JP2997578B2 - Semiconductor photoelectric conversion device - Google Patents
Semiconductor photoelectric conversion deviceInfo
- Publication number
- JP2997578B2 JP2997578B2 JP23952691A JP23952691A JP2997578B2 JP 2997578 B2 JP2997578 B2 JP 2997578B2 JP 23952691 A JP23952691 A JP 23952691A JP 23952691 A JP23952691 A JP 23952691A JP 2997578 B2 JP2997578 B2 JP 2997578B2
- Authority
- JP
- Japan
- Prior art keywords
- leads
- light
- interrupter
- photo
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体光電変換装置に係
わり、フォトインタラプタの改良に関するもので、特に
カメラ、ＯＡ機器等に内蔵され、物体検出する場合に使
用されるものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor photoelectric conversion device, and more particularly to an improvement in a photo-interrupter, which is incorporated in a camera, OA equipment, etc., and is used for detecting an object.
【０００２】[0002]
【従来の技術】この種の装置において、発光チップ（Ｌ
ＥＤ）と受光チップをそれぞれリードに搭載し、赤外光
に透明な樹脂で一次モールドし、これら一次モールドさ
れた発光素子と受光素子を、隙間をおき、光軸を一致さ
せ、対向させて遮光性樹脂で二次モールドし、一体化さ
れた透過型フォトインタラプタを図１２と図１３に示
す。ここで図１２（ａ）は発光素子１側の上面図、図１
２（ｂ）は同平面図、図１２（ｃ）は受光素子２側の上
面図、図１２（ｄ）は同平面図である。ここで３−１，
３−２は一次モールド樹脂、４−１，４−２はスリット
形成部（光が出入するところ）、５はリードフレーム、
９は二次モールド樹脂である。2. Description of the Related Art In this type of device, a light emitting chip (L
ED) and a light receiving chip are mounted on leads, respectively, and are primarily molded with a resin transparent to infrared light. The light emitting element and the light receiving element which have been primary molded are spaced, the optical axes are aligned, and the light is shielded by facing each other. FIGS. 12 and 13 show a transmission type photointerrupter which has been secondary-molded with a conductive resin and integrated. Here, FIG. 12A is a top view of the light emitting element 1 side, and FIG.
2 (b) is a plan view, FIG. 12 (c) is a top view on the light receiving element 2 side, and FIG. 12 (d) is a plan view. Where 3-1
3-2 is a primary mold resin, 4-1 and 4-2 are slit forming portions (where light enters and exits), 5 is a lead frame,
9 is a secondary mold resin.
【０００３】図１２のものを得るには、発光素子（ＬＥ
Ｄチップ）１、受光素子（受光チップ）２をリードフレ
ーム５の所定の位置のベッド上にダイボンディング、ワ
イヤー７−１，７−２のボンディングを行ない、赤外光
に透明な樹脂３−１，３−２で、光が出入するスリット
形成部４−１，４−２をそなえた形状に一次モールドす
る。次に図１３に示すように、発光素子１と受光素子２
を、リード端子を同一方向に向けて、光軸８が一致する
ように対向させて二次モールド用の金型に設置する。こ
の二次モールド用金型は、発光素子１と受光素子２を一
つのパッケージに組み込んで遮光性の樹脂９でモールド
するためのもので、このモールドでフォトインタラプタ
１０の外囲器（パッケージ）９とスリット４−１，４−
２と被検出物通過ギャップ１１が形成される。In order to obtain the device shown in FIG. 12, a light emitting device (LE
D chip 1 and a light receiving element (light receiving chip) 2 are die-bonded on a bed at a predetermined position of a lead frame 5 and wires 7-1 and 7-2 are bonded, and a resin 3-1 transparent to infrared light is formed. , 3-2, the primary molding is performed into a shape having slit forming portions 4-1 and 4-2 through which light enters and exits. Next, as shown in FIG.
Are placed in a mold for secondary molding with the lead terminals facing in the same direction and facing each other so that the optical axes 8 coincide. This mold for secondary molding is for incorporating the light emitting element 1 and the light receiving element 2 into one package and molding the same with a light-shielding resin 9. And slits 4-1 and 4-
2 and an object passage gap 11 are formed.
