JPH04113466U - Chip type light emitting diode - Google Patents
Chip type light emitting diodeInfo
- Publication number
- JPH04113466U JPH04113466U JP1991023761U JP2376191U JPH04113466U JP H04113466 U JPH04113466 U JP H04113466U JP 1991023761 U JP1991023761 U JP 1991023761U JP 2376191 U JP2376191 U JP 2376191U JP H04113466 U JPH04113466 U JP H04113466U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- chip
- light
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000003086 colorant Substances 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 230000000694 effects Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
(57)【要約】
【目的】 １つのチップ型発光ダイオードで白色発光を
含む多色発光を可能にした抵抗内蔵型の発光ダイオード
を提供する。
【構成】 このチップ型発光ダイオードは、電極形成さ
れた絶縁基板１上に発光ダイオード素子５Ｒ，５Ｇ，５
Ｂを実装し、透光性樹脂７にて封止する基本構造からな
る。発光ダイオード素子は赤色、緑色、青色の３色であ
る。また、各々の発光ダイオード素子に対応する電極パ
ターン上には、印刷にて電流制限用の抵抗４Ｒ，４Ｇ，
４Ｂが設けられている。この抵抗値を調整するか又はこ
れにそれぞれ印加する電圧を制御することにより、発光
色を設定、変化させることができる。
(57) [Summary] [Purpose] To provide a light emitting diode with a built-in resistor that enables multicolor light emission including white light emission with a single chip type light emitting diode. [Structure] This chip type light emitting diode has light emitting diode elements 5R, 5G, 5 on an insulating substrate 1 on which electrodes are formed.
It consists of a basic structure in which B is mounted and sealed with a translucent resin 7. The light emitting diode elements have three colors: red, green, and blue. In addition, on the electrode pattern corresponding to each light emitting diode element, current limiting resistors 4R, 4G,
4B is provided. By adjusting the resistance value or controlling the voltage applied to each of them, the color of the emitted light can be set and changed.
Description
【０００１】0001
本考案はチップ型発光ダイオードに関するものであり、特に赤色、緑色、青色 の３色の発光ダイオード（以下「ＬＥＤ」と略称する）素子を搭載し、かつ各色 のＬＥＤ素子に対応する抵抗体も内蔵することにより、白色を含む多色発光が可 能なチップ型ＬＥＤに関する。 This invention relates to chip-type light emitting diodes, especially red, green, and blue light emitting diodes. Equipped with three color light emitting diode (hereinafter abbreviated as "LED") elements, and each color By incorporating a resistor corresponding to the LED element, multi-color light emission including white is possible. This invention relates to a chip-type LED that can be used.
【０００２】 従来のチップ型ＬＥＤは図４及び図５に示すものであった。 図４に示すＬＥＤは、絶縁基板１に一対の電極パターン２及びスルーホール電 極３を形成し、さらにＬＥＤ素子５を一方の電極パターン２上に実装しワイヤー ６を介して他方の電極パターン２に接続し、透光性樹脂７にて封止したものであ る。 また、図５に示すＬＥＤは、図４に示すＬＥＤの構造を一つの絶縁基板１上に ２組設け、さらに抵抗体も２組設けたものである。即ち、２対の電極パターン２ 及びスルーホール電極３と、２個のＬＥＤ素子５と、これらにそれぞれ接続され る２本のワイヤー６と、２個の抵抗体４とから構成されている。0002 Conventional chip-type LEDs are shown in FIGS. 4 and 5. The LED shown in FIG. 4 includes a pair of electrode patterns 2 and a through-hole electrode on an insulating substrate 1. A pole 3 is formed, and an LED element 5 is mounted on one of the electrode patterns 2. It is connected to the other electrode pattern 2 through 6 and sealed with translucent resin 7. Ru. Furthermore, the LED shown in FIG. 5 has the structure of the LED shown in FIG. 4 on one insulating substrate 1. Two sets are provided, and two sets of resistors are also provided. That is, two pairs of electrode patterns 2 and through-hole electrode 3, two LED elements 5, and connected to these respectively. It consists of two wires 6 and two resistors 4.
