JPS60180775A - Cutting grind stone - Google Patents

Cutting grind stone

Info

Publication number
JPS60180775A
JPS60180775A JP3693784A JP3693784A JPS60180775A JP S60180775 A JPS60180775 A JP S60180775A JP 3693784 A JP3693784 A JP 3693784A JP 3693784 A JP3693784 A JP 3693784A JP S60180775 A JPS60180775 A JP S60180775A
Authority
JP
Japan
Prior art keywords
grind stone
cutting
grindstone
grinding
core metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3693784A
Other languages
Japanese (ja)
Inventor
Shigetoshi Morita
森田 重敏
Akira Taguchi
彰 田口
Masahiro Ao
青 雅弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP3693784A priority Critical patent/JPS60180775A/en
Publication of JPS60180775A publication Critical patent/JPS60180775A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To increase the life of a grind stone by providing a number of holes, at a certain rate of perforation, on the whole surface, or a part near the outer periphery, of the core metal of a grind stone. CONSTITUTION:A number of fine holes 2 are uniformly provided, at a perforation rate of 10-50%, on the whole surface, or a part near the outer periphery, of a core metal of a diamond grind stone 1 with a thickness of 0.5mm. or less. Thus, by providing fine holes 2, sufficient grinding fluid can be fed over the whole grinding surface of the grind stone 1, rise in temperature of the grinding surface can be reduced, and the life of the grind stone 1 can be increased.

Description

【発明の詳細な説明】 本発明は高密度フェライト、セラミックス等の難切削材
料を切断するために使用されるダイヤモンド砥石の改良
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in diamond grindstones used for cutting difficult-to-cut materials such as high-density ferrite and ceramics.

従来筒着度フェライト、セラミックス等の難切削材料を
切断する砥石は微粒のダイヤモンド粒子をメタル系ある
いはレジン系の結合剤でかためた第1図に示す様な円盤
状の砥石が使用されている。
Conventionally, the grindstone used to cut difficult-to-cut materials such as hard-to-cut ferrite and ceramics is a disk-shaped grindstone, as shown in Figure 1, made of fine diamond particles hardened with a metal or resin binder. .

しかるにこの円盤状のダイヤモンド砥石で厚みの厚い加
工物を切断する場合、砥石と被加工物の接触面すなわち
研削面全面に渡って充分に研削液が回り込まないために
、研削面の温度が高くなり、砥粒の劣化が激しく、いわ
ゆる切れ味が落ち、砥石の摩耗が太きくな″す、切断精
度が悪くなるとともに寿命が短くなるという欠点があっ
た。
However, when cutting a thick workpiece with this disk-shaped diamond grinding wheel, the temperature of the grinding surface becomes high because the grinding fluid does not circulate sufficiently over the contact surface between the grinding wheel and the workpiece, that is, the entire grinding surface. However, there were drawbacks such as severe deterioration of the abrasive grains, resulting in a decrease in sharpness, increased wear of the grindstone, poor cutting accuracy, and shortened lifespan.

本発明は上記従来技術の欠点を改良し、砥石の寿命を長
くすることのできる切断ダイヤモンド砥石を提供するも
のである。
The present invention aims to improve the drawbacks of the above-mentioned prior art and provide a cutting diamond grindstone that can extend the life of the grindstone.

本発明の%徴は第2図に示すように切断砥石の芯金の全
面または芯金の外周部の近傍を穿孔率で10〜50%に
なる様に均一に多数の穴を穿孔したことである。ここで
穿孔率は、芯金の面積忙対する穿孔した穴の面積の総オ
慣の比である。切断ダイヤモンド砥石をこのようにする
ことによって加工時の研削面に全面に渡って充分に研削
液を供給することによって、砥粒の劣化を防ぎ、砥石寿
命を長くしたものである。
The percentage characteristics of the present invention are obtained by uniformly drilling a large number of holes on the entire surface of the core metal of the cutting wheel or near the outer periphery of the core metal so that the perforation rate is 10 to 50%. be. Here, the perforation rate is the ratio of the total area of the drilled holes to the area of the core metal. By making the cutting diamond grindstone in this way, a sufficient amount of grinding liquid is supplied to the entire surface to be ground during processing, thereby preventing deterioration of the abrasive grains and extending the life of the grindstone.

なお、穿孔率を10〜50%に限定した理由は。The reason why the perforation rate was limited to 10-50% is as follows.

10%未満であると、加工時の研削面への研削液の供給
が不光分で砥石の劣化が満足できる程防止できないため
であり、50%以上であると砥石の剛性が弱るためであ
る。
If it is less than 10%, deterioration of the grinding wheel cannot be satisfactorily prevented due to the opacity of the supply of grinding fluid to the grinding surface during machining, and if it is more than 50%, the rigidity of the grinding wheel is weakened.

