JPS6037194A - Hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a hybrid integrated circuit device having an energy conversion section such as a photoelectric conversion element 9 and a heating resistor.

[Technical background of the invention and its problems] As electronic devices and the like have become smaller in recent years, there has been a demand for improved packaging density on circuits. In order to meet this demand, it is possible to improve wiring pattern density, and to mount electrical elements such as integrated circuit elements, resistor elements, and capacitor elements, and functional elements such as sensors on the same substrate. It is being done. Forming on the same substrate has many advantages such as miniaturization of the +S device and ease of maintenance when the IZ is incorporated into the device S2.

However, when performing high-density wiring using thin-film or thick-film technology, if a defect occurs, the entire board must be replaced, and the probability of this happening increases especially as the area of the board increases, resulting in poor yields and manufacturing problems. There is a problem that the cost i increases.

Special C: When the energy conversion parts such as the heat generating resistors of the photoelectric conversion element 1 are integrated on the same substrate, the conductor pattern that has already been formed may be affected by the formation of the energy conversion part, causing the pattern to peel off. There is a problem that this may occur. This tendency becomes more noticeable as the density of the conductor pattern increases. Furthermore, in the past, due to this influence, C
has been used as a conductor pattern, but it is still not sufficient and there is also a problem in terms of increased cost.

In addition, when the energy conversion portion is formed and then subjected to a second soldering process or mounting of an electric element such as an integrated circuit chip, the energy conversion film is often damaged.

Although this is a hybrid integrated circuit with great benefits from integration, as the area becomes larger, the yield of the energy conversion section and the circuit pattern decreases, and the yield of the entire C2 becomes the product of these. However, it was difficult to increase the overall yield.

[Object of the Invention] The present invention has been made in consideration of the above points, and an object of the present invention is to provide a hybrid integrated circuit device that has a high yield, is inexpensive, and is easy to manufacture.

[Summary of the Invention] The present invention includes: a first base including an energy conversion section; a second base on which an electric element for driving the energy conversion section is mounted; and the energy conversion section and the semiconductor element. Electrical C-
a connecting means for connecting; and a third translucent member for fixing the first base and the second base.
A hybrid integrated circuit device comprising: a base body; and a photocurable resin is used as means for fixing the first base body and the second base body to the third base body.

That is, a first base body equipped with an energy conversion part and a second base body equipped with an electric element for driving are manufactured separately, and then fixed onto a third base body using a photocurable resin. ,
It is an integrated hybrid integrated circuit device.

In this way (separated when manufacturing, then integrated)
Second, the yield of the energy conversion section can be increased. This is because the energy converter can be formed without going through extra processing steps such as forming a conductor pattern for a driving electric element and mounting the element. Also, since this energy converter is formed separately, there is no restriction on the formation of a conductive pattern for driving on the second substrate.
This facilitates the formation of multilayer wiring and high-definition patterns that accompany increased density. Furthermore, even if the integrated size is large, the individual boards can be small, so there is no need to increase the size of the attachment/detachment device, for example. Furthermore, since C is divided into two parts and the number of pieces that can fit into 10 tons increases due to the miniaturization, the time required for manufacturing C' is shortened.

Examples of energy conversion units include image sensors using a photoelectric conversion film such as amorphous silicon (A-8I), units that convert light energy and electrical energy, such as light emitting element arrays using light emitting diodes, and heat generating units. Examples include thermal heads that use resistor arrays to convert electrical energy into thermal energy.

The first substrate and the second substrate are glass substrates.

Various types of substrates can be used, such as a ceramic substrate, a metal substrate whose surface is insulated, and the like.This substrate can be used depending on the purpose.

For example, in the case of a thermal head that uses a heating resistor as an energy converter, a ceramic substrate with good heat resistance such as alumina is used as the first substrate, and in the case of a thermal head, the second substrate is used because a large current flows through it. For example, it is preferable to use a substrate with good heat dissipation such as a resin-coated metal substrate.

