JPS60137457U - Optical coupling semiconductor device - Google Patents

Optical coupling semiconductor device

Info

Publication number
JPS60137457U
JPS60137457U JP2611284U JP2611284U JPS60137457U JP S60137457 U JPS60137457 U JP S60137457U JP 2611284 U JP2611284 U JP 2611284U JP 2611284 U JP2611284 U JP 2611284U JP S60137457 U JPS60137457 U JP S60137457U
Authority
JP
Japan
Prior art keywords
semiconductor device
optical coupling
light
electrically connected
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2611284U
Other languages
Japanese (ja)
Inventor
弘 伊藤
阪本　清
弘之 山本
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP2611284U priority Critical patent/JPS60137457U/en
Publication of JPS60137457U publication Critical patent/JPS60137457U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による一実施例の組立て分解斜視図、第
２図は同実施例による要部斜視口、第３図は従来装置の
断面図である。 ７．７ａ、７ｂ：受光側リード、８：受光素子、１０１
：発光側リード、１１：ケース、１２゜１４：導電体膜
、１３：発光素子。FIG. 1 is an exploded perspective view of an embodiment of the present invention, FIG. 2 is a perspective view of a main part of the same embodiment, and FIG. 3 is a sectional view of a conventional device. 7.7a, 7b: Light receiving side lead, 8: Light receiving element, 101
: Light-emitting side lead, 11: Case, 12° 14: Conductor film, 13: Light-emitting element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発光素子と受光素子を光結合してなる半導体装置におい
て、断面が凹状をなすケースの底面に一方の素子を取付
け、該素子をケース壁に設けられた導電体に電気的接続
し、上記ケースの開口側を被うリードフレームの、上記
一方の素子と対向する面に他方の素子を取付け、上記リ
ードフレームと同一平面上で上記ケース壁の導電体と電
気的接続されたリード端子とを設け、上記素子対向部被
つて樹脂封止してなることを特徴とする光結合半導体装
置。In a semiconductor device formed by optically coupling a light-emitting element and a light-receiving element, one element is attached to the bottom of a case with a concave cross section, and the element is electrically connected to a conductor provided on the case wall. The other element is attached to the surface of the lead frame covering the opening side facing the one element, and a lead terminal electrically connected to the conductor of the case wall is provided on the same plane as the lead frame, An optically coupled semiconductor device, characterized in that the element opposing portion is covered and sealed with a resin.
JP2611284U 1984-02-22 1984-02-22 Optical coupling semiconductor device Pending JPS60137457U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2611284U JPS60137457U (en) 1984-02-22 1984-02-22 Optical coupling semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2611284U JPS60137457U (en) 1984-02-22 1984-02-22 Optical coupling semiconductor device

Publications (1)

Publication Number Publication Date
JPS60137457U true JPS60137457U (en) 1985-09-11

Family

ID=30521818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2611284U Pending JPS60137457U (en) 1984-02-22 1984-02-22 Optical coupling semiconductor device

Country Status (1)

Country Link
JP (1) JPS60137457U (en)

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