda
虎彦 神田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP4014403A priority Critical patent/JP2679509B2/en
Publication of JPH05208373A publication Critical patent/JPH05208373A/en
Application granted granted Critical
Publication of JP2679509B2 publication Critical patent/JP2679509B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121Circular saw blades

Abstract

PURPOSE:To obtain the properties of cutting face being obtained with an abrasive cutting wheel with small-diameter abrasive grains at the cutting speed equivalent to an abrasive cutting wheel with large-diameter abrasive grains, and prevent the abnormal abrasion of a corner. CONSTITUTION:An abrasive cutting wheel 11 is used, which has a large-diameter abrasive grains 23 at the center in thickness direction of a cutting wheel peripheral part 12 and has a small-diameter abrasive grains 13 at both side faces, and the sectional form of the large-diameter abrasive grain part of which has a taper 25 where the outer periphery side is large and the inner periphery side is small. Cutting is performed while reacting a small quantity of electrolytic dressing, as compared with the quantity of electrolytic dressing acting upon the outer periphery 12, upon both side faces of the abrasive cutting wheel.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ガラス、セラミックス
等の切断加工や溝入れ加工を、高精度かつ高速に行うた
めの切断砥石と切断方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting grindstone and a cutting method for cutting and grooving glass, ceramics and the like with high precision and high speed.

【0002】[0002]

【従来の技術】薄型の切断砥石を高速回転させてガラス
やセラミックス等の材料を切断、溝入れ加工する場合、
砥石自体の剛性が低いことや過大な研削抵抗が発生する
こと、偏摩耗といった要因により、切断砥石に曲がりが
生じやすい。この曲がりによって切断砥石の側面部が切
断面と接触し、側面部が切断面を僅かに研削あるいはラ
ビングすることになる。その際、切断砥石側面部の砥粒
の研削性能が不十分であると、目詰まり現象等に起因す
るむしれやチッピングが切断面に生じ、表面粗さを始め
とするの切断面性状が悪化する。
2. Description of the Related Art When a thin cutting grindstone is rotated at high speed to cut and groov materials such as glass and ceramics,
The cutting stone tends to bend due to factors such as low rigidity of the grinding stone itself, excessive grinding resistance, and uneven wear. Due to this bending, the side surface of the cutting grindstone comes into contact with the cutting surface, and the side surface slightly grinds or rubs the cutting surface. At that time, if the grinding performance of the abrasive grains on the side surface of the cutting grindstone is insufficient, peeling or chipping caused by a clogging phenomenon or the like occurs on the cut surface, and the cut surface properties such as surface roughness are deteriorated. To do.

【0003】切断面性状は、切断砥石に分布する砥粒を
小径化し、かつ適切なドレッシング法により砥粒の研削
性能を適切に維持することで向上することが可能とな
る。しかし、一般に切断面性状と切断速度は相反する関
係にあり、砥粒の小径化は除去能率を低下させ、切断加
工速度の低下をまねくことになる。このため、従来は所
望する切断面性状と切断速度の両者を考慮して、切断砥
石の砥粒径が決定されていた。
The cut surface property can be improved by reducing the diameter of the abrasive grains distributed on the cutting grindstone and by appropriately maintaining the grinding performance of the abrasive grains by an appropriate dressing method. However, in general, the cut surface properties and the cutting speed are in a contradictory relationship, and a reduction in the diameter of the abrasive grains lowers the removal efficiency and leads to a reduction in the cutting processing speed. Therefore, conventionally, the abrasive grain size of the cutting grindstone has been determined in consideration of both the desired cutting surface property and the cutting speed.

【0004】上記の課題を解決する方法として、主とし
て切断代の除去加工を行う切断砥石外周部の厚さ方向中
心部(以後、外周部と呼ぶ)に大径砥粒を有し、主とし
て切断面の僅かな研削のみを行う砥石側面部に小径砥粒
を有する切断砥石を用いた研削切断法が報告されてい
る。(1991年度精密工学会秋季大会学術講演会講演
論文集75ページ)。
As a method for solving the above-mentioned problems, a large-diameter abrasive grain is mainly provided in the central portion in the thickness direction of the outer peripheral portion of the cutting grindstone (hereinafter referred to as the outer peripheral portion), which is mainly used for removing the cutting allowance, and the cutting surface is mainly used. It has been reported that a grinding and cutting method using a cutting wheel having a small-diameter abrasive grain on the side surface portion of the wheel for performing only slight grinding. (Page 75 of the 1991 Autumn Meeting of the Precision Engineering Conference, Academic Lecture Meeting).