【０００３】0003
近年、この種のチップ型ＬＥＤの用途が広がり、これにより様々な発光色や発 光形態が要求されている。 In recent years, the use of this type of chip-type LED has expanded, and it has become possible to emit a variety of colors and emit light. Light form is required.
【０００４】 しかしながら、図４に示すＬＥＤにおいては、１個のＬＥＤ素子５が搭載され ているだけであるため、１色のみの発光となり、多色発光させることはできなか った。このため、同一構造からなる異なる発光色のＬＥＤを複数使用しなければ 多色発光させることはできなかった。0004 However, in the LED shown in FIG. 4, one LED element 5 is mounted. Since it is only a single color, it emits only one color and cannot emit multicolor light. It was. For this reason, it is necessary to use multiple LEDs with the same structure and different emission colors. It was not possible to emit multicolor light.
【０００５】 また、図５に示すＬＥＤにおいても、搭載されているＬＥＤ素子５の数は２個 であるため、２色の発光は可能であるが、白色発光を含む多色発光を行なうこと はできなかった。従って、通常このＬＥＤにおいては、何れか一方のＬＥＤ素子 が点灯するように使用されることが多かった。[0005] Also, in the LED shown in FIG. 5, the number of mounted LED elements 5 is two. Therefore, it is possible to emit light in two colors, but it is necessary to emit multicolor light including white light. I couldn't. Therefore, in this LED, usually one of the LED elements It was often used to light up.
【０００６】 本考案の目的は、赤色、緑色、青色の３色のＬＥＤを各々の発光を制御するこ とが可能な状態に実装することにより、１つのチップ型ＬＥＤで白色発光を含む 多色発光を容易に実現できる抵抗内蔵型のチップ型ＬＥＤを提供することにある 。[0006] The purpose of this invention is to control the light emission of three color LEDs: red, green, and blue. By mounting it in a state that allows for white light emission with one chip type LED. The objective is to provide a chip-type LED with a built-in resistor that can easily realize multicolor light emission. .
【０００７】[0007]
本考案のチップ型ＬＥＤは、電極形成された絶縁基板上に、ＬＥＤ素子を実装 し、透光性樹脂にて封止したチップ型ＬＥＤにおいて、絶縁基板に、赤色、緑色 、青色の３色のＬＥＤ素子を実装し、各々のＬＥＤ素子に対応した電極パターン 上に、印刷にて形成された電流制限用抵抗を設たものである。 The chip-type LED of this invention has an LED element mounted on an insulating substrate on which electrodes are formed. In chip-type LEDs sealed with translucent resin, red and green colors are placed on an insulating substrate. , LED elements of three colors of blue are mounted, and electrode patterns corresponding to each LED element are installed. A current limiting resistor formed by printing is provided on the top.
【０００８】[0008]
本考案のチップ型ＬＥＤにおいては、赤色、緑色、青色の各ＬＥＤ素子の発光 色の光量を制御することが可能である。したがって、その発光色の光量を制御す ることにより、白、赤、橙、黄、緑、青、紫の発光が可能となる。 In the chip-type LED of the present invention, each red, green, and blue LED element emits light. It is possible to control the amount of color light. Therefore, it is necessary to control the amount of light emitted from that color. By doing so, it becomes possible to emit white, red, orange, yellow, green, blue, and violet light.
【０００９】 各発光色の光量は、内蔵する各色に対応する抵抗体の抵抗値の調整、又は各抵 抗体を介して各ＬＥＤ素子に印加される電圧の制御を行なうことにより設定する ことができる。[0009] The amount of light for each emitted color can be adjusted by adjusting the resistance value of the built-in resistor corresponding to each color, or by adjusting the resistance value of the built-in resistor corresponding to each color. Set by controlling the voltage applied to each LED element via antibodies be able to.
【００１０】0010
図１は本考案の一実施例に係るチップ型ＬＥＤを示す斜視図であり、図３はそ の回路図である。図１に示す絶縁基板１は、アルミナ基板、ガラスエポキシ基板 等から構成されており、その表面には印刷若しくはメッキ配線により電極パター ン及びスルーホール電極が形成されている。 FIG. 1 is a perspective view showing a chip-type LED according to an embodiment of the present invention, and FIG. FIG. The insulating substrate 1 shown in FIG. 1 is an alumina substrate or a glass epoxy substrate. The electrode pattern is printed or plated on the surface. A through-hole electrode is formed.
