JP2572192Y2 - Chip type light emitting diode - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type light emitting diode, and more particularly to a light emitting diode of three colors of red, green and blue (hereinafter abbreviated as "LED"), and an LED element of each color. Chip type LE that can emit multicolor light including white by incorporating a resistor corresponding to
D.

2. Description of the Related Art A conventional chip-type LED is shown in FIGS. The LED shown in FIG. 4 has a pair of electrode patterns 2 and a through-hole electrode 3 formed on an insulating substrate 1,
Further, the LED element 5 is mounted on one electrode pattern 2, connected to the other electrode pattern 2 via a wire 6, and sealed with a translucent resin 7. In addition, the LED shown in FIG. 5 is different from the LED shown in FIG.
Two sets are provided above and two sets of resistors are provided.
That is, two pairs of electrode patterns 2 and through-hole electrodes 3
, Two LED elements 5, two wires 6 connected to these, and two resistors 4.

[0003]

In recent years, applications of this type of chip type LED have been widened, and accordingly, various emission colors and emission forms are required.

However, in the LED shown in FIG. 4, since only one LED element 5 is mounted, the LED emits light of only one color and cannot emit light of multiple colors. For this reason, multicolor light emission cannot be achieved unless a plurality of LEDs having the same structure and different emission colors are used.

Also, in the LED shown in FIG. 5, since the number of mounted LED elements 5 is two, two-color light emission is possible. However, multicolor light emission including white light emission cannot be performed. could not. Therefore, this LED is usually used so that either one of the LED elements is turned on.

An object of the present invention is to mount three color LEDs of red, green, and blue in a state where each light emission can be controlled, so that one chip LED can emit multicolor light including white light. It is an object of the present invention to provide a chip type LED with a built-in resistor, which can easily realize the above.

[0007]

SUMMARY OF THE INVENTION A chip type LED according to the present invention.
Is formed substantially in the center of the upper surface of the insulating substrate and the insulating substrate.
A first electrode pattern and a periphery of the first electrode pattern
Second to fourth electrode patterns formed in
Corresponding to the vicinity of the fourth electrode pattern
The fifth to seventh electrode patterns formed in
A first electrode pattern formed on the outer periphery of the substrate and
Connected to the fifth to seventh electrode patterns, respectively.
First to fourth terminal electrodes, and on the first electrode pattern
Arranged at the approximate center of the insulating substrate.
And the second to fourth electrode pads respectively.
Red, green and blue light emitting dies connected to the turn
Ode element, the second to fourth electrode patterns, and
Between the fifth and seventh electrode patterns respectively corresponding to
And are supplied to each light emitting diode element
Three resistors each for limiting a current, and the insulating substrate
Formed on the upper surface of the substrate to seal the light emitting diode element
And a translucent resin .

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the chip type LED of the present invention, each LED element is provided with a resistor, respectively.
It is configured so that voltage can be applied to each LED element
To adjust the resistance value of each resistor or through each resistor
To control the voltage applied to each LED element.
It can, thereby red, green, it is possible to control an emission color quantity of each LED element blue. Therefore, by controlling the amount of light of the emission color, white,
Red, orange, yellow, green, blue, and violet light can be emitted.

Further , the LED element is placed on the central electrode pattern.
And arrange them so that resistors are lined up around them
So that the light-emitting part is
Is sufficient when the LED elements are turned on at the same time.
Light is mixed with the color of the
Change of light emitting position when LED elements are individually lit
It looks like it always emits light at the same position
Can be.

[0010]

FIG. 1 shows a chip type LE according to an embodiment of the present invention.
FIG. 3 is a perspective view showing D, and FIG. 3 is a circuit diagram thereof. FIG.
Is formed of an alumina substrate, a glass epoxy substrate, or the like, and an electrode pattern and a through-hole electrode are formed on the surface thereof by printing or plating wiring.

