JPS60133653U - light emitting diode - Google Patents

light emitting diode

Info

Publication number
JPS60133653U
JPS60133653U JP2160384U JP2160384U JPS60133653U JP S60133653 U JPS60133653 U JP S60133653U JP 2160384 U JP2160384 U JP 2160384U JP 2160384 U JP2160384 U JP 2160384U JP S60133653 U JPS60133653 U JP S60133653U
Authority
JP
Japan
Prior art keywords
emitting diode
lead
light emitting
element mounting
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2160384U
Other languages
Japanese (ja)
Inventor
向原　広章
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP2160384U priority Critical patent/JPS60133653U/en
Publication of JPS60133653U publication Critical patent/JPS60133653U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の発光ダイオ−！の断面＝、竿２図は従来
の改良された発光＝゛イオード断面図、第３図は本考案
の一実施例による発光ダイオードの断面図である。Figure 1 shows a conventional light emitting diode! 2 is a sectional view of a conventional improved light emitting diode, and FIG. 3 is a sectional view of a light emitting diode according to an embodiment of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 素子搭載部を有するリードと幸子からのボンディング線
の接続部を有するリードとを備えた発光ダイオードにお
いて前記ボンディング線接続部を有するリードが素子搭
載部を有するリードより長−°　　くボンディング線接
続部が素子搭載部より上方に位置しかつ発光ダイオード
の指向性を低下せしめない様、リードのボンディング線
接続部を傾斜さ−せたことを特徴とする発光ダイボード
。　　゛In a light emitting diode having a lead having an element mounting part and a lead having a connection part for a bonding line from Sachiko, the lead having the bonding line connection part is longer than the lead having the element mounting part. A light-emitting die board characterized in that the bonding wire connection part of the lead is inclined so as to be located above the element mounting part and not to reduce the directivity of the light-emitting diode.゛
JP2160384U 1984-02-17 1984-02-17 light emitting diode Pending JPS60133653U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2160384U JPS60133653U (en) 1984-02-17 1984-02-17 light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2160384U JPS60133653U (en) 1984-02-17 1984-02-17 light emitting diode

Publications (1)

Publication Number Publication Date
JPS60133653U true JPS60133653U (en) 1985-09-06

Family

ID=30513142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2160384U Pending JPS60133653U (en) 1984-02-17 1984-02-17 light emitting diode

Country Status (1)

Country Link
JP (1) JPS60133653U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008010740A (en) * 2006-06-30 2008-01-17 Stanley Electric Co Ltd Optical semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008010740A (en) * 2006-06-30 2008-01-17 Stanley Electric Co Ltd Optical semiconductor device

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