【００１１】 電極パターンは、絶縁基板１の上面の略中央に形成されている電極パターン２ ａと、その周囲に形成されている電極パターン２ｂ〜２ｄと、それらの近辺に設 けられている電極パターン２ｅ〜２ｇとから構成されている。[0011] The electrode pattern is an electrode pattern 2 formed approximately in the center of the upper surface of the insulating substrate 1. a, the electrode patterns 2b to 2d formed around it, and the electrode patterns 2b to 2d formed around it. It is composed of electrode patterns 2e to 2g that are eclipsed.
【００１２】 また、スルーホール電極は、絶縁基板１の外周に形成され、電極パターン２ａ 、２ｅ〜２ｇにそれぞれ接続されたスルーホール電極３ａ、３ｅ〜３ｇから構成 されている。このスルーホール電極は、チップ型ＬＥＤを回路基板等に実装する 時に半田等により電気的及び機械的に接続される端子電極として使用される。0012 Further, the through-hole electrode is formed on the outer periphery of the insulating substrate 1, and the electrode pattern 2a , consisting of through-hole electrodes 3a, 3e to 3g connected to electrodes 2e to 2g, respectively. has been done. This through-hole electrode is used to mount a chip-type LED on a circuit board, etc. It is sometimes used as a terminal electrode that is electrically and mechanically connected by soldering or the like.
【００１３】 電流制限用の抵抗体は、酸化ルテニウム、カーボン等からなり、電極２ｂ、２ ｅ間、電極２ｃ、２ｆ間、電極２ｄ、２ｇ間にそれぞれ形成されている抵抗体４ Ｒ、４Ｇ、４Ｂから構成されている。[0013] The current limiting resistor is made of ruthenium oxide, carbon, etc., and is connected to the electrodes 2b, 2. A resistor 4 is formed between e, between electrodes 2c and 2f, and between electrodes 2d and 2g. It is composed of R, 4G, and 4B.
【００１４】 それぞれ赤色、緑色、青色の発光をする３個のＬＥＤ素子５Ｒ、５Ｇ、５Ｂは 、共に電極２ａ上に銀ペースト等の導電性接着剤を用いて接着されている。また 、このＬＥＤ素子５Ｒ、５Ｇ、５Ｂは、金、アルミ等からなるワイヤ６Ｒ、６Ｇ 、６Ｂによりそれぞれ電極パターン２ｂ〜２ｄに接続されている。[0014] The three LED elements 5R, 5G, and 5B each emit red, green, and blue light. , are both bonded onto the electrode 2a using a conductive adhesive such as silver paste. Also , these LED elements 5R, 5G, 5B are wires 6R, 6G made of gold, aluminum, etc. , 6B are connected to the electrode patterns 2b to 2d, respectively.
【００１５】 透光性樹脂７は、ＬＥＤ素子５Ｒ、５Ｇ、５Ｂ、ワイヤ６Ｒ、６Ｇ、６Ｂ等を 封止して保護するために設けられており、絶縁基板１の上面上に形成されている 。[0015] The translucent resin 7 includes LED elements 5R, 5G, 5B, wires 6R, 6G, 6B, etc. Provided for sealing and protection, and is formed on the upper surface of the insulating substrate 1. .
【００１６】 本実施例のチップ型ＬＥＤにおいては、図３に示すように接続されることにな り、抵抗体６Ｒ、６Ｇ、６Ｂの各抵抗値Ｒ１、Ｒ２、Ｒ３を調整するかまたはＬ ＥＤ素子５Ｒ、５Ｇ、５Ｂにそれぞれ印加する電圧Ｖｃｃ１、Ｖｃｃ２、Ｖｃｃ ３を制御することにより各ＬＥＤ素子の発光量を調節することができる。このよ うに、赤色、緑色、青色の発光量を調節することにより、各種の発光色を得るこ とが可能となる。[0016] The chip type LED of this example is connected as shown in Figure 3. , adjust the resistance values R1, R2, and R3 of the resistors 6R, 6G, and 6B, or Voltages Vcc1, Vcc2, and Vcc applied to the ED elements 5R, 5G, and 5B, respectively By controlling 3, the amount of light emitted from each LED element can be adjusted. This way Various colors can be obtained by adjusting the amount of red, green, and blue light emitted. becomes possible.