【0005】この方法によると、主として砥石外周部の
大径砥粒によって切断速度が決定され、側面部の小径砥
粒の研削によって切断面性状が左右されるため、切断面
性状を低下させることなく切断速度を向上することがで
きる。
According to this method, the cutting speed is mainly determined by the large-diameter abrasive grains on the outer peripheral portion of the grindstone, and the cutting surface property is influenced by the grinding of the small-diameter abrasive grains on the side surface portion, so that the cutting surface property is not deteriorated. The cutting speed can be improved.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、外周部
に大径砥粒を有し、側面部に小径砥粒を有する従来の切
断砥石を用いた研削切断法では、砥石に異常な摩耗が発
生しやすかった。すなわち、大径砥粒と小径砥粒の研削
性能が大きく異なることに起因し、大径砥粒部か小径砥
粒部のいずれかが急速に摩耗する現象が発生しやすかっ
た。
However, in the grinding and cutting method using the conventional cutting grindstone having the large-diameter abrasive grains on the outer peripheral portion and the small-diameter abrasive grains on the side surface portion, abnormal abrasion occurs in the grindstone. It was easy. That is, due to the large difference in the grinding performance between the large-diameter abrasive grain and the small-diameter abrasive grain, a phenomenon in which either the large-diameter abrasive grain portion or the small-diameter abrasive grain portion is rapidly worn was likely to occur.

【0007】異常摩耗が発生すると、切断砥石の外周部
に欠損が生じやすくなり、頻ぱんな切断砥石のツルーイ
ング作業が必要となる。このためこの切断砥石が有する
効果を再現性よく得ることができなかった。
If abnormal wear occurs, the cutting grindstone is likely to be damaged at the outer peripheral portion thereof, and frequent truing work of the cutting grindstone is required. Therefore, the effect of this cutting grindstone cannot be obtained with good reproducibility.

【0008】本発明の目的は、このような従来の課題を
解決し、切断面性状を悪化させることなく切断速度を向
上でき、かつ、その効果を高い再現性で得ることができ
る切断砥石及び切断方法を提供することにある。
The object of the present invention is to solve the above-mentioned conventional problems, to improve the cutting speed without deteriorating the properties of the cutting surface, and to obtain the effect with high reproducibility. To provide a method.

【0009】[0009]

【課題を解決するための手段】本発明の切断砥石は、砥
石外周部の厚さ方向の中央部に大径砥粒を、両側面部に
小径砥粒を有し、前記大径砥粒部の厚さ方向の寸法は、
外周側が大きく内周側が小さいテーパ状の断面形状を有
することを特徴とする。
The cutting grindstone of the present invention has a large-diameter abrasive grain in the central portion in the thickness direction of the outer peripheral portion of the grindstone, and has small-diameter abrasive grains on both side surfaces, The dimension in the thickness direction is
It is characterized by having a tapered cross-sectional shape with a large outer peripheral side and a small inner peripheral side.

【0010】また本発明の切断方法は、メタルボンドで
作製した大径砥粒切断砥石の両側面部に、電着等の方法
で小径砥粒を保持した本発明の切断砥石を用い、この切
断砥石の両側面部には外周部に作用させる電解ドレッシ
ング量に比較して少量の電解ドレッシングを作用させな
がら切断することを特徴とする。
The cutting method of the present invention uses the cutting grindstone of the present invention in which small-diameter abrasive grains are held by a method such as electrodeposition on both side surfaces of a large-diameter abrasive grain cutting grindstone made by metal bonding. It is characterized in that both side surfaces are cut while applying a small amount of electrolytic dressing as compared with the amount of electrolytic dressing applied to the outer peripheral portion.