The electrode patterns include an electrode pattern 2a formed substantially at the center of the upper surface of the insulating substrate 1, electrode patterns 2b to 2d formed therearound, and an electrode pattern 2e provided near the electrode patterns 2b to 2d. To 2 g.

The through-hole electrodes are formed on the outer periphery of the insulating substrate 1 and include through-hole electrodes 3a, 3e to 3g connected to the electrode patterns 2a, 2e to 2g, respectively. This through-hole electrode is a chip type L
When the ED is mounted on a circuit board or the like, it is used as a terminal electrode that is electrically and mechanically connected by solder or the like.

The current limiting resistor may be ruthenium oxide,
Made of carbon or the like, between the electrodes 2b and 2e,
The resistors 4R, 4G, and 4B are formed between the electrodes f and the electrodes 2d and 2g, respectively.

Each of which emits red, green and blue light, respectively.
Each of the LED elements 5R, 5G, and 5B is bonded on the electrode 2a using a conductive adhesive such as a silver paste.
The LED elements 5R, 5G, and 5B are connected to the electrode patterns 2b to 2d by wires 6R, 6G, and 6B made of gold, aluminum, or the like.

The translucent resin 7 includes LED elements 5R, 5G,
5B, the wires 6R, 6G, 6B and the like are provided for sealing and protecting, and are formed on the upper surface of the insulating substrate 1.

In the chip type LED of this embodiment, the connection is made as shown in FIG.
By adjusting the resistance values R1, R2, R3 of G, 6B or controlling the voltages Vcc1, Vcc2, Vcc3 respectively applied to the LED elements 5R, 5G, 5B, the light emission amount of each LED element can be adjusted. it can. In this way, by adjusting the amount of red, green, and blue light emitted,
Various luminescent colors can be obtained.

FIG. 2 is a perspective view showing a partially modified example of the chip type LED shown in FIG. As shown in the figure, this chip-type LED is obtained by attaching a reflection frame 8 made of white plastic to the upper part of the chip-type LED shown in FIG. The reflection frame 8 is for irradiating light only in a desired direction. In the illustrated example, the light radiated to the side is reflected by an inner slope and radiated upward in the drawing. .

[0018]

According to the present invention, by changing the applied voltage or the resistance value of the built-in resistor, it is possible to emit multicolor light including white light with one chip type LED. It is possible to easily realize multi-color electronic devices that require miniaturization and high-density mounting.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a chip type LED according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a partially modified example of the chip-type LED shown in FIG.

FIG. 3 is a circuit diagram of the chip type LED shown in FIG. 1;

FIG. 4 is a perspective view showing a conventional chip-type LED.

FIG. 5 is a perspective view showing a conventional chip-type LED.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating board 2a-2g Electrode pattern 3a, 3e-3g Through-hole electrode 4R, 4G, 4B Resistor 5R, 5G, 5B LED element 6R, 6G, 6B Wire 7 Transparent resin 8 Reflection frame

Claims (1)

(57) [Scope of request for utility model registration] 1. An insulating substrate and a first electrode pattern formed substantially at the center of the upper surface of the insulating substrate.
And the second to fourth layers formed around the first electrode pattern.
Corresponding to each of the electrode patterns, in the vicinity of the second to fourth electrode patterns
Fifth to seventh electrode patterns formed on the insulating substrate and the first electrode pattern formed on the outer periphery of the insulating substrate.
And the fifth to seventh electrode patterns, respectively.
The first to fourth terminal electrodes connected to each other and the first electrode pattern,
It is arranged at the approximate center of the insulating substrate and
Red, green connected to the second to fourth electrode patterns
And blue light-emitting diode elements, and the second to fourth electrode patterns and corresponding to them, respectively.
Between the fifth and seventh electrode patterns to be formed.
And the current supplied to each light emitting diode element
Three limiting resistors and the light emitting diode formed on the upper surface of the insulating substrate
Chip type light emitting diode, wherein the light-transmitting resin for sealing the element, in that it consists of.