【００１７】 図２は図１に示すチップ型ＬＥＤの一部変更例を示す斜視図である。図に示す ように、このチップ型ＬＥＤは、図１に示すチップ型ＬＥＤの上部に白色系のプ ラスチックからなる反射枠８を取り付けたものである。この反射枠８は、所望の 方向のみに光を照射させるためのものであり、図示するものにおいては、側方へ 照射される光を内側の斜面で反射して図中上方へ照射させている。[0017] FIG. 2 is a perspective view showing a partially modified example of the chip-type LED shown in FIG. shown in figure As shown in Fig. 1, this chip-type LED has a white colored plate on the top of the chip-type LED. A reflective frame 8 made of plastic is attached. This reflective frame 8 is This is to emit light only in one direction; The irradiated light is reflected by the inner slope and radiated upward in the figure.
【００１８】[0018]
本考案によれば、印加する電圧あるいは内蔵する抵抗体の抵抗値を変えること により、１つのチップ型ＬＥＤで白色を含む多色発光が可能となり、しかも抵抗 内蔵であるため、小型化、高密度実装が要求される電子機器の多色化を容易に実 現することができる。 According to the present invention, it is possible to change the applied voltage or the resistance value of the built-in resistor. This makes it possible to emit multicolor light including white with a single chip-type LED, and it is possible to emit light in multiple colors including white. Because it is built-in, it is easy to implement multiple colors in electronic devices that require miniaturization and high-density mounting. can be expressed.
【図１】本考案の一実施例に係るチップ型ＬＥＤを示す
斜視図である。FIG. 1 is a perspective view showing a chip-type LED according to an embodiment of the present invention.
【図２】図１に示すチップ型ＬＥＤの一部変更例を示す
斜視図である。FIG. 2 is a perspective view showing a partially modified example of the chip-type LED shown in FIG. 1;
【図３】図１に示すチップ型ＬＥＤの回路図である。FIG. 3 is a circuit diagram of the chip-type LED shown in FIG. 1;
【図４】従来のチップ型ＬＥＤを示す斜視図である。FIG. 4 is a perspective view showing a conventional chip-type LED.
【図５】従来のチップ型ＬＥＤを示す斜視図である。FIG. 5 is a perspective view showing a conventional chip-type LED.
１ 絶縁基板 ２ａ〜２ｇ 電極パターン ３ａ、３ｅ〜３ｇ スルーホール電極 ４Ｒ、４Ｇ、４Ｂ 抵抗体 ５Ｒ、５Ｇ、５Ｂ ＬＥＤ素子 ６Ｒ、６Ｇ、６Ｂ ワイヤ ７ 透光性樹脂 ８ 反射枠 1 Insulating substrate 2a-2g electrode pattern 3a, 3e to 3g through hole electrode 4R, 4G, 4B resistor 5R, 5G, 5B LED element 6R, 6G, 6B wire 7 Translucent resin 8 Reflective frame
Claims (1)
オード素子を実装し、透光性樹脂にて封止したチップ型
発光ダイオードにおいて、前記絶縁基板に、赤色、緑
色、青色の３色の発光ダイオード素子を実装し、かつ各
々の発光ダイオード素子に対応した電極パターン上に、
印刷にて形成された電流制限用抵抗を設け、白色を含む
多色発光を可能にしたことを特徴とするチップ型発光ダ
イオード。1. A chip-type light emitting diode in which a light emitting diode element is mounted on an insulating substrate on which electrodes are formed and sealed with a translucent resin, wherein the insulating substrate is provided with three colors of red, green, and blue. The light emitting diode elements are mounted, and on the electrode pattern corresponding to each light emitting diode element,
A chip-type light-emitting diode characterized by being provided with a current-limiting resistor formed by printing and capable of emitting multicolor light including white.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991023761U JP2572192Y2 (en) | 1991-03-19 | 1991-03-19 | Chip type light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991023761U JP2572192Y2 (en) | 1991-03-19 | 1991-03-19 | Chip type light emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04113466U true JPH04113466U (en) | 1992-10-05 |
| JP2572192Y2 JP2572192Y2 (en) | 1998-05-20 |
Family