【0011】[0011]

【作用】図4(a)、(b)は、外周部12に大径砥粒
23を有し、両側面部14に小径砥粒13を有する従来
の切断砥石11を用いて切断した場合、砥石に発生する
代表的な異常摩耗の断面形状を示した概略図である。
4 (a) and 4 (b) show the case where a conventional cutting wheel 11 having large-diameter abrasive grains 23 on the outer peripheral portion 12 and small-diameter abrasive grains 13 on both side surface portions 14 is used for cutting. It is the schematic which showed the cross-sectional shape of the typical abnormal wear which occurs in the.

【0012】切断砥石11の側面部14に分布する小径
砥粒13は、主として切断面を僅かに研削するだけであ
り、この軽研削による側面部14の摩耗量は極めて僅か
であると考えられている。しかし、従来の切断砥石11
において、角部26の小径砥粒13は切断代の除去加工
も行う。その際、大径砥粒23の研削能力に見合った切
断速度で加工を続けると、角部26では砥粒が小径であ
るため十分な砥粒の突き出し量が得られず、小径砥粒1
3の研削性能を越えた状態で切断代の研削除去加工が行
われることになる。このため小径砥粒13に目詰まり現
象等が生じて角部26に過大な研削抵抗が作用し、角部
26の小径砥粒13のみが急速に摩耗して、図4(a)
に示すような異常摩耗が生じる。
The small-diameter abrasive grains 13 distributed on the side surface portion 14 of the cutting grindstone 11 mainly only slightly grind the cut surface, and it is considered that the amount of wear of the side surface portion 14 due to this light grinding is extremely small. There is. However, the conventional cutting wheel 11
In the above, the small-diameter abrasive grains 13 of the corner portion 26 are also subjected to removal processing of the cutting margin. At that time, if the machining is continued at a cutting speed suitable for the grinding ability of the large-diameter abrasive grains 23, the abrasive grains at the corners 26 have a small diameter, so that a sufficient protrusion amount of the abrasive grains cannot be obtained, and the small-diameter abrasive grains 1
When the grinding performance of No. 3 is exceeded, the cutting removal grinding removal process is performed. As a result, a clogging phenomenon or the like occurs in the small-diameter abrasive grains 13 and an excessive grinding resistance acts on the corner portions 26, so that only the small-diameter abrasive grains 13 at the corner portions 26 are rapidly worn, and FIG.
Abnormal wear occurs as shown in.

【0013】そこで、本発明の切断砥石では、図1に示
すように、大径砥粒部の厚さ方向の寸法を、外周側が大
きく内周側が小さいテーパ状の断面形状としている。こ
の切断砥石11を用いることで、大量の加工物の研削除
去加工は大径砥粒23のみが行い、小径砥粒13は切断
面を僅かに研削するだけとなる。こうして、小径砥粒1
3で得られる切断面性状を、大径砥粒23を用いた場合
の切断速度で得ることが可能となる。
Therefore, in the cutting grindstone of the present invention, as shown in FIG. 1, the size of the large-diameter abrasive grain portion in the thickness direction has a tapered cross-sectional shape whose outer peripheral side is large and whose inner peripheral side is small. By using this cutting grindstone 11, only a large-diameter abrasive grain 23 grinds and removes a large amount of workpieces, and a small-diameter abrasive grain 13 only slightly grinds the cut surface. In this way, small-diameter abrasive grain 1
It becomes possible to obtain the cut surface properties obtained in No. 3 at the cutting speed when the large-diameter abrasive grains 23 are used.

【0014】また切断加工の進行に伴う側面部14の摩
耗量(砥粒部17の厚さの減り)を考慮してテーパ25
の角度を決定すると、外周部12が摩耗して切断砥石1
1の外径が減少しても、断面形状は安定に保たれる。す
なわち角部26において、小径砥粒13か大径砥粒23
のいずれかが先に摩耗しても、残された他方の砥粒部は
突出することになる。この突出部には過大な研削抵抗が
作用するため、急速に摩耗する。その結果、図3に示す
ように角部26は適度なアールを保ち続け、異常摩耗は
発生せず、安定した砥石断面形状を維持することが可能
となる。
Further, in consideration of the amount of wear of the side surface portion 14 (reduction of the thickness of the abrasive grain portion 17) along with the progress of cutting, the taper 25
When the angle of is determined, the outer peripheral portion 12 is worn and the cutting grindstone 1
Even if the outer diameter of 1 decreases, the cross-sectional shape is kept stable. That is, in the corner portion 26, the small-diameter abrasive grain 13 or the large-diameter abrasive grain 23
Even if any of the above is abraded first, the remaining abrasive grain portion will protrude. Excessive grinding resistance acts on these protrusions, causing rapid wear. As a result, as shown in FIG. 3, the corner portion 26 keeps an appropriate radius, abnormal wear does not occur, and a stable grindstone cross-sectional shape can be maintained.

【0015】一方、従来の方法で切断加工する場合、大
量の研削代を除去加工する外周部12に過大な負荷が作
用し、研削性能を適度に維持できず、図4(b)に示す
ような異常摩耗が発生することもある。このような異常
摩耗は、外周部12の厚さ方向の中央部に十分な研削液
が供給されないことや、小径砥粒13に比べて外周部1
2に分布する大径砥粒23の保持結合力が弱いこと等の
要因によっても助長される。
On the other hand, in the case of cutting by the conventional method, an excessive load acts on the outer peripheral portion 12 which removes a large amount of grinding allowance, and the grinding performance cannot be maintained appropriately, as shown in FIG. 4 (b). Abnormal wear may occur. Such abnormal wear is caused by insufficient supply of grinding fluid to the central portion of the outer peripheral portion 12 in the thickness direction, and the outer peripheral portion 1 compared with the small-diameter abrasive grains 13.
It is also promoted by factors such as the weak holding force of the large-diameter abrasive grains 23 distributed in No. 2.

【0016】上記の異常摩耗は、大径砥粒23と小径砥
粒13の研削性能の差異に起因して発生する。よってこ
の異常摩耗は大径砥粒23の分布する外周部12と小径
砥粒13の分布する側面部14をそれぞれ適切にドレッ
シングすることで抑制できる。しかし、切断加工の進行
に伴うセルフドレッシングによって、外周部12と側面
部14をそれぞれ適切な研削性能に維持することは困難
であり、切断パスの間に機械的なドレッシングを行うこ
とは非能率的である。
The above-mentioned abnormal wear occurs due to the difference in grinding performance between the large-diameter abrasive grain 23 and the small-diameter abrasive grain 13. Therefore, this abnormal wear can be suppressed by appropriately dressing the outer peripheral portion 12 in which the large-diameter abrasive grains 23 are distributed and the side surface portion 14 in which the small-diameter abrasive grains 13 are distributed. However, it is difficult to keep the outer peripheral portion 12 and the side surface portion 14 at appropriate grinding performances due to self-dressing as the cutting process progresses, and it is inefficient to perform mechanical dressing during the cutting pass. Is.

【0017】そこで本発明の切断方法では、メタルボン
ドによって作製した大径砥粒部の両側面に電着等の方法
で小径砥粒を保持した本発明の切断砥石を用い、切断砥
石11の外周部12と側面部14それぞれに、異なる量
の電解ドレシングを作用させる方法を採っている。一実
施例として使用した装置加工部の平面図を図2に示す。
このようにコの字型のマイナス電極16を用いて、かつ
砥石側面部14と電極16の隙間d1 を外周部12と電
極16の隙間d2 より大きくすることで、側面部14に
は外周部12に比較して僅かな電解電流を印加すること
としている。
Therefore, in the cutting method of the present invention, the outer circumference of the cutting wheel 11 is used by using the cutting wheel of the present invention in which the small-diameter abrasive grains are held on both sides of the large-diameter abrasive grain portion produced by metal bonding by a method such as electrodeposition. A method of applying different amounts of electrolytic dressing to the portion 12 and the side surface portion 14 is adopted. FIG. 2 shows a plan view of a machined part used as an example.
Thus, by using the U-shaped negative electrode 16 and making the gap d 1 between the grindstone side face portion 14 and the electrode 16 larger than the gap d 2 between the outer peripheral portion 12 and the electrode 16, the side face portion 14 has an outer periphery. A small electrolytic current is applied as compared with the portion 12.