【０００４】図１３（ａ），（ｂ），（ｃ）は上記二次
モールド後、リードカットされた最終形状の斜視図、縦
断面図、横断面図であるが、フォトインタラプタ１０が
実装される基板１２に対し、光軸８が平行な位置関係の
パッケージ構造になっていた。１３は金型への一次モー
ルド素子セット時に素子を押さえつける穴（スリット部
４−２に樹脂９が囲り込まないように一次モールド素子
を押さえつけるピンが出入する穴）である。FIGS. 13 (a), 13 (b) and 13 (c) are a perspective view, a longitudinal sectional view and a transverse sectional view, respectively, of the final shape which has been lead-cut after the above-mentioned secondary molding, in which the photo interrupter 10 is mounted. The package structure has an optical axis 8 parallel to the substrate 12. Reference numeral 13 denotes a hole for holding down the element when the primary mold element is set in the mold (a hole through which a pin for holding down the primary mold element so that the resin 9 does not surround the slit portion 4-2).
【０００５】[0005]
【発明が解決しようとする課題】図１４，図１５は従来
例の不具合を説明するためのもので、図１４（ａ）は被
検出物１４の通過検出側、図１４（ｂ）は被検出物１５
の通過とその孔１６の数を検出する例である。即ち一般
的には、フォトインタラプタ１０が基板１２に実装され
た場合、図１３の光軸８が基板１２に対して平行にな
り、被検出物１４または１５が光軸を横切って検出され
るためには、基板１２に対して被検出物１４または１５
が垂直に立って平行移動または垂直に立って円弧状の動
きをすることになる。このため機器の部品セット構成
上、被検出物が基板１２に対し垂直に位置するのではな
く、水平に位置せざるを得ない場合、従来のフォトイン
タラプタ１０の形状は不便で、図１５の如くユーザ側で
インタラプタ１０を横寝せ（光軸を基板に対し垂直）に
して使わざるを得ない。そのため余分なスペースを確保
してインタラプタ１０用に別基板１７を設けたり、フレ
キシブル基板（基板１７がフレキシブルの場合）に半田
実装して引き廻したりしていた。１８は被検出物１４の
移動方向を示す記号である。FIGS. 14 and 15 are diagrams for explaining the disadvantages of the conventional example. FIG. 14 (a) shows the passage detecting side of the object 14, and FIG. Object 15
In this example, the number of holes 16 and the number of holes 16 are detected. That is, generally, when the photointerrupter 10 is mounted on the substrate 12, the optical axis 8 in FIG. 13 is parallel to the substrate 12, and the object 14 or 15 is detected across the optical axis. The object 14 or 15 with respect to the substrate 12
Will stand upright and make a parallel movement or stand upright and make an arcuate movement. For this reason, in the case where the object to be detected must be located not horizontally but vertically with respect to the substrate 12 due to the component set configuration of the device, the conventional photointerrupter 10 is inconvenient in shape, as shown in FIG. The user must use the interrupter 10 lying down (the optical axis is perpendicular to the substrate). Therefore, a separate board 17 is provided for the interrupter 10 by securing an extra space, or the board is soldered and mounted on a flexible board (when the board 17 is flexible). Reference numeral 18 is a symbol indicating the moving direction of the detection object 14.
【０００６】図１６〜図１９は、受光素子２が、シュミ
ット回路を含む受光ＩＣチップの場合の従来例である。
即ち受光ＩＣチップでは、物体の通過検出をオン，オフ
（論理値）判定で行なう。つまり物体の通過検出したこ
とを一方の論理に対応させ、通過非検出を他方の論理に
対応させる判定を行なうが、この判定に、シュミット回
路などによりヒステリシス特性をもたせておくと、上記
検出、非検出間のチャンタリングが防止できる。FIGS. 16 to 19 show a conventional example in which the light receiving element 2 is a light receiving IC chip including a Schmitt circuit.
That is, in the light receiving IC chip, detection of passage of an object is performed by on / off (logical value) determination. In other words, it is determined that the detection of the passage of an object corresponds to one logic and the detection of non-passage corresponds to the other logic. If this determination is given a hysteresis characteristic by a Schmitt circuit or the like, the above detection, Chantering between detections can be prevented.