In addition, when an image sensor using an a-8i photoelectric conversion element is used as an energy conversion part, the first substrate may be a glass substrate or a surface 1 on which the a-8+ film is well deposited.
A ceramic substrate on which a Yugle layer is formed is used, and a ceramic substrate that can be easily processed into thick and thin films is used as the second base when performing high-density wiring between electric elements such as driving semiconductor elements. Good.

Further, as the electric element to be mounted on the second substrate C2,
Examples include integrated circuit elements, capacitor elements, and resistance elements.

The first and second substrates described above are fixed to the third substrate C2 by a photocurable resin C2 such as a photocurable epoxy resin or a photocurable urethane resin. Therefore, a transparent substrate is used as the third base so that the light for curing the photocurable resin is transmitted therethrough. Examples of such transparent substrates include optical glass substrates using borosilicate glass, borosilicate glass, etc. On such a third substrate, a photocurable resin is dropped and applied. , by a method such as printing, the first and second substrates are placed on this photocurable resin, and curing light is irradiated from the third substrate side to fix it.

In this way, when fixing using a photocurable resin (-), when fixing the first and second substrates to the third substrate C (2), for example, when using a thermosetting resin (5); Since no energy is added, it is possible to prevent deterioration of the energy converting part.Also, the curing time is shorter than usual, so
Productivity can be improved. Further, there is no need for a substrate fixing jig during curing.

In addition, examples of connection means for electrically connecting the first substrate and the second substrate include, for example, connection by bonding wire I, contact with conductive rubber, and drawing contact with insulating rubber having a conductive pattern. Various methods are possible.

It goes without saying that there may be a plurality of each of the first and second substrates.

[Effects of the Invention] As explained above, according to the "non-explosion" C2, it is possible to separately manufacture the base body equipped with the energy conversion section and the base body equipped with the drive electric element. The yield rate can be increased, and the yield rate of integrated hybrid integrated circuit devices can also be improved. Furthermore, by integrating the IZ with a photocurable resin (second, it is possible to obtain substantially the same effect as that formed on a single IZ substrate without causing any deterioration of the characteristics of the energy conversion section, etc.).

[Embodiments of the invention] The present invention will be explained in detail below.

This embodiment is a -dimensional close-contact type image sensor that uses a photoelectric conversion element as an energy conversion section, and is shown in Fig. 1 (
-) A glass substrate is used as the first substrate (1), and Cr is vapor-deposited and photo-etched to form a lower electrode (2) in a desired shape. These lower electrodes are arranged in a row r:p at a pitch of, for example, 8 electrodes/column.
Form several pieces. This situation is shown in FIG. 1(b) as a two-part fair view. Next, on this lower electrode (2), a photoelectric conversion film (8) made of, for example, a hydrogen-containing a-8i film is deposited by CVD.
This photoelectric conversion film (8
A transparent electrode (4) made of ITO or the like is formed on the first substrate (1), and an array-like optical sensor (5) having a so-called sandwich structure is formed on the first substrate (1).

Next, the formation of the drive section of the optical sensor (5) array will be explained.

Using an alumina substrate as the second substrate, an Au paste is printed and fired to form a conductor pattern 0η. 8 pieces/
Since wJ is about 1, it is preferable to use photophosphorography technology in the case of high-density wiring. Next, an integrated circuit element (2) having a switching function for sequentially driving the photoelectric conversion element array is fixed on the conductor pattern αη using, for example, conductive epoxy, and then the integrated circuit element (2) is fixed on the conductor pattern αη.
1-? (1nl m In r h rLA 彰%west?Strong force is formed 0 The performance of the first base body and the second base body formed separately in this way is conducted respectively, and a good product is selected and the third base body ( Goods) Implement upper C.