【0018】この方法によって、大量の研削代を除去加
工する外周部12には多量の電解ドレッシングを作用さ
せ、切断面を僅かに研削するだけの側面部14には僅か
な電解ドレッシング作用させることができる。外周部1
2の大径砥粒23と側面部14の小径砥粒13の突き出
し量は、砥粒径が異なるにもかかわらず、それぞれ適切
に維持され、切断砥石11の異常摩耗を防止することが
可能となる。
By this method, a large amount of electrolytic dressing can be applied to the outer peripheral portion 12 for removing a large amount of grinding allowance, and a small amount of electrolytic dressing can be applied to the side surface portion 14 that only slightly grinds the cut surface. it can. Outer part 1
The protrusion amounts of the large-diameter abrasive grains 23 of No. 2 and the small-diameter abrasive grains 13 of the side surface portion 14 are appropriately maintained even though the abrasive grain sizes are different, and it is possible to prevent abnormal wear of the cutting grindstone 11. Become.

【0019】[0019]

【実施例】図1は、本発明の一実施例で用いた切断砥石
の概略断面図を示し、図2は装置加工部の平面図を示
す。図1の切断砥石11は砥粒部17の厚さ0.5m
m、ベース部18の厚さ0.3mm、ブロンズ系や鉄系
の1A1RタイプSD1200メタルボンド切断砥石
に、ツルーイング作業で1度程のテーパ25をつける。
次に電着あるいは無電解メッキ法でSD6000砥粒を
約0.05mmの厚さに形成、その後、両面ラッピング
法によってストレート形状に修整することで作製した。
1 is a schematic sectional view of a cutting grindstone used in an embodiment of the present invention, and FIG. 2 is a plan view of a machined portion of the apparatus. The cutting grindstone 11 shown in FIG. 1 has an abrasive grain portion 17 having a thickness of 0.5 m.
m, the thickness of the base portion 18 is 0.3 mm, and a bronze-based or iron-based 1A1R type SD1200 metal bond cutting grindstone is provided with a taper 25 of about 1 degree by a truing operation.
Next, SD6000 abrasive grains were formed to a thickness of about 0.05 mm by electrodeposition or electroless plating, and thereafter, straight-shaped was prepared by double-side lapping.

【0020】まず図2に示すように、コの字型の電極1
6を切断砥石11に隣接して設置し、弱導電性を有する
水溶性の研削液15を、カバー22に設けた供給孔から
切断砥石11の側面部14に向けて供給した。ここで砥
石外周部12と電極16の隙間d2 は0.3mm、側面
部14と電極16の隙間d1 は0.8mmとし、研削液
15は毎分3リッタ供給した。
First, as shown in FIG. 2, a U-shaped electrode 1
6 was installed adjacent to the cutting grindstone 11, and the water-soluble grinding fluid 15 having weak conductivity was supplied toward the side surface portion 14 of the cutting grindstone 11 from the supply hole provided in the cover 22. Here, the gap d 2 between the grindstone outer peripheral portion 12 and the electrode 16 was 0.3 mm, the gap d 1 between the side surface portion 14 and the electrode 16 was 0.8 mm, and the grinding fluid 15 was supplied at 3 liters per minute.

【0021】そして切断砥石11と電極16を電解電源
19に接続し、切断砥石11を15000RPMで回転
させ、厚さ5mmのガラス基板を、送り速度10mm/
minで研削切断した。本実施例では切断砥石11へ電
解電源19を供給する方式として、主軸21の端面にカ
ーボンブラシ24を接触させる方式を採った。
Then, the cutting grindstone 11 and the electrode 16 are connected to an electrolytic power source 19, the cutting grindstone 11 is rotated at 15000 RPM, and a glass substrate having a thickness of 5 mm is fed at a feed rate of 10 mm /
Grinding cut at min. In this embodiment, as a method of supplying the electrolytic power source 19 to the cutting grindstone 11, a method of bringing the carbon brush 24 into contact with the end surface of the main shaft 21 is adopted.

