JPH04307975A - Optical device - Google Patents

Abstract

PURPOSE:To dispense with a confirming work of the mounting directions of external connection terminals and to make it possible to mount the external connection terminals to each equipment used without minding the polarities of the terminals by a method wherein a plurality of the external connection terminals of same polarity are respectively provided, and arranged in the direction diagonal to each other and the polarities are put in a rotationally symmetrical state. CONSTITUTION:First and second leas parts 16 and 17 for mounting use of a lead frame 2 for mounting use are respectively arranged in the direction diagonal to each other. A lead frame 14 for connection use is provided with first and second lead frames 18 and 19 for connection use led out in the two directions different from the directions of the lead parts 16 and 17. A light- emitting diode 11 is die-bonded and mounted on a head part 15 of the lead frame 12. Then, after the lead frames 12 and 14 are arranged in such a way that their polarities are located at positions in symmetry of rotation, the diode 11 and a first connection part 18a of the lead frame 18 are connected with each other by a bonding wire 13. Moreover, the connection part 18a and the lead part 19 are connected with each other by a connection material 21.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device equipped with external connection terminals.

0002

[Prior Art] Generally, light-emitting elements such as light-emitting diodes and light-receiving elements such as photodiodes and phototransistors used in optical devices have polarities such as anode and cathode, collector and emitter, and are used in various control equipment. If the device is installed in a

[0003] In optical devices according to the prior art, there are two types of optical devices: one method uses a lead frame to electrically connect the optical element to the outside, and the other method uses a pattern plated substrate to electrically connect the optical element to the outside.

FIG. 8 shows an example of the internal structure of a conventional optical device using a lead frame. An optical element 2 (diode chip) is mounted on one lead frame 1 for mounting, and is electrically connected to a cathode section at the bottom of the chip 2. The other lead frame 3 for connection is
It is electrically connected to an anode electrode provided on the top of the chip 2 by a bonding wire 4. The periphery of these mechanisms is molded with translucent resin to form a peripheral device, resulting in the final product. In this case, attachment to various control devices is performed using lead portions that protrude from the resin envelope.

FIG. 9 shows the internal structure of a conventional light emitting device using a pattern plated substrate. In this case, plating patterned portions 6 and 7 on the substrate 5
is divided into two parts, the chip 2 is mounted on one of the plating patterns 6, and the lower cathode portion of the chip 2 is electrically connected to the plating pattern 6. The other plating pattern 7 is electrically connected to an anode electrode provided on the top of the chip 2 by a bonding wire 4.

[0006]Then, the periphery of these mechanisms provided on the upper part of the substrate 5 is molded with a translucent resin to form an outer casing, resulting in a final product.

[0007] In this case as well, attachment to various control devices is carried out using the edges of the plating pattern on the substrate that protrude from the resin envelope.

[0008]

However, with the structure of the optical device according to the prior art as described above, it is difficult to completely avoid attaching the optical device to various control devices with incorrect polarity. And if it is installed in the opposite direction, it will not function properly. Therefore, it is necessary to check the mounting direction, which increases the number of steps and makes the work complicated.

SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide an optical device that can be attached to various types of equipment without worrying about polarity.

0010

[Means for Solving the Problems] A means for solving the problems according to claim 1 of the present invention, as shown in FIGS. 1 to 7, includes an optical element 11, an external connection terminal 12 for mounting the optical element 11, and In an optical device including an external connection terminal 14 for connection, which is connected to the optical element 11 via a bonding wire 13 in a non-contact manner to the external connection terminal 12, the external connection terminal 12 for mounting is connected to the external connection terminal 14 when the optical element 11 is mounted. A first lead part 16 for mounting and a second lead part 17 for mounting are drawn out from the head part 15 in mutually different directions. It comprises a first lead part 18 for connection and a second lead part 19 for connection, which are drawn out in two directions different from the lead parts 16, 17 for connection, and between the two lead parts 18, 19 for connection, A connection body 21 is provided which connects both the connection lead parts 18 and 19 to each other while maintaining a non-contact state with the external connection terminal 12, and the both mounting lead parts 16,
17 are arranged diagonally to each other, and both the connection lead parts 18 and 19 are arranged diagonally to each other in a diagonal direction different from both mounting lead parts 16 and 17, so that each polarity is 1.
They are arranged to have rotational symmetry at 80 degrees.

[0011] According to a second aspect of the present invention, as shown in FIGS. 1 to 3, the connection body 21 according to the first aspect is made of a bonding wire that connects both connection lead portions 18 and 19.

The means for solving the problem according to claim 3 of the present invention is that, as shown in FIGS. It is what it is.

