JPH0332441U - - Google Patents

Info

Publication number
JPH0332441U
JPH0332441U JP9352089U JP9352089U JPH0332441U JP H0332441 U JPH0332441 U JP H0332441U JP 9352089 U JP9352089 U JP 9352089U JP 9352089 U JP9352089 U JP 9352089U JP H0332441 U JPH0332441 U JP H0332441U
Authority
JP
Japan
Prior art keywords
lead
integrated circuit
semiconductor integrated
pins
circuit element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9352089U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9352089U priority Critical patent/JPH0332441U/ja
Publication of JPH0332441U publication Critical patent/JPH0332441U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の斜視図、第2図a
,bは第1図のリードフレームの製造方法の一例
を説明する斜視図、第3図は従来のリードフレー
ムの一例の斜視図である。 1……アイランド、2……つりピン、3……リ
ードピン、4……枠、5……ステツチ、6………
モールド樹脂。
Figure 1 is a perspective view of one embodiment of the present invention, Figure 2 a
, b are perspective views illustrating an example of a method for manufacturing the lead frame shown in FIG. 1, and FIG. 3 is a perspective view of an example of a conventional lead frame. 1...Island, 2...Hanging pin, 3...Lead pin, 4...Frame, 5...Stitch, 6...
mold resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体集積回路素子を固着するアイランドと、
前記半導体集積回路素子に電位を供給する複数個
のリードピンとを有する樹脂封止型半導体集積回
路装置のリードフレームにおいて、複数の前記リ
ードピンのうちの少くとも1つのリードピンが少
くとも1つの他のリードピンと互いに間隔をおい
て立体交差していることを特徴とするリードフレ
ーム。
An island to which a semiconductor integrated circuit element is fixed;
In the lead frame of a resin-sealed semiconductor integrated circuit device having a plurality of lead pins that supply potential to the semiconductor integrated circuit element, at least one lead pin among the plurality of lead pins is connected to at least one other lead. A lead frame characterized by three-dimensional intersections with pins at intervals.
JP9352089U 1989-08-08 1989-08-08 Pending JPH0332441U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9352089U JPH0332441U (en) 1989-08-08 1989-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9352089U JPH0332441U (en) 1989-08-08 1989-08-08

Publications (1)

Publication Number Publication Date
JPH0332441U true JPH0332441U (en) 1991-03-29

Family

ID=31642897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9352089U Pending JPH0332441U (en) 1989-08-08 1989-08-08

Country Status (1)

Country Link
JP (1) JPH0332441U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200470216Y1 (en) * 2012-11-09 2013-12-06 이진우 Roll of toilet paper for the case structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200470216Y1 (en) * 2012-11-09 2013-12-06 이진우 Roll of toilet paper for the case structure

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