【0022】以上の実施例では、メッシュサイズ120
0の切断砥石を用いた場合に匹敵する切断速度で研削切
断することができ、切断速度をメッシュサイズ6000
の切断砥石を用いた場合の3倍以上に向上できた。切断
面の表面粗さは、メッシュサイズ6000の切断砥石を
用いた場合と同時のRm a x 0.05μmが得られた。
In the above embodiment, the mesh size 120
It is possible to grind and cut at a cutting speed comparable to that when a cutting whetstone of 0 is used, and the cutting speed is 6000 mesh size.
It was possible to improve it by more than 3 times as compared with the case of using the cutting whetstone. As for the surface roughness of the cut surface, R max of 0.05 μm was obtained at the same time as when the cutting grindstone with a mesh size of 6000 was used.

【0023】また、従来の方法で発生していた異常摩耗
は防止され、図3の概略断面図に示すように安定した切
断砥石11の摩耗形状が得られた。その結果、ツルーイ
ング頻度は従来法の1/4以下となり、本説明の切断砥
石が持つ効果を高い再現性で得ることができた。
Further, abnormal wear which occurred in the conventional method was prevented, and a stable wear shape of the cutting wheel 11 was obtained as shown in the schematic sectional view of FIG. As a result, the truing frequency was 1/4 or less of the conventional method, and the effect of the cutting wheel of the present description could be obtained with high reproducibility.

【0024】なお本実施例では、大径砥粒23としてS
D1200を、小型砥粒13としてSD6000を有す
る切断砥石11を使用したが、これとは粒径の異なる砥
粒を組み合わせたものや、CBN等の異種砥粒を用いた
切断砥石を使用しても、同様の効果が得られる。
In this embodiment, the large-diameter abrasive grain 23 is S
The cutting grindstone 11 having SD6000 as the small abrasive 13 is used for the D1200, but a cutting grindstone using different abrasives such as CBN or the like may also be used. , A similar effect is obtained.

【0025】[0025]

【発明の効果】以上述べたように、本発明の切断砥石と
切断方法では、切断面性状を悪化することなく切断速度
を向上でき、かつ切断砥石の異常摩耗を抑制すること
で、前記の効果を高い再現性で達成することができる。
As described above, according to the cutting grindstone and the cutting method of the present invention, the cutting speed can be improved without deteriorating the properties of the cutting surface, and the abnormal wear of the cutting grindstone can be suppressed, whereby the above-mentioned effects can be obtained. Can be achieved with high reproducibility.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例で用いた切断砥石の概略断面
図である。
FIG. 1 is a schematic sectional view of a cutting grindstone used in an example of the present invention.

【図2】本発明の一実施例で用いた切断装置の加工部平
面図である。
FIG. 2 is a plan view of a processing portion of the cutting device used in the embodiment of the present invention.

【図3】本発明の切断砥石のにおいて、切断加工の進行
に伴う断面形状の変化を示した図である。
FIG. 3 is a diagram showing a change in cross-sectional shape of a cutting grindstone of the present invention as a cutting process progresses.

【図4】外周部に大径砥粒を有し、両側面部に小径砥粒
を有する従来の切断砥石を用いた場合に発生する代表的
な異常摩耗の断面形状を示す図である。
FIG. 4 is a diagram showing a cross-sectional shape of typical abnormal wear that occurs when a conventional cutting wheel having large-diameter abrasive grains on the outer peripheral portion and small-diameter abrasive grains on both side surfaces is used.

【符号の説明】[Explanation of symbols]

11 切断砥石 12 外周部 13 小径砥粒 14 側面部 15 研削液 16 電極 17 砥粒部 18 ベース部 19 電解電源 20 ガラス基板 21 主軸 22 カバー 23 大径砥粒 24 ブラシ 25 テーパ角 26 角部 11 Cutting Whetstone 12 Outer Perimeter 13 Small Diameter Abrasive Grain 14 Side Surface 15 Grinding Fluid 16 Electrode 17 Abrasive Grain Part 18 Base 19 Electrolytic Power Supply 20 Glass Substrate 21 Spindle 22 Cover 23 Large Diameter Abrasive 24 Brush 25 Tapered Angle 26 Corner