For example, the third substrate (a) has a thickness of 350 to 450 nm.
Using barium borosilicate glass (7059 manufactured by Koning Co., Ltd.) that transmits ordinary ultraviolet rays, etc., this third substrate is arranged horizontally, and an ultraviolet curing resin (21) is used as a fixing means. , apply this resin (2''j) on the third substrate (goods). Then, align the first substrate (1) and the second substrate αQ and arrange C on the third substrate (company). Next, ultraviolet M (α in the figure) is applied via the third substrate (a).
The first substrate (1
) and the second base (to) are fixed on the third base (to). Since this curing treatment time is usually about 1 minute, it is very efficient, and since no further heat treatment is used, there is no risk of adverse effects on the photoelectric conversion element array 5.

Next, the first base (1) and the second base (2) are electrically connected. In this example, a bonding wire was used as the connection means.

By manufacturing the C2 substrate by dividing it (2), the degree of freedom when manufacturing image sensors is greatly increased.In other words, in order to reduce the size of general C2 equipment, the drive circuit section and the sensor section are integrated into one C2. However, since the manufacturing process is different for each, multiple steps are required and it takes time.Furthermore, I: The sensor part is general ζ; Heat treatment C: Further changes in characteristics occur. Therefore, there are two limitations on process C after forming the sensor section.

However, by making this 5-part harm um (from 2), the sensor part and the drive circuit part can be manufactured separately, so manufacturing can proceed in parallel, reducing the time required for manufacturing C2. Furthermore, since the divided substrates are manufactured separately, there is no need to mix manufacturing processes, which simplifies the manufacturing process.

In addition, restrictions on process order, processing conditions, etc. are relaxed, increasing the degree of freedom in manufacturing.

Furthermore, by eliminating the mixing of manufacturing processes, the individual yield of sensors, drive circuits, etc. on each substrate is improved. Characteristic changes are likely to occur as a result of passing through each process, and these characteristic changes can lead to fatal defects such as an increase in dark current and a decrease in charge conversion efficiency. The benefits are huge.

In addition, since the C and C on the same substrate are eventually integrated, the same
For example, it is easy to handle, easy to maintain, and similar to the case where the sensor section and the drive circuit section are formed by coexisting C on the base body.
It also has effects such as easy miniaturization. When driving an image sensor with a special S dual storage type, the signals handled are small, so it is desirable to place the drive circuit and sensor part as close as possible. Base ■
It needs to be integrated close to the top.

In the embodiments described above, bonding wires were used to connect the substrates, but for example, an insulating rubber surface with a conductive pattern formed thereon may be brought into contact between the substrates.

For example, in the case where the lower electrodes in the above-mentioned Example c2 are lined up at a density of about 8 electrodes/line, the conductor pattern to be connected to this electrode on the second substrate is formed in a thin pattern so as to face it. Parallel 1 in the opposing direction between these two road bodies
For example, a conductor pattern of approximately 16 conductor patterns may be formed on the insulating rubber surface and brought into contact with both substrates. In this method, as long as the first and second substrates are aligned, all electrical connections can be made simply by abutting the rubber, making it extremely easy to manufacture. The above is valid. The same thing can be said if a long-lasting conductive rubber is used.

[Brief explanation of the drawing]

FIG. 1(a) is a cross-sectional view of an image sensor showing an embodiment of the present invention, and FIG. 1(b) is a cross-sectional view of an image sensor showing an embodiment of the present invention.
FIG. 1... First base 5... Optical sensor (energy conversion unit) 10... Second
Base body 12... integrated circuit element (electrical element) 20... third base body

Claims (2)

[Claims] (1) A first base body including an energy conversion unit, and a second base body on which an electric element for driving the energy conversion unit is mounted.
a base body; a connection means for electrically connecting the energy conversion section and the semiconductor element; and a translucent third base body for fixing the first base body and the second base body.
A hybrid integrated circuit device, comprising: a base body, and a photocurable resin is used as means for fixing the first base body and the second base body to the third base body. (2) The hybrid integrated circuit device according to claim 1, wherein the energy conversion section is a photoelectric conversion element.