JPH03128955U - - Google Patents
Info
- Publication number
- JPH03128955U JPH03128955U JP2854190U JP2854190U JPH03128955U JP H03128955 U JPH03128955 U JP H03128955U JP 2854190 U JP2854190 U JP 2854190U JP 2854190 U JP2854190 U JP 2854190U JP H03128955 U JPH03128955 U JP H03128955U
- Authority
- JP
- Japan
- Prior art keywords
- light
- terminal
- lead frame
- chips
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
Description
第１図乃至第４図は本考案の一実施例を示すも
ので、第１図は要部斜視図、第２図は同上の断面
図、第３図ａは入力側リードフレームの平面図、
第３図ｂは出力側リードフレームの平面図、第４
図は入出力側リードフレームを対向配置した状態
を示す平面図、第５図乃至第８図は従来例を示す
もので、第５図ａは入力側リードフレームの平面
図、第５図ｂは出力側リードフレームの平面図、
第６図は入出力側リードフレームを対向配置した
状態を示す平面図、第７図は要部斜視図、第８図
は同上の断面図である。
１……発光側チツプ、２……受光側チツプ、３
……透光性樹脂、４……非透光性樹脂、５……界
面、６……ワイヤ、Ａ……入力（発光）側リード
フレーム、Ａ１……第１端子、Ａ２……第２端子
、Ａ３……第３端子、Ｂ……出力（受光）側リー
ドフレーム、Ｇ……空隙。
1 to 4 show an embodiment of the present invention, in which FIG. 1 is a perspective view of the main part, FIG. 2 is a sectional view of the same, FIG. 3a is a plan view of the input side lead frame,
Figure 3b is a plan view of the output side lead frame;
The figure is a plan view showing a state in which the input and output side lead frames are arranged opposite each other, and Figs. 5 to 8 show conventional examples. Fig. 5 a is a plan view of the input side lead frame, and Fig. 5 b is a plan view of the input side lead frame. Plan view of output side lead frame,
FIG. 6 is a plan view showing a state in which the input/output side lead frames are arranged facing each other, FIG. 7 is a perspective view of a main part, and FIG. 8 is a sectional view of the same. 1... Light emitting side chip, 2... Light receiving side chip, 3
...Translucent resin, 4...Non-transparent resin, 5...Interface, 6...Wire, A...Input (light emitting) side lead frame, A1 ...First terminal, A2 ...First terminal 2 terminal, A 3 ...Third terminal, B...Output (light receiving) side lead frame, G...Gap.
Claims (1)
別体のリードフレームにダイボンドされるともに
、前記両チツプが前記リードフレームの厚み方向
に対向配置され、前記受光側チツプ間のワイヤ配
線が、前記両チツプ間に充填された透光性樹脂と
その外部を覆う非透光性樹脂との界面を横切る構
成の光結合デバイスにおいて、前記発光側のリー
ドフレームを、発光側チツプがダイボンドされる
第１の端子と、発光側チツプとワイヤ配線される
第２の端子と、前記第１端子に対して前記第２端
子と左右対称に形成された第３の端子とで構成す
るとともに、第２端子及び第３端子の両先端間の
空隙が第１端子の延長線上に位置するように配置
したことを特徴とする光結合デバイス。 The light-emitting side chip and the light-receiving side chip are die-bonded to separate lead frames, and the chips are arranged opposite to each other in the thickness direction of the lead frame, and the wire wiring between the light-receiving side chips is In an optical coupling device configured to cross the interface between a light-transmitting resin filled between chips and a non-light-transmitting resin covering the outside thereof, the light-emitting side lead frame is connected to the first lead frame to which the light-emitting side chip is die-bonded. A terminal, a second terminal wired to the light emitting chip, and a third terminal formed laterally symmetrically with the second terminal with respect to the first terminal. An optical coupling device characterized in that the three terminals are arranged so that a gap between both ends thereof is located on an extension line of the first terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2854190U JPH03128955U (en) | 1990-03-20 | 1990-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2854190U JPH03128955U (en) | 1990-03-20 | 1990-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03128955U true JPH03128955U (en) | 1991-12-25 |
Family
ID=31531338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2854190U Pending JPH03128955U (en) | 1990-03-20 | 1990-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03128955U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009054731A (en) * | 2007-08-24 | 2009-03-12 | Nakamura Mfg Co Ltd | Metal based printed-circuit board with heat discharge section, and manufacturing method for the same |
-
1990
- 1990-03-20 JP JP2854190U patent/JPH03128955U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009054731A (en) * | 2007-08-24 | 2009-03-12 | Nakamura Mfg Co Ltd | Metal based printed-circuit board with heat discharge section, and manufacturing method for the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH03128955U (en) | ||
| JPH0651001Y2 (en) | Optical coupling element | |
| JPH0428687U (en) | ||
| JPS6045453U (en) | Light emitting diode for display | |
| JPH0233459U (en) | ||
| JPS6214754U (en) | ||
| JPH01169056U (en) | ||
| JPH02118958U (en) | ||
| JPS6183062U (en) | ||
| JPS60153557U (en) | optical coupling device | |
| JPS6448057U (en) | ||
| JPH0298662U (en) | ||
| JPH02136343U (en) | ||
| JPS6210454U (en) | ||
| JPS6049654U (en) | Two-color light emitting semiconductor device | |
| JPS63197364U (en) | ||
| JPS6291459U (en) | ||
| JPS59111378A (en) | Photo coupler | |
| JPH04132273A (en) | Semiconductor optical coupler | |
| JPH0350351U (en) | ||
| JPS6244452U (en) | ||
| JPS6179551U (en) | ||
| JPS6176978U (en) | ||
| JPS59125850U (en) | AC photocoupler | |
| JPS6073263U (en) | optical coupler |