JPS6322006U - - Google Patents
Info
- Publication number
- JPS6322006U JPS6322006U JP1986114700U JP11470086U JPS6322006U JP S6322006 U JPS6322006 U JP S6322006U JP 1986114700 U JP1986114700 U JP 1986114700U JP 11470086 U JP11470086 U JP 11470086U JP S6322006 U JPS6322006 U JP S6322006U
- Authority
- JP
- Japan
- Prior art keywords
- stop lamp
- organic polymer
- polymer resin
- emitting diode
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000620 organic polymer Polymers 0.000 claims description 5
- 239000002952 polymeric resin Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Description
第１図は本考案の自動車用ストツプランプの一
実施例の平面図、第２図は透光性の有機ポリマー
樹脂モールド発光ダイオードの断面図、第３図は
第１図に示したストツプランプに赤色拡散カバー
を取付けた時の縦断面図、第４図は第３図に示し
たストツプランプを自動車のハイマウント・スト
ツプランプのケーシングに組み込んだ時の斜視図
である。
１：基板、２：有機ポリマー樹脂モールド発光
ダイオード、３：赤色発光ダイオードチツプ、４
：ステム電極、５ａ：正電極リード端子、５ｂ：
負電極リード端子、７：透光性有機ポリマー樹脂
モールド、８：赤色拡散カバー、９……ケーシン
グ。
Figure 1 is a plan view of one embodiment of the automotive stop lamp of the present invention, Figure 2 is a cross-sectional view of a light-transmitting light-emitting diode molded with organic polymer resin, and Figure 3 is a red color diffused into the stop lamp shown in Figure 1. FIG. 4 is a longitudinal sectional view when the cover is attached, and FIG. 4 is a perspective view when the stop lamp shown in FIG. 3 is assembled into the casing of a high-mount stop lamp for an automobile. 1: Substrate, 2: Organic polymer resin molded light emitting diode, 3: Red light emitting diode chip, 4
: Stem electrode, 5a: Positive electrode lead terminal, 5b:
Negative electrode lead terminal, 7: Transparent organic polymer resin mold, 8: Red diffusion cover, 9...Casing.
Claims (1)
の有機ポリマー樹脂モールド発光ダイオードを配
してなることを特徴とする自動車用ストツプラン
プ。 (2) 有機ポリマー樹脂モールドの頂部が凸レン
ズを形成していることを特徴とする実用新案登録
請求の範囲第(1)項記載の自動車用ストツプラン
プ。[Claims for Utility Model Registration] (1) An automotive stop lamp characterized in that a light-transmitting organic polymer resin molded light emitting diode is arranged on a conductive pattern formed on a substrate. (2) The stop lamp for an automobile according to claim (1), wherein the top of the organic polymer resin mold forms a convex lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986114700U JPS6322006U (en) | 1986-07-26 | 1986-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986114700U JPS6322006U (en) | 1986-07-26 | 1986-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322006U true JPS6322006U (en) | 1988-02-13 |
Family
ID=30997675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986114700U Pending JPS6322006U (en) | 1986-07-26 | 1986-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322006U (en) |
-
1986
- 1986-07-26 JP JP1986114700U patent/JPS6322006U/ja active Pending