JPH03102743U - - Google Patents

Info

Publication number
JPH03102743U
JPH03102743U JP1102590U JP1102590U JPH03102743U JP H03102743 U JPH03102743 U JP H03102743U JP 1102590 U JP1102590 U JP 1102590U JP 1102590 U JP1102590 U JP 1102590U JP H03102743 U JPH03102743 U JP H03102743U
Authority
JP
Japan
Prior art keywords
light
receiving element
photoelectric conversion
emitting
protective resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1102590U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1102590U priority Critical patent/JPH03102743U/ja
Publication of JPH03102743U publication Critical patent/JPH03102743U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の光電変換素子の基本的構成の
一例を示す正面図、第２図は第１図のＡ−Ａ′線
矢視断面図、第３図はそのパツケージ内部の回路
構成例を示す正面図、第４図は本考案の光電変換
素子の他の構成例を示す正面図、第５図は第４図
のＢ−Ｂ′線矢視断面図、第６図は従来の光電変
換素子の構成を示す正面図である。 １１……リードフレーム、１２……発光または
受光素子、１３……周辺電気回路素子、１４……
透明モールドパツケージ、１５……ボンデイング
ワイヤー、１６……低線膨張モールド体。 Figure 1 is a front view showing an example of the basic configuration of the photoelectric conversion element of the present invention, Figure 2 is a sectional view taken along the line A-A' in Figure 1, and Figure 3 is an example of the circuit configuration inside the package. 4 is a front view showing another configuration example of the photoelectric conversion element of the present invention, FIG. 5 is a sectional view taken along the line B-B' in FIG. 4, and FIG. FIG. 3 is a front view showing the configuration of a conversion element. 11... Lead frame, 12... Light emitting or light receiving element, 13... Peripheral electric circuit element, 14...
Transparent mold package, 15...Bonding wire, 16...Low linear expansion mold body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属製のリードフレーム上に少なくとも発光ま
たは受光素子およびＩＣ素子が一体または別体と
してマウントされており、外周を保護用樹脂でパ
ツケージングされた光電変換素子であり、前記保
護用樹脂は少なくとも発光または受光素子を含む
部分のみが透明材料で形成されており、その他の
部分はより低い線膨張率を有する材料からなるこ
とを特徴とする光電変換素子。 It is a photoelectric conversion element in which at least a light-emitting or light-receiving element and an IC element are mounted integrally or separately on a metal lead frame, and the outer periphery is packaged with a protective resin, and the protective resin is at least a light-emitting or light-receiving element and an IC element. A photoelectric conversion element characterized in that only a portion including a light-receiving element is made of a transparent material, and the other portions are made of a material having a lower coefficient of linear expansion.
JP1102590U 1990-02-08 1990-02-08 Pending JPH03102743U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1102590U JPH03102743U (en) 1990-02-08 1990-02-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1102590U JPH03102743U (en) 1990-02-08 1990-02-08

Publications (1)

Publication Number Publication Date
JPH03102743U true JPH03102743U (en) 1991-10-25

Family

ID=31514569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1102590U Pending JPH03102743U (en) 1990-02-08 1990-02-08

Country Status (1)

Country Link
JP (1) JPH03102743U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159296A (en) * 2003-11-06 2005-06-16 Sharp Corp Package structure of optodevice

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159296A (en) * 2003-11-06 2005-06-16 Sharp Corp Package structure of optodevice

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