【０００７】図１６（ａ）は発光素子１側の上面図、図
１６（ｂ）は同平面図、図１６（ｃ）は受光素子（受光
ＩＣチップ）２側の上面図、図１６（ｄ）は同平面図で
ある。図１７（ａ），（ｂ），（ｃ）は二次モールド
後、リードカットされた最終形状の斜視図、縦断面図、
横断面図である。図１８，図１９はこの従来例の不具合
点の説明図である。FIG. 16A is a top view of the light emitting element 1 side, FIG. 16B is a plan view of the same, FIG. 16C is a top view of the light receiving element (light receiving IC chip) 2 side, and FIG. ) Is the same plan view. FIGS. 17 (a), (b) and (c) are a perspective view, a longitudinal sectional view, and a cross-sectional view of the final shape which is lead-cut after the secondary molding.
FIG. FIGS. 18 and 19 are explanatory views of the disadvantages of this conventional example.
【０００８】図１２〜図１５の従来例と図１６〜図１９
の従来例の相異点は、後者の従来例では受光側に３本の
リード５が必要であり、これらリード５と受光ＩＣチッ
プ２の主表面間をつなぐボンディングワイヤ７−２も３
本必要となる点であるが、欠点は、前者の従来例と同様
である。FIGS. 12 to 15 show a conventional example and FIGS.
The difference of the conventional example is that the latter conventional example requires three leads 5 on the light receiving side, and the bonding wires 7-2 connecting these leads 5 and the main surface of the light receiving IC chip 2 also have three wires.
This is a necessary point, but has the same disadvantages as the former conventional example.
【０００９】[0009]
【課題を解決するための手段と作用】そこで本発明の目
的は、フォトインタラプタの実装基板に対し、光軸を垂
直にして簡単に実装できる半導体光電変換装置を提供す
ることにある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a semiconductor photoelectric conversion device which can be easily mounted with a vertical optical axis on a mounting substrate of a photointerrupter.
【００１０】本発明は、発光素子、受光素子と、これら
各素子を、これら各素子間の光軸を一致させた状態でそ
れぞれ搭載する第１，第２のリード、及び前記各素子に
それぞれ電気的に接続する第３，第４のリードと、前記
各素子を、これら各素子間に被検出物体が通過可能にそ
れぞれ被覆する透明性樹脂と、該樹脂及び前記第１ない
し第４のリードの一部を被覆する遮光性樹脂とを有した
フォトインタラプタと；該フォトインタラプタを、前記
光軸がフォトインタラプタ取付面に交差する方向に取り
付けるフォトインタラプタ取付体とを具備したことを特
徴としている。また本発明は、発光素子、受光素子と、
これら各素子を、これら各素子間の光軸を一致させた状
態でそれぞれ搭載する第１及び第２のリード、前記各素
子にそれぞれ電気的に接続された第３及び第４，第５の
リードと、前記各素子を、これら各素子間に被検出物体
が通過可能にそれぞれ被覆する透明性樹脂と、該樹脂及
び前記第１ないし第５のリードの一部を被覆する遮光性
樹脂とを有したフォトインタラプタと；該フォトインタ
ラプタを、前記光軸がフォトインタラプタ取付面に交差
する方向に取り付けるフォトインタラプタ取付体とを具
備したことを特徴としている。According to the present invention, there are provided a light emitting element, a light receiving element, and first and second leads for mounting each of these elements with their optical axes aligned with each other, and electrical connection to each of the elements. Third and fourth leads that are electrically connected to each other, a transparent resin that covers each of the elements so that an object to be detected can pass between the elements, and the resin and the first and fourth leads. A photointerrupter having a light-shielding resin that partially covers the photointerrupter; and a photointerrupter mounting body for mounting the photointerrupter in a direction in which the optical axis intersects the photointerrupter mounting surface. Also, the present invention provides a light emitting element, a light receiving element,
First and second leads for mounting each of these elements with their optical axes aligned, and third, fourth, and fifth leads electrically connected to each of the elements, respectively. A transparent resin that covers each of the elements so that an object to be detected can pass between the elements, and a light-shielding resin that covers the resin and a part of the first to fifth leads. And a photointerrupter mounting body for mounting the photointerrupter in a direction in which the optical axis intersects the photointerrupter mounting surface.
