JPS62152470U - - Google Patents
Info
- Publication number
- JPS62152470U JPS62152470U JP1986041700U JP4170086U JPS62152470U JP S62152470 U JPS62152470 U JP S62152470U JP 1986041700 U JP1986041700 U JP 1986041700U JP 4170086 U JP4170086 U JP 4170086U JP S62152470 U JPS62152470 U JP S62152470U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- element chip
- recess
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000002457 bidirectional effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
第１図ａ，ｂは本考案の発光半導体装置の一実
施例の上断面図及びその要部の拡大斜視図、第２
図ａ，ｂは従来の発光半導体装置の上断面図及び
その要部の拡大斜視図、第３図は第２図に示した
従来例の断面図である。
１：リード端子、２：発光ダイオードチツプ、
３：透明樹脂、３ａ，３ｂ：レンズ部、６：凹欠
部、７：壁、８：反射面。
1a and 1b are a top sectional view and an enlarged perspective view of the main parts of an embodiment of the light emitting semiconductor device of the present invention;
Figures a and b are a top sectional view and an enlarged perspective view of the main parts of a conventional light emitting semiconductor device, and Figure 3 is a sectional view of the conventional example shown in Figure 2. 1: Lead terminal, 2: Light emitting diode chip,
3: Transparent resin, 3a, 3b: Lens portion, 6: Recessed portion, 7: Wall, 8: Reflective surface.
Claims (1)
リード端子の搭載部とほぼ平行に発光面を位置さ
せてボンデイングされた発光素子チツプと該発光
素子チツプの発光面の周囲の２箇所に指向性を与
えるレンズを設けてチツプをモールドする透明樹
脂とからなる双方向性の発光半導体装置において
、前記リード端子の先端部上面の略中央に凹欠部
を形成し、該凹欠部の底部に前記発光素子チツプ
をボンデイングするとともに該発光素子チツプを
挾んで相対向する前記凹欠部の両側壁面に、前記
発光素子よりの光をレンズ側へ集光させる反射面
を設けたことを特徴とする発光半導体装置。 A lead terminal with a chip mounting part at the tip, a light emitting element chip bonded with the light emitting surface positioned almost parallel to the mounting part of the lead terminal, and a directional light at two places around the light emitting surface of the light emitting element chip. In a bidirectional light emitting semiconductor device, a recess is formed approximately in the center of the upper surface of the tip of the lead terminal, and a recess is formed at the bottom of the recess. A light emitting device characterized in that a light emitting element chip is bonded and reflective surfaces for condensing light from the light emitting element toward a lens are provided on both side wall surfaces of the recessed part facing each other while sandwiching the light emitting element chip. Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986041700U JPS62152470U (en) | 1986-03-19 | 1986-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986041700U JPS62152470U (en) | 1986-03-19 | 1986-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62152470U true JPS62152470U (en) | 1987-09-28 |
Family
ID=30856933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986041700U Pending JPS62152470U (en) | 1986-03-19 | 1986-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62152470U (en) |
-
1986
- 1986-03-19 JP JP1986041700U patent/JPS62152470U/ja active Pending
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