The means for solving the problem according to claim 4 of the present invention, as shown in FIG.
A bonding wire 13 is connected to the optical element 11 in a non-contact manner.
In the optical device, the mounting external connection terminal 12 is connected to a head portion 15 on which the optical element 11 is mounted, and to the head portion 1.
It consists of four mounting lead parts 16, 17, 35, and 36 drawn out in all directions from the first mounting lead part 1 at 90 degrees phase with each other.
6, 17, 35, 36 and 90° phase with each other and drawn out in all directions.
, 37, 38, and the wiring lead parts 18, 1
9, 37, 38, while maintaining a non-contact state with the external connection terminal 12, the wiring lead portions 18, 19, 37, 3
A connecting body 21 is provided for connecting 8 to each other, and each polarity is 9 to 9.
They are arranged so that they are rotationally symmetrical at 0°.

[0014]

[Operation] In the means for solving the problem according to claims 1 to 4, the polarity of the lead frames 12 and 14 of the optical device are arranged in rotationally symmetrical positions when the optical device is attached to various types of equipment. , mounting the optical device in a different direction does not result in a change in its polar arrangement. Therefore, even if the polarity of the optical device is not concerned at all, it is possible to prevent the optical device from being attached with each polarity reversed.

[0015]

[Embodiment] An embodiment of the present invention will be described below with reference to FIG.

First Embodiment FIG. 1 is a perspective view showing the internal structure of an optical device according to a first embodiment of the present invention. As shown in the figure, the optical device of this embodiment includes an optical element 11 and an external connection terminal for mounting (lead frame) on which the optical element 11 is mounted.
12, and a connecting external connecting terminal (lead frame) 14 which is not in contact with the mounting external connecting terminal 12 and is connected to the optical element 11 via a bonding wire 13 such as a gold wire.

The optical element 11 is, for example, a light emitting diode, and has an anode electrode formed on its upper surface and a cathode electrode formed on its lower surface.

The mounting lead frame 12 includes a head portion 15 on which the light emitting diode 11 is mounted, and a first mounting lead portion 16 and a second mounting lead portion 17 that are pulled out from the head portion 15 in different directions. It consists of
The first mounting lead part 16 and the second mounting lead part 17 are arranged diagonally to each other. The head portion 15
The cathode electrode of the light emitting diode 11 is directly die-bonded.

The wiring lead frame 14 includes a first wiring lead part 18 and a second wiring lead part 19 which are drawn out in two directions different from the mounting lead parts 16 and 17.

A first connection portion 18a is formed at the end of the first connection lead portion 18 close to the light emitting diode 11, to which the anode electrode on the top surface of the light emitting diode 11 is connected via the bonding wire 13. There is. Both connection lead parts 18 and 19 are connected to mounting lead parts 16 and 1.
They are arranged diagonally to each other in diagonal directions different from 7.

Between the two connection lead parts 18 and 19,
A bonding wire 21 is provided as a wire connection body that connects both wire connection lead portions 18 and 19 to each other while maintaining a non-contact state with the mounting lead frame 12.

In the above structure, when manufacturing an optical device, first, the light emitting diode 11 is die-bonded and mounted on the head portion 15 of the mounting lead frame 12. and,
The mounting lead frame 12 and the connection lead frame 14 are positioned as shown in FIG. 1, and the light emitting diode 11 and the first connection part 18a of the connection lead frame 14 are
While connecting with the bonding wire 13, the first connection portion 18a and the second connection lead portion 19 are connected to the connection body 21.
Connect at. Thereafter, after molding with a transparent resin (not shown), an outer shell is formed, and the optical device is completed.

[0023] Furthermore, when attaching to various control equipment, each lead frame 12, 14 is attached to a predetermined mounting board.

At this time, the lead frame 12 of the optical device
, 14 are arranged in rotationally symmetrical positions, the optical device is placed in the opposite direction, that is, in the horizontal direction.
Even if it is attached with a 0° rotation, the polarity arrangement will not change. Therefore, even if the polarity of the optical device is not concerned at all, it is possible to prevent the optical device from being attached with each polarity reversed. Therefore, there is no need to confirm the direction of the optical device, and the speed at which the optical device is attached can be increased.

[0025] In this case, all lead frames 1
2 and 14 may be fixed by soldering to the mounting board of various devices used, or alternatively, only one terminal of each lead frame 12 and 14 may be connected, and the other terminal may be insulated and fixed mechanically. Just do it.

Furthermore, there is no need to align the polarities when packing surface-mounted optical devices with taping, which simplifies the work.