【００１１】即ち本発明は、パッケージの樹脂内でリー
ド形状を工夫することにより、フォトインタラプタの実
装基板に対し光軸を垂直にして簡単に実装でき、かつ図
１５，図１９の別基板１７等を用いる必要をなくし、実
装スペースの縮小化も可能とした形状で、前記基板に対
し平行化された状態で移動してくる被検出物を容易に検
出できるようにしたものである。That is, according to the present invention, by devising the lead shape in the resin of the package, the optical interrupter can be easily mounted with the optical axis perpendicular to the mounting substrate of the photointerrupter, and the separate substrate 17 shown in FIGS. And a shape enabling the mounting space to be reduced, so that an object to be detected that moves in a state parallel to the substrate can be easily detected.
【００１２】[0012]
【実施例】以下図面を参照して本発明の実施例を説明す
る。図１（ａ）は同実施例の斜視図、図１（ｂ）は同断
面図、図１（ｃ）は同正面図である。図２は図１の実施
例の１次モールド後の構成で、図２（ａ）は同構成の発
光側の上面図、図２（ｂ）は同平面図、図２（ｃ）は受
光側の上面図、図２（ｄ）は同平面図である。これら図
において前記従来例と対応する箇所には同一符号を用い
る。５−１，５−２は発光素子１、受光素子２間の光軸
８を一致させた状態でそれぞれ搭載するリード、５−
３，５−４は素子１，２にそれぞれワイヤボンディング
で接続されたリードである。リード５−１〜５−４は、
はじめはリードフレーム５として一体化されている。リ
ード５−２，５−４間の末端側の間隔（例えば３．８１
mm）２１はリード５−１，５−３間の末端側の間隔（例
えば１．２７mm）２２より大で、リード５−２，５−４
は遮光性樹脂９内で、第１図（ｂ）の如く下方にフォー
ミングされ、リード５−１〜５−４はインタプラグ取付
基板１２の表面に沿い、樹脂９の表面の同方向から取り
出されている。またリード５−１〜５−４はその末端付
近で基板１２面に沿うようにフォーミングされ、インタ
ラプタ１０と共に基板面に取着されている。Embodiments of the present invention will be described below with reference to the drawings. 1A is a perspective view of the embodiment, FIG. 1B is a cross-sectional view, and FIG. 1C is a front view. 2A and 2B show a configuration after the primary molding of the embodiment of FIG. 1. FIG. 2A is a top view of a light emitting side of the same configuration, FIG. 2B is a plan view of the same, and FIG. 2D is a plan view of the same. In these figures, the same reference numerals are used for portions corresponding to the above-mentioned conventional example. 5-1 and 5-2 are leads mounted respectively with the optical axis 8 between the light emitting element 1 and the light receiving element 2 aligned.
Reference numerals 3 and 5-4 denote leads connected to the elements 1 and 2 by wire bonding, respectively. Leads 5-1 to 5-4 are
First, it is integrated as a lead frame 5. The distance on the terminal side between the leads 5-2 and 5-4 (for example, 3.81
mm) 21 is larger than the distance 22 (for example, 1.27 mm) on the terminal side between the leads 5-1 and 5-3, and the leads 5-2 and 5-4
1b is formed in the light-shielding resin 9 as shown in FIG. 1B, and the leads 5-1 to 5-4 are taken out from the same direction on the surface of the resin 9 along the surface of the interplug mounting substrate 12. ing. The leads 5-1 to 5-4 are formed near the ends thereof along the surface of the substrate 12, and are attached to the substrate surface together with the interrupter 10.
【００１３】図３は本発明の他の実施例で、図３（ａ）
は斜視図、図３（ｂ）は同断面図である。リード５−
２，５−４は樹脂９内でフォーミングされ樹脂９の一方
から外部へ導出され、リード５−１，５−３は樹脂９の
他方から外部へ導出されている。リード５−１と５−３
の間隔２２、リード５−２と５−４の間隔２１は図２の
ままでもよいが、いずれか一方に統一してもよい。リー
ド５−１〜５−４の樹脂外部でのフォーミング及び基板
１２への取付は前実施例と同様である。FIG. 3 shows another embodiment of the present invention.
Is a perspective view, and FIG. 3B is a sectional view of the same. Lead 5-
2, 5-4 are formed in the resin 9 and led out from one side of the resin 9, and the leads 5-1 and 5-3 are led out from the other side of the resin 9. Leads 5-1 and 5-3
2 and the interval 21 between the leads 5-2 and 5-4 may be the same as in FIG. 2, but may be unified to either one. The forming of the leads 5-1 to 5-4 outside the resin and the attachment to the substrate 12 are the same as in the previous embodiment.