以下本発明の詳細な説明する。外径10−2内径40+
+IIf+ +厚さ0.5mのダイヤモンド砥石に第2
図に示すごとく直径80〜10−の範囲内K O,4m
の間隔で直径[)、5mφの穴を穿孔(穿孔率は25%
に相当する。)した。この砥石を第3図に示す切断機に
取り付け、研削液を砥石側面より供給して、砥石回転数
600Or、p、m’、切削速度40″/minで切断
した。
The present invention will be explained in detail below. Outer diameter 10-2 Inner diameter 40+
+IIf+ +The second diamond grindstone with a thickness of 0.5m
As shown in the figure, within the range of 80 to 10-diameter K O, 4m
Drill holes with a diameter of [) and 5 mφ at intervals of (the drilling rate is 25%)
corresponds to )did. This grindstone was attached to the cutting machine shown in FIG. 3, and cutting was carried out at a grindstone rotation speed of 600 Or, p, m', and a cutting speed of 40''/min, with grinding fluid supplied from the side of the grindstone.

なお被加工物は長さ30咽×巾25順×厚さ10111
11の高密度Mn −Znフェライトで、厚さ方向に切
断した。
The workpiece is 30mm long x 25mm wide x 10111mm thick.
No. 11 high-density Mn-Zn ferrite was cut in the thickness direction.

被加工物の厚みが10mと厚い場合の切断においても、
研削面全面に渡って研削液が充分に供給されるため、研
削面の温度上昇が小さく、従来の砥石を使用した場合と
比較して寿命を55%向上することができた。
Even when cutting workpieces as thick as 10m,
Since the grinding fluid is sufficiently supplied over the entire surface of the grinding surface, the temperature rise on the grinding surface is small, and the life of the grinding wheel can be improved by 55% compared to when a conventional grindstone is used.

第4図は上記実施例において、芯金の穿孔を直径90〜
100簡の芯金の先端部に直径d;0.5朝の穴を穴間
距離t = 0.5叫の間隔で均一に穿孔した(穿孔率
11優に相当する。)砥石の例であるが、この砥石を使
用して上記実施例と同様な条件で切断した場合において
も、砥石の寿命が従来の砥石の寿催と比較して30係向
上できた。
Figure 4 shows the diameter of the perforation of the core metal in the above embodiment.
This is an example of a whetstone in which holes with a diameter of d: 0.5 mm are uniformly drilled at the tip of a 100-piece core metal at intervals of t = 0.5 mm (corresponding to a drilling rate of 11 or more). However, even when this grindstone was used for cutting under the same conditions as in the above embodiment, the life of the grindstone was improved by 30 times compared to the life of the conventional grindstone.

以上詳述したように本発明によれば著しく砥石の寿命を
向上できる効果がある。
As detailed above, the present invention has the effect of significantly improving the life of the grindstone.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の切断磁石、第2図は本発明による切断砥
石、第3図は加工図、第4図は本発明の実施例を示す図
である。 1:切断砥石、2:i孔、3:主軸、4:研削液ノズル
、5:被加工物 第 1 口 第2 第30 第4−口 ν
FIG. 1 shows a conventional cutting magnet, FIG. 2 shows a cutting grindstone according to the present invention, FIG. 3 shows a processed diagram, and FIG. 4 shows an embodiment of the present invention. 1: Cutting wheel, 2: i-hole, 3: main shaft, 4: grinding fluid nozzle, 5: workpiece 1st mouth 2nd 30th 4th mouth ν

Claims (1)

【特許請求の範囲】[Claims] 厚さ0.5m以下のダイヤモンド砥石πおいて、前記砥
石の芯金の全面または芯金の外周部の近傍圧、穿孔率で
10〜50%になるように多数の穴を穿孔したことを特
徴とする切断砥石。−
A diamond grinding wheel π with a thickness of 0.5 m or less is characterized in that a large number of holes are bored so that the pressure near the entire surface of the core metal of the grinding wheel or the outer periphery of the core metal and the perforation rate are 10 to 50%. Cutting wheel. −
JP3693784A 1984-02-28 1984-02-28 Cutting grind stone Pending JPS60180775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3693784A JPS60180775A (en) 1984-02-28 1984-02-28 Cutting grind stone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3693784A JPS60180775A (en) 1984-02-28 1984-02-28 Cutting grind stone

Publications (1)

Publication Number Publication Date
JPS60180775A true JPS60180775A (en) 1985-09-14

Family

ID=12483665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3693784A Pending JPS60180775A (en) 1984-02-28 1984-02-28 Cutting grind stone

Country Status (1)

Country Link
JP (1) JPS60180775A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62110863U (en) * 1985-12-27 1987-07-15
US4860722A (en) * 1985-12-13 1989-08-29 Hs Veglio S.R.L. Diamond segments and inserts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4860722A (en) * 1985-12-13 1989-08-29 Hs Veglio S.R.L. Diamond segments and inserts
JPS62110863U (en) * 1985-12-27 1987-07-15

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