JPH0284350U - - Google Patents

Info

Publication number
JPH0284350U
JPH0284350U JP1988164157U JP16415788U JPH0284350U JP H0284350 U JPH0284350 U JP H0284350U JP 1988164157 U JP1988164157 U JP 1988164157U JP 16415788 U JP16415788 U JP 16415788U JP H0284350 U JPH0284350 U JP H0284350U
Authority
JP
Japan
Prior art keywords
light emitting
chip
electrode
mount
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988164157U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988164157U priority Critical patent/JPH0284350U/ja
Publication of JPH0284350U publication Critical patent/JPH0284350U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本構成の一実施例の発光素子の構成を
示す断面図、第２図は個別素子のハンダ付けによ
つて組立てられる従来の発光回路の回路図である
。 １１……発光ダイオード、１２……トランジス
タ・チツプ、１３……チツプ抵抗器、１４，１５
，１６……リード端子、１４ａ……マウント部、
１６……パツケージの基部、１８……透明又は着
色された樹脂層、２１，２２，２３……ボンデイ
ングワイヤ。 FIG. 1 is a sectional view showing the configuration of a light emitting element according to an embodiment of the present configuration, and FIG. 2 is a circuit diagram of a conventional light emitting circuit assembled by soldering individual elements. 11... Light emitting diode, 12... Transistor chip, 13... Chip resistor, 14, 15
, 16...Lead terminal, 14a...Mount part,
16... Base of package, 18... Transparent or colored resin layer, 21, 22, 23... Bonding wire.

Claims (1)

【実用新案登録請求の範囲】 (1) 電圧端子の間に直列接続されるチツプ抵抗
器、発光ダイオード及びこの発光ダイオードを駆
動するためのトランジスタ・チツプが同一のパツ
ケージ内に形成されたことを特徴とする発光素子
。 (2) 前記パツケージは基部と、この基部に植設
された３本のリード端子であつて中央のリード端
子の先端部分には導電性のマウント部が形成され
たものとを備え、 このマウント部には前記チツプ抵抗器が接着に
よつて固定されると共に、このマウント部表面に
対するエミツタ端子の電気的接続によつて前記ト
ランジスタ・チツプが固定され、 このマウント部に固定されたチツプ抵抗器の一
方の電極に対する一方の電極の電気的接続によつ
て発光ダイオードが固定され、 前記３本のリード端子のうち両側に位置する一
方のリード端子から前記トランジスタ・チツプの
制御電極に制御電圧が供給され、他方のリード端
子から前記チツプ抵抗器の他方の電極に直流電圧
が供給され、 前記トランジスタ・チツプのコレクタ電極が前
記発光ダイオードの他方の端子に接続され、 前記中央に位置するリード端子には接地電位が
供給されることを特徴とする実用新案登録請求の
範囲第１項記載の発光素子。[Claims for Utility Model Registration] (1) A chip resistor connected in series between voltage terminals, a light emitting diode, and a transistor chip for driving the light emitting diode are formed in the same package. A light-emitting element. (2) The package includes a base, and three lead terminals implanted in the base, with a conductive mount formed at the tip of the central lead terminal, and the mount At the same time, the chip resistor is fixed by adhesive, and the transistor chip is fixed by the electrical connection of the emitter terminal to the surface of the mount, and one of the chip resistors fixed to the mount. A light emitting diode is fixed by electrical connection of one electrode to the electrode of the transistor chip, and a control voltage is supplied to the control electrode of the transistor chip from one of the three lead terminals located on both sides, A DC voltage is supplied from the other lead terminal to the other electrode of the chip resistor, a collector electrode of the transistor chip is connected to the other terminal of the light emitting diode, and the center lead terminal is connected to a ground potential. A light emitting device according to claim 1, characterized in that the light emitting device is provided with:
JP1988164157U 1988-12-19 1988-12-19 Pending JPH0284350U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988164157U JPH0284350U (en) 1988-12-19 1988-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988164157U JPH0284350U (en) 1988-12-19 1988-12-19

Publications (1)

Publication Number Publication Date
JPH0284350U true JPH0284350U (en) 1990-06-29

Family

ID=31449522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988164157U Pending JPH0284350U (en) 1988-12-19 1988-12-19

Country Status (1)

Country Link
JP (1) JPH0284350U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1787334A2 (en) * 2004-02-05 2007-05-23 Agilight, Inc. Light-emitting structures

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1787334A2 (en) * 2004-02-05 2007-05-23 Agilight, Inc. Light-emitting structures
EP1787334A4 (en) * 2004-02-05 2009-11-11 Gen Led Inc Light-emitting structures

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