【００１４】図４（ａ）は図１，図２の構成を得る方法
を示す。まず発光素子１，受光素子２をリード５−１，
５−２の所定位置にダイボンディング、ワイヤボンディ
ングし、赤外光に透明な樹脂３−１，３−２で一次モー
ルドする。このとき後の二次モールドでＬＥＤ光が出入
するスリットを形成できるように所望の一次モールドす
る。インナーリード部がフォーミングされた発光、受光
側は図４（ａ）の如く金型３１に設置され、ピン３２，
３３で一次モールド体３−１，３−２が相近づく方向に
押しつけられた状態で遮光性樹脂９の二次モールドが行
われる。この場合はリード５−１〜５−４はその隣接相
互間が等ピッチになるように同列に並べられ外部に取り
出されており、かつ外部でも面実装しやすいようにフォ
ーミングされている。FIG. 4A shows a method for obtaining the configuration shown in FIGS. First, the light emitting element 1 and the light receiving element 2 are connected to the leads 5-1 and 5-1.
Die bonding and wire bonding are performed at predetermined positions 5-2, and primary molding is performed with resins 3-1 and 3-2 that are transparent to infrared light. At this time, a desired primary mold is formed so that a slit through which the LED light enters and exits can be formed in the subsequent secondary mold. The light-emitting and light-receiving sides with the inner lead portions formed are set in a mold 31 as shown in FIG.
The secondary molding of the light-shielding resin 9 is performed in a state where the primary molded bodies 3-1 and 3-2 are pressed in a direction approaching each other at 33. In this case, the leads 5-1 to 5-4 are arranged in the same row so as to have the same pitch between adjacent leads, are taken out to the outside, and are formed so as to be easily surface-mounted even outside.
【００１５】図４（ｂ）は図３の構成を得る方法で、図
４（ａ）と異なる点は、リード５−１，５−３と５−
２，５−３とが互いに逆方向に導出されるように金型３
１内の配置を行う点である。FIG. 4B shows a method for obtaining the configuration shown in FIG. 3. The difference from FIG. 4A is that the leads 5-1, 5-3 and 5-
2 and 5-3 are led out in opposite directions.
1 is to perform the arrangement.
【００１６】図５は本発明の更に異なる実施例で、アウ
ターリードがフォーミングされないで平面実装される場
合を示す。この場合インタラプタ１０は基板１２の穴４
１内に嵌合されている。図５はリードを一方のみから取
り出す場合の実施例と、一方、他方の双方から取り出す
場合の実施例との両方を示している。FIG. 5 shows still another embodiment of the present invention, in which the outer leads are mounted on a plane without forming. In this case, the interrupter 10 is
1. FIG. 5 shows both the embodiment in which the lead is taken out from only one side and the embodiment in which the lead is taken out from both sides.
【００１７】図６は本発明の更に異なる実施例で、アウ
ターリードを基板１２の孔に挿通して半田５１で接続を
行って実装される場合である。この図６もリードを樹脂
９の一方のみから取り出す場合と、一方、他方の双方か
ら取り出す場合の実施例の両方を示している。FIG. 6 shows still another embodiment of the present invention, in which the outer leads are inserted into the holes of the substrate 12 and connected by soldering 51 for mounting. FIG. 6 also shows both the case where the lead is taken out from only one of the resins 9 and the embodiment where the lead is taken out from both the other.
【００１８】以上説明した如き実施例によれば、基板１
２の実装取付面に対し、光軸８を垂直にして実装できる
構造のフォトインタラプタ１０を、部品点数の削減、実
装スペースの縮小化を図った状態で実現できるものであ
る。図７〜図１１は、受光素子２が、シュミット回路を
含む受光ＩＣチップの場合の実施例で、図１６〜図１９
の従来例を改良したものである。According to the embodiment as described above, the substrate 1
The photointerrupter 10 can be mounted so that the optical axis 8 can be mounted perpendicular to the mounting surface 2 in a state where the number of components is reduced and the mounting space is reduced. 7 to 11 show an embodiment in which the light receiving element 2 is a light receiving IC chip including a Schmitt circuit.
This is an improvement of the conventional example.
