JPS6188107U - - Google Patents
Info
- Publication number
- JPS6188107U JPS6188107U JP17412084U JP17412084U JPS6188107U JP S6188107 U JPS6188107 U JP S6188107U JP 17412084 U JP17412084 U JP 17412084U JP 17412084 U JP17412084 U JP 17412084U JP S6188107 U JPS6188107 U JP S6188107U
- Authority
- JP
- Japan
- Prior art keywords
- light
- optical fiber
- semiconductor chip
- introduction path
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013307 optical fiber Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000012778 molding material Substances 0.000 claims description 2
- 238000010137 moulding (plastic) Methods 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、この考案のパツケージの一例をプラ
スチツクモールド材を半割り状態にして示す斜視
図、第２図はその断面図、第３図及び第４図は導
入路の変形例を拡大して示す断面図、第５図は他
の実施例の斜視図である。
１…メタルフレーム、２…半導体チツプ、３…
ボンデイングワイヤ、４…プラスチツクモールド
材、５…光フアイバ導入路、６…逆止用突起。
Fig. 1 is a perspective view showing an example of the package of this invention with the plastic molded material cut in half, Fig. 2 is a sectional view thereof, and Figs. 3 and 4 are enlarged views of modified examples of the introduction path. The sectional view shown in FIG. 5 is a perspective view of another embodiment. 1...metal frame, 2...semiconductor chip, 3...
Bonding wire, 4... Plastic molding material, 5... Optical fiber introduction path, 6... Back check protrusion.
Claims (1)
のボンデイングワイヤ及びそれ等を固定封止する
プラスチツクモールド材から成るＩＣパツケージ
において、上記半導体チツプが発光又は受光部と
光透過性の表面保護膜とを有し、一方上記モール
ド材が半導体チツプの発光又は受光部と対応した
光フアイバ導入路を有することを特徴とするＩＣ
パツケージ。 (2) 上記光フアイバ導入路が奥所に向かつて内
径を小さくしたテーパ穴であることを特徴とする
実用新案登録請求の範囲第(1)項記載のＩＣパツ
ケージ。 (3) 上記光フアイバ導入路の内面に光フアイバ
の外被に喰込ませる逆止用の突起を設けたことを
特徴とする実用新案登録請求の範囲第(1)項又は
第(2)項記載のＩＣパツケージ。[Claims for Utility Model Registration] (1) In an IC package consisting of a semiconductor chip, a metal frame, bonding wires for both, and a plastic molding material for fixing and sealing them, the semiconductor chip has a light-emitting or light-receiving part and a light-transmitting part. an optical fiber introduction path corresponding to a light emitting or light receiving part of a semiconductor chip;
Packaging. (2) The IC package according to claim 1, wherein the optical fiber introduction path is a tapered hole whose inner diameter decreases toward the back. (3) Claims (1) or (2) for registering a utility model, characterized in that the inner surface of the optical fiber introduction path is provided with a non-return protrusion that is cut into the outer sheath of the optical fiber. IC package as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17412084U JPS6188107U (en) | 1984-11-15 | 1984-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17412084U JPS6188107U (en) | 1984-11-15 | 1984-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6188107U true JPS6188107U (en) | 1986-06-09 |
Family
ID=30731749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17412084U Pending JPS6188107U (en) | 1984-11-15 | 1984-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6188107U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6319878A (en) * | 1986-07-12 | 1988-01-27 | Canon Inc | Semiconductor photodetector |
| JPH02278212A (en) * | 1989-04-20 | 1990-11-14 | Sumitomo Electric Ind Ltd | Multifiber type optical module and its manufacture |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS562263B2 (en) * | 1977-10-13 | 1981-01-19 | ||
| JPS5691481A (en) * | 1979-12-25 | 1981-07-24 | Fujitsu Ltd | Photoelectric convertor device and light fiber combining system |
-
1984
- 1984-11-15 JP JP17412084U patent/JPS6188107U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS562263B2 (en) * | 1977-10-13 | 1981-01-19 | ||
| JPS5691481A (en) * | 1979-12-25 | 1981-07-24 | Fujitsu Ltd | Photoelectric convertor device and light fiber combining system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6319878A (en) * | 1986-07-12 | 1988-01-27 | Canon Inc | Semiconductor photodetector |
| JPH02278212A (en) * | 1989-04-20 | 1990-11-14 | Sumitomo Electric Ind Ltd | Multifiber type optical module and its manufacture |
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