JPS61104566U - - Google Patents
Info
- Publication number
- JPS61104566U JPS61104566U JP1984189886U JP18988684U JPS61104566U JP S61104566 U JPS61104566 U JP S61104566U JP 1984189886 U JP1984189886 U JP 1984189886U JP 18988684 U JP18988684 U JP 18988684U JP S61104566 U JPS61104566 U JP S61104566U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting part
- resistor
- bonding
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Audible And Visible Signals (AREA)
Description
第1図は本考案に係る発光ダイオードドツトア
レイの一実施例を示す斜視図、第2図は同実施例
の光量調整時の接続図、第3図は従来例を示す斜
視図である。
11……LEDチツプ、11A……発光部、1
1B……ボンデイングパツド、12……基板、1
3……抵抗体、13A〜13D……ボンデイング
ポスト、14及び15……ワイヤー、16……外
部接続端子。
FIG. 1 is a perspective view showing an embodiment of a light emitting diode dot array according to the present invention, FIG. 2 is a connection diagram for adjusting the light amount of the same embodiment, and FIG. 3 is a perspective view showing a conventional example. 11... LED chip, 11A... Light emitting part, 1
1B...Bonding pad, 12...Substrate, 1
3...Resistor, 13A to 13D...Bonding post, 14 and 15...Wire, 16...External connection terminal.
Claims (1)
ングされた発光ダイオードチツプの側方に、両端
及び中間にボンデイングポストを有する抵抗体を
発光部に対応して設け、この抵抗体を介して発光
部と基板上の外部接続端子を接続するとともに、
ボンデイングポスト間のワイヤーボンデイングに
よつて各発光部の発光光量を均一化するようにし
たことを特徴とする発光ダイオードドツトアレイ
。 A resistor having bonding posts at both ends and in the middle is provided on the side of a light emitting diode chip which has a predetermined arrangement of light emitting parts and is die-bonded to a substrate, corresponding to the light emitting part, and the light emitting part is connected through this resistor. and the external connection terminals on the board,
A light emitting diode dot array characterized in that the amount of light emitted from each light emitting part is made uniform by wire bonding between bonding posts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984189886U JPS61104566U (en) | 1984-12-14 | 1984-12-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984189886U JPS61104566U (en) | 1984-12-14 | 1984-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61104566U true JPS61104566U (en) | 1986-07-03 |
Family
ID=30747334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984189886U Pending JPS61104566U (en) | 1984-12-14 | 1984-12-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61104566U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03209781A (en) * | 1990-01-11 | 1991-09-12 | Rohm Co Ltd | Manufacture of light source for image sensor |
JPH04221838A (en) * | 1990-12-21 | 1992-08-12 | Rohm Co Ltd | Wire bonder |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117280A (en) * | 1982-12-24 | 1984-07-06 | Ricoh Co Ltd | Semiconductor light emitting device |
-
1984
- 1984-12-14 JP JP1984189886U patent/JPS61104566U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117280A (en) * | 1982-12-24 | 1984-07-06 | Ricoh Co Ltd | Semiconductor light emitting device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03209781A (en) * | 1990-01-11 | 1991-09-12 | Rohm Co Ltd | Manufacture of light source for image sensor |
JPH04221838A (en) * | 1990-12-21 | 1992-08-12 | Rohm Co Ltd | Wire bonder |
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