ID=31908866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991023761U Expired - Fee Related JP2572192Y2 (en) | 1991-03-19 | 1991-03-19 | Chip type light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2572192Y2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001326390A (en) * | 2000-05-18 | 2001-11-22 | Rohm Co Ltd | Rear-surface light-emitting chip type light-emitting element and insulating board used therefor |
| WO2006001352A1 (en) * | 2004-06-25 | 2006-01-05 | Sanyo Electric Co., Ltd. | Light-emitting device |
| JP2006005290A (en) * | 2004-06-21 | 2006-01-05 | Citizen Electronics Co Ltd | Light emitting diode |
| JP2007294547A (en) * | 2006-04-21 | 2007-11-08 | Sharp Corp | Semiconductor light emitting device |
| JP2011155311A (en) * | 2011-05-16 | 2011-08-11 | Citizen Electronics Co Ltd | Chip-type light-emitting diode |
| JP2012033407A (en) * | 2010-07-30 | 2012-02-16 | Ichikoh Ind Ltd | Light source unit of semiconductor type light source of lamp fitting for vehicle and lamp fitting for vehicle |
| US9841175B2 (en) | 2012-05-04 | 2017-12-12 | GE Lighting Solutions, LLC | Optics system for solid state lighting apparatus |
| US9951938B2 (en) | 2009-10-02 | 2018-04-24 | GE Lighting Solutions, LLC | LED lamp |
| US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58150854U (en) * | 1982-04-05 | 1983-10-08 | 株式会社明電舎 | white light emitting indicator |
| JPS5918454U (en) * | 1982-07-27 | 1984-02-04 | 株式会社シチズン電子 | leadless light emitting diode |
-
1991
- 1991-03-19 JP JP1991023761U patent/JP2572192Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58150854U (en) * | 1982-04-05 | 1983-10-08 | 株式会社明電舎 | white light emitting indicator |
| JPS5918454U (en) * | 1982-07-27 | 1984-02-04 | 株式会社シチズン電子 | leadless light emitting diode |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001326390A (en) * | 2000-05-18 | 2001-11-22 | Rohm Co Ltd | Rear-surface light-emitting chip type light-emitting element and insulating board used therefor |
| US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
| JP2006005290A (en) * | 2004-06-21 | 2006-01-05 | Citizen Electronics Co Ltd | Light emitting diode |
| WO2006001352A1 (en) * | 2004-06-25 | 2006-01-05 | Sanyo Electric Co., Ltd. | Light-emitting device |
| JP2007294547A (en) * | 2006-04-21 | 2007-11-08 | Sharp Corp | Semiconductor light emitting device |
| US9951938B2 (en) | 2009-10-02 | 2018-04-24 | GE Lighting Solutions, LLC | LED lamp |
| JP2012033407A (en) * | 2010-07-30 | 2012-02-16 | Ichikoh Ind Ltd | Light source unit of semiconductor type light source of lamp fitting for vehicle and lamp fitting for vehicle |
| US9512996B2 (en) | 2010-07-30 | 2016-12-06 | Ichikoh Industries, Ltd. | Light source unit of semiconductor-type light source of vehicle lighting device and vehicle lighting device |
| JP2011155311A (en) * | 2011-05-16 | 2011-08-11 | Citizen Electronics Co Ltd | Chip-type light-emitting diode |
| US9841175B2 (en) | 2012-05-04 | 2017-12-12 | GE Lighting Solutions, LLC | Optics system for solid state lighting apparatus |
| US10139095B2 (en) | 2012-05-04 | 2018-11-27 | GE Lighting Solutions, LLC | Reflector and lamp comprised thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2572192Y2 (en) | 1998-05-20 |
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|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |