JPH0227749U - - Google Patents
Info
- Publication number
- JPH0227749U JPH0227749U JP10619788U JP10619788U JPH0227749U JP H0227749 U JPH0227749 U JP H0227749U JP 10619788 U JP10619788 U JP 10619788U JP 10619788 U JP10619788 U JP 10619788U JP H0227749 U JPH0227749 U JP H0227749U
- Authority
- JP
- Japan
- Prior art keywords
- light
- photosensitive element
- sealed
- resin
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
断面図である。
１：半導体チツプ、２：透光性樹脂、４：遮光
性樹脂ホルダ、５：金属支持板、８：接着剤。
FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a sectional view. 1: Semiconductor chip, 2: Transparent resin, 4: Light-shielding resin holder, 5: Metal support plate, 8: Adhesive.
Claims (1)
り封止され、その封止体の光感応素子への光入射
面以外の面が遮光性樹脂よりなる付帯部分と接着
されたことを特徴とする光半導体装置。 A semiconductor substrate containing a photosensitive element is sealed with a light-transmitting resin, and a surface of the sealed body other than the light incident surface to the photosensitive element is bonded to an attached part made of a light-shielding resin. Optical semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10619788U JPH0227749U (en) | 1988-08-11 | 1988-08-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10619788U JPH0227749U (en) | 1988-08-11 | 1988-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227749U true JPH0227749U (en) | 1990-02-22 |
Family
ID=31339492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10619788U Pending JPH0227749U (en) | 1988-08-11 | 1988-08-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227749U (en) |
-
1988
- 1988-08-11 JP JP10619788U patent/JPH0227749U/ja active Pending
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