Second Embodiment FIG. 2 is a perspective view showing the internal structure of an optical device according to a second embodiment of the present invention. As shown,
The optical device of this embodiment has an external connection terminal 12 (wiring pattern) for mounting and an external connection terminal 1 for connection on an insulating substrate 31.
4 (wiring pattern) is printed and wired, and a light emitting diode 11 is mounted on the wiring pattern 12 for mounting. Then, the mounting wiring pattern 1
2 and the wiring pattern 14 for connection are the same as in the first embodiment, and the same bonding wire 21 as in the first embodiment is used for the connection body.

[0028] Also in this embodiment, since both polarities are arranged in rotationally symmetrical positions, the same effects as in the first embodiment can be achieved when mounted on the equipment in use.

Third Embodiment FIG. 3 is a perspective view showing the internal structure of an optical device according to a third embodiment of the present invention. As shown in the figure, in the optical device of this embodiment, the connection body 21 is a pair of bonding bodies that connect the connection portions of the first connection lead portion 18 and the second connection lead portion 19 and the anode electrode of the light emitting diode 11. It is composed of wires 13 and 22. By connecting the bonding wires 13 and 22 in parallel around the light emitting diode 11 in this way,
First lead part 18 for connection and second lead part 19 for connection
are connected to each other.

The other configurations are the same as in the first embodiment, and the same effects as in the first and second embodiments can be achieved.

<Fourth Embodiment> FIG. 4 is a perspective view showing the internal structure of an optical device according to a fourth embodiment of the present invention. As shown,
The connection body of the optical device of this embodiment includes a conductive piece 21 that is three-dimensionally routed so as to avoid the mounting lead frame 12.
The conductive piece 21 and the connection lead frame 14 are formed by bending a single metal piece. It is routed directly under the head section 15 of the head.

Both lead frames 12 and 14 are positioned by the translucent resin during molding.
The dielectric strength voltage is maintained well.

Other configurations are the same as in the first embodiment,
The same effects as in the first to third embodiments can be achieved.

<Fifth Embodiment> FIG. 5 is a perspective view showing the internal structure of an optical device according to a fifth embodiment of the present invention. As shown in the figure, the optical device of this embodiment has a wiring pattern 12 for mounting and a wiring pattern 14 for connection printed on an insulating substrate 31 by plating printing, and a first lead for connection of the wiring pattern 14 for connection. A conductive piece 21 serving as a connection body for connecting the portion 18 and the second connection lead portion 19 is routed three-dimensionally avoiding the head portion 15 of the mounting wiring pattern 12.

The mounting wiring patterns 12 and 14 are formed on the upper surface of the insulating substrate 31. On the other hand, the connection body 21 is formed by being routed from each end of the connection leads 18 and 19 close to the light emitting diode 11 to the lower surface of the insulating substrate 31 through a portion S such as a through hole of the insulating substrate 31. There is.

[0036] In this embodiment as well, the same effects as in each of the above embodiments can be achieved.

<Sixth Embodiment> FIG. 6 is a perspective view showing the internal structure of an optical device according to a sixth embodiment of the present invention. As shown,
In the optical device of this embodiment, connection terminals of the same pattern are formed on all four sides of the insulating substrate 31, and the light emitting diode 11 is mounted on the insulating substrate 31, which is square in plan view. The wiring pattern 12 and the connection wiring pattern 14 which is connected to the light emitting diode 11 via the bonding wire 13 are pattern-wired by glazing printing, and the mounting wiring pattern 12 is connected to the head portion 15 on which the light emitting diode 11 is mounted. , four mounting lead parts 16, 17, 35, and 36 are drawn out from the head part 15 in four directions with a phase of 90 degrees to each other. 17, 35, 36 and 90° phase with each other and drawn out in all directions.
9, 37, 38, and the wiring lead portions 18, 19
, 37, 38, the wiring lead parts 18, 19, 37, 3 are connected while maintaining a non-contact state with the mounting wiring pattern 12.
A wire connection body 21 is provided for connecting the wires 8 to each other.

[0038] The mounting lead portions 16, 17, 35, 3
6 is from the head portion 15 at the center of the upper surface of the insulating substrate 31;
Wiring pattern 1 for connection through part S of through hole etc.
4, it is routed three-dimensionally toward the lower surface side, and is further extended to the side surface of the substrate 31 to form a pattern.

The connection body 21 is formed in an opening shape on the upper surface of the insulating substrate 31 so as to surround the head portion 15 of the mounting wiring pattern 12, and is connected to the anode electrode on the upper surface of the light emitting diode 11 via the bonding wire 13. wired. And each connection lead part 18, 19, 37, 3
8 is drawn out from the connection portion 41 on the upper surface of the insulating substrate 31.

