JPS61153356U - - Google Patents

Info

Publication number
JPS61153356U
JPS61153356U JP1985036315U JP3631585U JPS61153356U JP S61153356 U JPS61153356 U JP S61153356U JP 1985036315 U JP1985036315 U JP 1985036315U JP 3631585 U JP3631585 U JP 3631585U JP S61153356 U JPS61153356 U JP S61153356U
Authority
JP
Japan
Prior art keywords
drive circuit
circuit section
chip carrier
light emitting
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985036315U
Other languages
Japanese (ja)
Other versions
JPH0412696Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985036315U priority Critical patent/JPH0412696Y2/ja
Publication of JPS61153356U publication Critical patent/JPS61153356U/ja
Application granted granted Critical
Publication of JPH0412696Y2 publication Critical patent/JPH0412696Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Optical Communication System (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａは本考案の一実施例を示す光送信モジ
ユールの平面図、ｂはその断面図、第２図は従来
の光送信モジユールを示す断面図である。 図において、１０１……チツプキヤリア部、１
０２，２０２……発光素子、１０３……集光レン
ズ、１０４１，１０４２……ネジ、１０５，２０
５……セラミツク基板、１０６，２０６……発属
キヤリア、１０７……駆動回路部、１０８，２０
８……トランジスタ、１０９１〜１０９３，２０
９１〜２０９３……金ランド、１１０，２１０…
…ボンデイングワイヤ、１１１，２１１……モジ
ユールケース、２１２……セラミツク基板、１１
３，２１３……光フアイバコネクタ、２１４……
カバー、３０２……発光素子、３０７……駆動回
路部、３１０１，３１０２……ボンデイングワイ
ヤ、３１１……モジユールケース、３１５……発
光モジユール、３１６……リード線である。 FIG. 1A is a plan view of an optical transmission module showing an embodiment of the present invention, FIG. 1B is a sectional view thereof, and FIG. 2 is a sectional view showing a conventional optical transmission module. In the figure, 101...Chip carrier section, 1
02,202...Light emitting element, 103...Condensing lens, 104 1,104 2 ...Screw, 105,20
5... Ceramic substrate, 106, 206... Originating carrier, 107... Drive circuit section, 108, 20
8...Transistor, 109 1 to 109 3 , 20
9 1 ~ 209 3 ... Gold Land, 110,210...
... Bonding wire, 111, 211 ... Module case, 212 ... Ceramic substrate, 11
3,213...Optical fiber connector, 214...
Cover, 302... Light emitting element, 307... Drive circuit section, 310 1 , 310 2 ... Bonding wire, 311... Module case, 315... Light emitting module, 316... Lead wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電気誘電体基板上に搭載した能動素子および受
動素子からなる駆動回路部と、さらに金属キヤリ
ア上に電気信号を光信号に変換する発光素子を搭
載したチツプキヤリア部とから成り、前記駆動回
路部と前記チツプキヤリア部をボンデイングワイ
ヤで結合すると共に、両者を同一のモジユールケ
ース内に収容することを特徴とする光送信モジユ
ール。 It consists of a drive circuit section consisting of an active element and a passive element mounted on an electric dielectric substrate, and a chip carrier section further mounted with a light emitting element for converting an electric signal into an optical signal on a metal carrier, and the drive circuit section and the An optical transmission module characterized in that a chip carrier part is bonded with a bonding wire and both are housed in the same module case.
JP1985036315U 1985-03-14 1985-03-14 Expired JPH0412696Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985036315U JPH0412696Y2 (en) 1985-03-14 1985-03-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985036315U JPH0412696Y2 (en) 1985-03-14 1985-03-14

Publications (2)

Publication Number Publication Date
JPS61153356U true JPS61153356U (en) 1986-09-22
JPH0412696Y2 JPH0412696Y2 (en) 1992-03-26

Family

ID=30541375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985036315U Expired JPH0412696Y2 (en) 1985-03-14 1985-03-14

Country Status (1)

Country Link
JP (1) JPH0412696Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03140824A (en) * 1989-10-26 1991-06-14 Nec Corp Optical receiving module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916435A (en) * 1982-07-20 1984-01-27 Hitachi Ltd Optical transmission module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916435A (en) * 1982-07-20 1984-01-27 Hitachi Ltd Optical transmission module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03140824A (en) * 1989-10-26 1991-06-14 Nec Corp Optical receiving module

Also Published As

Publication number Publication date
JPH0412696Y2 (en) 1992-03-26

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