JPH0350351U - - Google Patents
Info
- Publication number
- JPH0350351U JPH0350351U JP11122689U JP11122689U JPH0350351U JP H0350351 U JPH0350351 U JP H0350351U JP 11122689 U JP11122689 U JP 11122689U JP 11122689 U JP11122689 U JP 11122689U JP H0350351 U JPH0350351 U JP H0350351U
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- semiconductor device
- optically coupled
- coupled semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000008188 pellet Substances 0.000 description 2
Description
第１図は本考案の一実施例の光結合半導体装置
の縦断面図、第２図は従来の光結合半導体装置の
一例の縦断面図である。
１……受光素子ペレツト、２……リードフレー
ムアイランド部、３……リードフレームボンデイ
ングワイヤー接続部、４……ボンデイングワイヤ
ー、５……リードフレーム端子部、６……発光ダ
イオードペレツト、７……透明樹脂、８……反射
層。
FIG. 1 is a longitudinal sectional view of an optically coupled semiconductor device according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of an example of a conventional optically coupled semiconductor device. DESCRIPTION OF SYMBOLS 1... Light receiving element pellet, 2... Lead frame island part, 3... Lead frame bonding wire connection part, 4... Bonding wire, 5... Lead frame terminal part, 6... Light emitting diode pellet, 7... Transparent resin, 8... Reflective layer.
Claims (1)
より発光させ、この光を受光素子に伝達し、発生
する信号を外部に出力として取り出す光結合半導
体装置において、受光素子を保持固定し、かつ、
外部端子とするリードフレームをモールド樹脂パ
ツケージ内で階段状に２段折り曲げ、中間の平坦
部に受光素子とのボンデイングワイヤーによる接
続を施したことを特徴とする光結合半導体装置の
組み立て構造。 In an optically coupled semiconductor device that causes a light-emitting diode in an input section to emit light in response to an input signal current, transmits this light to a light-receiving element, and takes out the generated signal as an output to the outside, the light-receiving element is held and fixed, and
An assembly structure for an optically coupled semiconductor device, characterized in that a lead frame serving as an external terminal is bent in two steps in a molded resin package, and a flat part in the middle is connected to a light receiving element using a bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11122689U JPH0350351U (en) | 1989-09-22 | 1989-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11122689U JPH0350351U (en) | 1989-09-22 | 1989-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350351U true JPH0350351U (en) | 1991-05-16 |
Family
ID=31659718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11122689U Pending JPH0350351U (en) | 1989-09-22 | 1989-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350351U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62247575A (en) * | 1986-04-18 | 1987-10-28 | Sharp Corp | Optical coupling element |
-
1989
- 1989-09-22 JP JP11122689U patent/JPH0350351U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62247575A (en) * | 1986-04-18 | 1987-10-28 | Sharp Corp | Optical coupling element |
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