[0040] In the above configuration, when installing the optical device to various control equipment, the polarity of the wiring pattern of the optical device is arranged so as to be rotationally symmetrical at 90°, so the polarity can be checked in any of the four directions. Can be installed without any installation. Therefore, the same effects as those of the above embodiments can be achieved.

It should be noted that the present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.

For example, in addition to the above-mentioned embodiments, it is also possible to create an optical device of the tamper pattern type, as shown in FIG. 7, using the same wire connection body 21 as in the third embodiment.

In addition, mounting wiring pattern 1 of the sixth embodiment
2. It goes without saying that the same effect can be achieved by forming each lead frame with a metal piece having the same pattern shape as the wiring pattern 14 for connection, and then molding the lead frame with resin.

Further, in the above structure, a light emitting diode is used as an example of the light emitting element, but a photodiode or an open electrode bipolar phototransistor or the like may also be used.

[0045]

As is clear from the above description, according to claims 1 to 4 of the present invention, a plurality of external connection terminals of the same polarity are provided and arranged diagonally, and each polarity is rotationally symmetrical. Therefore, even if the optical device is mounted in a different direction, the polarity arrangement will not change, and even if the polarity of the optical device is not concerned at all, it is possible to prevent each polarity from being mounted in the opposite direction. Therefore, there is no need to confirm the direction of the optical device, and the speed at which the optical device is attached can be increased.

Furthermore, there is no need to align the polarities when packing the optical device with taping, which has the advantage of simplifying the work.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the internal structure of an optical device according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing the internal structure of an optical device according to a second embodiment of the present invention.

FIG. 3 is a perspective view showing the internal structure of an optical device according to a third embodiment of the present invention.

FIG. 4 is a perspective view showing the internal structure of an optical device according to a fourth embodiment of the present invention.

FIG. 5 is a perspective view showing the internal structure of an optical device according to a fifth embodiment of the present invention.

FIG. 6 is a perspective view showing the internal structure of an optical device according to a sixth embodiment of the present invention.

FIG. 7 is a perspective view showing the internal structure of another optical device of the present invention.

FIG. 8 is a perspective view showing an example of the internal structure of a conventional optical device.

FIG. 9 is a perspective view showing another example of the internal structure of a conventional optical device.

[Explanation of symbols]

11 Optical element 12 External connection terminal for mounting 13
Bonding wire 14
External connection terminal 15 for wiring
Head parts 16, 17, 35, 36 Mounting lead parts 18, 19, 37, 38 Wiring lead part 21 Wiring body

Claims (4)

[Claims] 1. An optical element, an external connection terminal for mounting on which the optical element is mounted, and an external connection terminal for connection that is not in contact with the external connection terminal for mounting and is connected to the optical element via a bonding wire. In the optical device, the external connection terminal for mounting is connected to a head portion on which the optical element is mounted, and a first lead portion for mounting and a second lead portion for mounting that are pulled out from the head portion in mutually different directions. Becomes,
The external connection terminal for connection includes a first lead part for connection and a second lead part for connection, which are drawn out in two directions different from the lead parts for both mounting, and between the two lead parts for connection, A connection body is provided for connecting both connection lead parts to each other while maintaining a non-contact state with the mounting external connection terminal, and both mounting lead parts are arranged diagonally to each other, and both connection leads are arranged diagonally to each other. An optical device characterized in that the parts are arranged diagonally to each other in a diagonal direction different from that of both mounting lead parts, so that each polarity is rotationally symmetrical at 180 degrees. 2. An optical device according to claim 1, wherein the connection body comprises a bonding wire that connects both connection lead portions. 3. An optical device according to claim 1, wherein the connection body comprises a conductive piece that is three-dimensionally routed so as to avoid an external connection terminal for mounting. 4. An optical element, an external connection terminal for mounting on which the optical element is mounted, and an external connection terminal for connection that is not in contact with the external connection terminal for mounting and is connected to the optical element via a bonding wire. In the optical device, the external connection terminal for mounting consists of a head portion on which the optical element is mounted, and four mounting lead portions drawn out from the head portion in four directions with a phase of 90 degrees to each other, The external connection terminal for wiring is provided with four wiring lead parts drawn out in all directions in phase with the first lead part for mounting and 90 degrees to each other, and the external connection terminal for wiring is provided with the An optical device characterized in that a wire connection body is provided for connecting wire connection lead portions to each other while maintaining a non-contact state with an external connection terminal, and is arranged so that each polarity is rotationally symmetrical at 90 degrees.