JPS60144258U - optical semiconductor device - Google Patents
optical semiconductor deviceInfo
- Publication number
- JPS60144258U JPS60144258U JP1984031305U JP3130584U JPS60144258U JP S60144258 U JPS60144258 U JP S60144258U JP 1984031305 U JP1984031305 U JP 1984031305U JP 3130584 U JP3130584 U JP 3130584U JP S60144258 U JPS60144258 U JP S60144258U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- optical semiconductor
- light emitting
- emitting chip
- infrared light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａｔ赤外発光半導体素子の断面図、第２図、
は赤外発光半導体素子の等価回路図、第３図はこの考案
の１実施例の光半導体素子の断面図、第４図は１実施例
の光半導体素子の等価回路図、第５図はこの考案の別の
１実施例の光半導体素子の断面−である。
１．２４・・・・・・赤外発光チップ、２．２２−・間
カソード用リード、２ａ＊ ２３ａ・・・・−ノード
頂部の椀、５・・・・・・モールドｌＩＭｆｉＦｉ、１
１． ２１・・・・・・アノード用リード、１２．２５
・・・・・・可視光発光チップ、１３．２６．２７・・
・・・・ボンディングワイヤ、２３ ゛・・・・・・
リード。Figure 1 is a cross-sectional view of an infrared light emitting semiconductor device, Figure 2 is
is an equivalent circuit diagram of an infrared light-emitting semiconductor device, FIG. 3 is a sectional view of an optical semiconductor device according to one embodiment of this invention, FIG. 4 is an equivalent circuit diagram of an optical semiconductor device according to one embodiment of this invention, and FIG. It is a cross section of an optical semiconductor device of another example of the invention. 1.24...Infrared light emitting chip, 2.22--Cathode lead, 2a* 23a...-Node top bowl, 5...Mold lIMfiFi, 1
1. 21...Anode lead, 12.25
...Visible light emitting chip, 13.26.27...
・・・・Bonding wire, 23 ゛・・・・・・
Lead.
Claims (1)
チップを前記チップと共通の外囲器内に並設したことを
特徴とする光半導体素子。1. An optical semiconductor device characterized in that a visible light emitting chip for monitoring energization of an infrared light emitting chip is arranged in parallel with the infrared light emitting chip in a common envelope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984031305U JPS60144258U (en) | 1984-03-06 | 1984-03-06 | optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984031305U JPS60144258U (en) | 1984-03-06 | 1984-03-06 | optical semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60144258U true JPS60144258U (en) | 1985-09-25 |
Family
ID=30531792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984031305U Pending JPS60144258U (en) | 1984-03-06 | 1984-03-06 | optical semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60144258U (en) |
-
1984
- 1984-03-06 JP JP1984031305U patent/JPS60144258U/en active Pending
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