JPS6448060U - - Google Patents
Info
- Publication number
- JPS6448060U JPS6448060U JP1987143406U JP14340687U JPS6448060U JP S6448060 U JPS6448060 U JP S6448060U JP 1987143406 U JP1987143406 U JP 1987143406U JP 14340687 U JP14340687 U JP 14340687U JP S6448060 U JPS6448060 U JP S6448060U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- lamp body
- lamp
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Description
第１図ａは本考案の発光ダイオードランプの一
実施例を示す平面図、第１図ｂはその一部破断正
面図、第１図ｃはその側面図、第２図はその一部
破断分解正面図、第３図はランプ本体の製造法を
示す断面図、第４図はランプ本体の正面図、第５
図ａは従来例の発光ダイオードランプの平面図、
第５図ｂはその一部破断正面図である。
１０……ランプ本体、１１……透光性部材、１
３……リードフレーム、１３ａ……端子部、１４
……発光ダイオード素子、１６……リード線、２
０……口金、２１……端子口、２２……側部端子
口、３０……連結部材。
Fig. 1a is a plan view showing an embodiment of the light emitting diode lamp of the present invention, Fig. 1b is a partially cutaway front view thereof, Fig. 1c is a side view thereof, and Fig. 2 is a partially cutaway exploded view. 3 is a sectional view showing the method of manufacturing the lamp body, 4 is a front view of the lamp body, and 5 is a front view of the lamp body.
Figure a is a plan view of a conventional light emitting diode lamp.
FIG. 5b is a partially cutaway front view thereof. 10...Lamp body, 11...Translucent member, 1
3...Lead frame, 13a...Terminal part, 14
...Light emitting diode element, 16...Lead wire, 2
0...Cap, 21...Terminal port, 22...Side terminal port, 30...Connecting member.
Claims (1)
子が装着されたリードフレームが埋設されたラン
プ本体と、該ランプ本体に装着され、前記リード
フレームの端子部に電気接続される端子口を有す
る口金と、を具備する発光ダイオードランプ。 ２ 前記透光性部材内には、前記発光ダイオード
素子からの光を収束して反射する反射ケースが埋
設されている実用新案登録請求の範囲第１項に記
載の発光ダイオードランプ。[Claims for Utility Model Registration] 1. A lamp body in which a lead frame on which a light emitting diode element is mounted is embedded in a translucent resin member, and a lamp body mounted on the lamp body and connected to a terminal portion of the lead frame. A light emitting diode lamp, comprising: a base having a terminal opening for electrical connection; 2. The light-emitting diode lamp according to claim 1, wherein a reflective case that converges and reflects light from the light-emitting diode element is embedded in the light-transmitting member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143406U JPS6448060U (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143406U JPS6448060U (en) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448060U true JPS6448060U (en) | 1989-03-24 |
Family
ID=31410202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987143406U Pending JPS6448060U (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448060U (en) |
-
1987
- 1987-09-18 JP JP1987143406U patent/JPS6448060U/ja active Pending