JPS61199059U - - Google Patents

Info

Publication number
JPS61199059U
JPS61199059U JP1985082044U JP8204485U JPS61199059U JP S61199059 U JPS61199059 U JP S61199059U JP 1985082044 U JP1985082044 U JP 1985082044U JP 8204485 U JP8204485 U JP 8204485U JP S61199059 U JPS61199059 U JP S61199059U
Authority
JP
Japan
Prior art keywords
photoelectric conversion
glass
image sensor
mounting structure
conversion element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985082044U
Other languages
Japanese (ja)
Other versions
JPH0749806Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985082044U priority Critical patent/JPH0749806Y2/en
Publication of JPS61199059U publication Critical patent/JPS61199059U/ja
Application granted granted Critical
Publication of JPH0749806Y2 publication Critical patent/JPH0749806Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案の密着型イメージセンサーの
実装構造の例を示す要部の断面図。第２図、第３
図、第４図は、従来の密着型イメージセンサーの
実装構造を示す要部の断面図。 １……光電変換素子、２，２′……ガラス基板
、３……入射光、４……ボンデイングワイヤー、
５……封止剤、６……光電変換素子駆動用集積回
路、７……光学接着剤、８……配線パターン電極
、９……セラミツク基板、１０……ガラスマスク
、１１……スペーサー、１２……光電変換材料。 FIG. 1 is a sectional view of essential parts showing an example of a mounting structure of a contact type image sensor of the present invention. Figures 2 and 3
4 are sectional views of main parts showing the mounting structure of a conventional contact type image sensor. 1... Photoelectric conversion element, 2, 2'... Glass substrate, 3... Incident light, 4... Bonding wire,
5... Encapsulant, 6... Integrated circuit for driving photoelectric conversion element, 7... Optical adhesive, 8... Wiring pattern electrode, 9... Ceramic substrate, 10... Glass mask, 11... Spacer, 12 ...Photoelectric conversion material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 光電変換素子をガラス基板上へ、屈折率がガラ
スに対し、０．９〜１．１倍の屈折率を有する透
明な接着剤によつて接着することを特徴とする密
着型イメージセンサーの実装構造。 A mounting structure for a contact image sensor, characterized in that a photoelectric conversion element is bonded onto a glass substrate using a transparent adhesive having a refractive index 0.9 to 1.1 times that of glass. .
JP1985082044U 1985-05-31 1985-05-31 Image sensor mounting structure Expired - Lifetime JPH0749806Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985082044U JPH0749806Y2 (en) 1985-05-31 1985-05-31 Image sensor mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985082044U JPH0749806Y2 (en) 1985-05-31 1985-05-31 Image sensor mounting structure

Publications (2)

Publication Number Publication Date
JPS61199059U true JPS61199059U (en) 1986-12-12
JPH0749806Y2 JPH0749806Y2 (en) 1995-11-13

Family

ID=30629404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985082044U Expired - Lifetime JPH0749806Y2 (en) 1985-05-31 1985-05-31 Image sensor mounting structure

Country Status (1)

Country Link
JP (1) JPH0749806Y2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS637072A (en) * 1986-06-27 1988-01-12 Matsushita Electric Ind Co Ltd Contact type photoelectric transfer unit
JP2011077553A (en) * 2011-01-05 2011-04-14 Sony Corp Semiconductor image sensor module, and method of manufacturing semiconductor image sensor module
JP2011077554A (en) * 2011-01-05 2011-04-14 Sony Corp Semiconductor image sensor module, and method of manufacturing semiconductor image sensor module
JP2011077555A (en) * 2011-01-05 2011-04-14 Sony Corp Semiconductor image sensor module, and method of manufacturing semiconductor image sensor module
JP4720120B2 (en) * 2004-07-14 2011-07-13 ソニー株式会社 Semiconductor image sensor module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948954A (en) * 1982-09-13 1984-03-21 Kyocera Corp Contact type reader
JPS6037194A (en) * 1983-08-09 1985-02-26 株式会社東芝 Hybrid integrated circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948954A (en) * 1982-09-13 1984-03-21 Kyocera Corp Contact type reader
JPS6037194A (en) * 1983-08-09 1985-02-26 株式会社東芝 Hybrid integrated circuit device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS637072A (en) * 1986-06-27 1988-01-12 Matsushita Electric Ind Co Ltd Contact type photoelectric transfer unit
JP4720120B2 (en) * 2004-07-14 2011-07-13 ソニー株式会社 Semiconductor image sensor module
JP2011077553A (en) * 2011-01-05 2011-04-14 Sony Corp Semiconductor image sensor module, and method of manufacturing semiconductor image sensor module
JP2011077554A (en) * 2011-01-05 2011-04-14 Sony Corp Semiconductor image sensor module, and method of manufacturing semiconductor image sensor module
JP2011077555A (en) * 2011-01-05 2011-04-14 Sony Corp Semiconductor image sensor module, and method of manufacturing semiconductor image sensor module

Also Published As

Publication number Publication date
JPH0749806Y2 (en) 1995-11-13

Similar Documents

Publication Publication Date Title
JPS61199059U (en)
JPH01137554U (en)
JPH0428687U (en)
JPS61134060U (en)
JPS62122367U (en)
JPS61153356U (en)
JPH01149685U (en)
JPH0227749U (en)
JPS61119749U (en)
JPS63153557U (en)
JPS6398661U (en)
JPH0480069U (en)
JPS6316462U (en)
JPS63196162U (en)
JPH0348250U (en)
JPS61134059U (en)
JPS6398660U (en)
JPS6413161U (en)
JPH03113564U (en)
JPS6430535U (en)
JPS61153358U (en)
JPS63152251U (en)
JPS6197865U (en)
JPS59104551U (en) solid-state imaging device
JPS63129835U (en)