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 砥石外周部の厚さ方向の中央部に大径砥
粒を、両側面部に小径砥粒を有し、前記大径砥粒部の厚
さ方向の寸法は、外周側が大きく内周側が小さいテーパ
状の断面形状を有することを特徴とする切断砥石。
1. A large-diameter abrasive grain is provided at the center of the outer peripheral portion of the grindstone in the thickness direction, and small-diameter abrasive grains are provided on both side surfaces, and the large-diameter abrasive grain portion has a large inner diameter on the outer peripheral side. A cutting grindstone having a tapered cross-sectional shape on the peripheral side.
【請求項2】 メタルボンドで作製した大径砥粒切断砥
石の両側面部に、電着等の方法で小径砥粒を保持した請
求項1記載の切断砥石を用い、 この切断砥石の両側面部には外周部に作用させる電解ド
レッシングを量に比較して少量の電解ドレッシング作用
させながら切断することを特徴とする切断方法。
2. A cutting grindstone according to claim 1, wherein small-diameter abrasive grains are held on both side surfaces of a large-diameter abrasive grain cutting grindstone produced by metal bonding by a method such as electrodeposition. Is a cutting method characterized by cutting while applying a small amount of electrolytic dressing as compared with the amount of electrolytic dressing applied to the outer peripheral portion.
JP4014403A 1992-01-30 1992-01-30 Cutting wheel and cutting method Expired - Lifetime JP2679509B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4014403A JP2679509B2 (en) 1992-01-30 1992-01-30 Cutting wheel and cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4014403A JP2679509B2 (en) 1992-01-30 1992-01-30 Cutting wheel and cutting method

Publications (2)

Publication Number Publication Date
JPH05208373A true JPH05208373A (en) 1993-08-20
JP2679509B2 JP2679509B2 (en) 1997-11-19

Family

ID=11860083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4014403A Expired - Lifetime JP2679509B2 (en) 1992-01-30 1992-01-30 Cutting wheel and cutting method

Country Status (1)

Country Link
JP (1) JP2679509B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07164327A (en) * 1993-12-08 1995-06-27 Nec Corp Cutting blade and electrolytic dressing, grinding and cutting device
JP2008049412A (en) * 2006-08-22 2008-03-06 Read Co Ltd Multilayer structure thin edge blade and its manufacturing method
JP2009123897A (en) * 2007-11-14 2009-06-04 Tdk Corp Ceramic electronic part, its manufacturing method and its packaging method
EP2094424A1 (en) * 2006-11-16 2009-09-02 Shinhan Diamond Ind. Co., Ltd. Diamond tool and method for manufacturing segment thereof
CN106346378A (en) * 2015-07-16 2017-01-25 株式会社捷太格特 Grinding wheel
EP3067194B1 (en) * 2015-03-13 2023-07-12 NGK Insulators, Ltd. Manufacturing method of honeycomb structure, and grinding wheel

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07164327A (en) * 1993-12-08 1995-06-27 Nec Corp Cutting blade and electrolytic dressing, grinding and cutting device
JP2008049412A (en) * 2006-08-22 2008-03-06 Read Co Ltd Multilayer structure thin edge blade and its manufacturing method
EP2094424A1 (en) * 2006-11-16 2009-09-02 Shinhan Diamond Ind. Co., Ltd. Diamond tool and method for manufacturing segment thereof
EP2094424A4 (en) * 2006-11-16 2014-03-05 Shinhan Diamond Ind Co Ltd Diamond tool and method for manufacturing segment thereof
JP2009123897A (en) * 2007-11-14 2009-06-04 Tdk Corp Ceramic electronic part, its manufacturing method and its packaging method
EP3067194B1 (en) * 2015-03-13 2023-07-12 NGK Insulators, Ltd. Manufacturing method of honeycomb structure, and grinding wheel
CN106346378A (en) * 2015-07-16 2017-01-25 株式会社捷太格特 Grinding wheel
JP2017024091A (en) * 2015-07-16 2017-02-02 株式会社ジェイテクト Grinding wheel
CN106346378B (en) * 2015-07-16 2020-03-27 株式会社捷太格特 Grinding wheel

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