【００１９】図７（ａ）は同実施例の斜視図、図７
（ｂ）は同断面図、図７（ｃ）は同正面図である。図８
は図７の実施例の一次モールド後の構成で、図８（ａ）
は同構成の発光側の上面図、図８（ｂ）は同平面図、図
８（ｃ）は受光側の上面図、図８（ｄ）は同平面図であ
る。これら図において前記実施例と対応する箇所には同
一符号を用いる。５−１，５−２は発光素子１、受光素
子（受光ＩＣチップ）２間の光軸８を一致させた状態で
それぞれ搭載するリード、５−３，５−４，５−５は素
子１，２にそれぞれワイヤボンディングで接続されたリ
ードである。リード５−２，５−４，５−５と受光素子
２の主表面間をつなぐボンディングワイヤ７−２が３本
必要となる点等は図１６〜図１９の従来例の場合と同様
である。リード５−１〜５−５は、はじめにリードフレ
ームとして一体化されている。リード５−２，５−５間
の末端側の間隔（例えば１．６mm）２１はリード５−
１，５−３間の末端側の間隔（例えば３．２０mm) ２２
より小で、リード５−２，５−４，５−５は遮光性樹脂
９内で、図７（ｂ）の如く下方にフォーミングされ、リ
ード５−１〜５−５はインタラプタ取付基板１２の表面
に沿い、樹脂９の表面の同方向から取り出されている。
またリード５−１〜５−５はその末端付近で基板１２面
に沿うようにフォーミングされ、インタラプタ１０の下
面と共に基板面に取着されている。FIG. 7A is a perspective view of the embodiment, and FIG.
FIG. 7B is a sectional view of the same, and FIG. 7C is a front view of the same. FIG.
FIG. 8A shows a configuration after the primary molding of the embodiment of FIG.
8B is a top view of the light emitting side of the same configuration, FIG. 8B is a plan view of the same, FIG. 8C is a top view of the light receiving side, and FIG. In these drawings, the same reference numerals are used for portions corresponding to the above-described embodiment. 5-1 and 5-2 are leads mounted in a state where the optical axis 8 between the light emitting element 1 and the light receiving element (light receiving IC chip) 2 is matched, and 5-3, 5-4 and 5-5 are elements 1 , 2 are respectively connected by wire bonding. The point that three bonding wires 7-2 are required to connect the leads 5-2, 5-4, 5-5 and the main surface of the light receiving element 2 are the same as in the case of the conventional example of FIGS. . The leads 5-1 to 5-5 are first integrated as a lead frame. The distance 21 (for example, 1.6 mm) on the terminal side between the leads 5-2 and 5-5 is equal to the lead 5-
End-to-end spacing between 1, 5 and 3 (eg, 3.20 mm) 22
7B, the leads 5-2, 5-4, and 5-5 are formed downward in the light-shielding resin 9 as shown in FIG. Along the surface, the resin 9 is taken out from the same direction on the surface.
The leads 5-1 to 5-5 are formed near their ends along the surface of the substrate 12, and are attached to the substrate surface together with the lower surface of the interrupter 10.
【００２０】図９は本発明の他の実施例で、図９（ａ）
は斜視図、図９（ｂ）は同断面図である。リード５−
２，５−４，５−５は樹脂９内でフォーミングされ樹脂
９の一方から外部へ導出され、リード５−１，５−３は
樹脂９の他方から外部へ導出されている。リード５−１
と５−３の間隔２２、リード５−２と５−５の間隔２１
は図８のままでもよいが、いずれか一方に統一してもよ
い。リード５−１〜５−５の樹脂外部でのフォーミング
及び基板１２への取り付けは前実施例と同様である。FIG. 9 shows another embodiment of the present invention.
Is a perspective view and FIG. 9B is a sectional view of the same. Lead 5-
2, 5-4 and 5-5 are formed in the resin 9 and led out from one side of the resin 9, and the leads 5-1 and 5-3 are led out from the other side of the resin 9. Lead 5-1
22 between lead 5-3 and spacing 21 between leads 5-2 and 5-5.
May be the same as in FIG. 8, but may be unified to either one. The forming of the leads 5-1 to 5-5 outside the resin and the attachment to the substrate 12 are the same as in the previous embodiment.
【００２１】図１０は本発明の更に異なる実施例で、ア
ウターリードがフォーミングされないで平面実装される
場合を示す。この場合インタラプタ１０は基板１２の穴
４１内に嵌合されている。図１０はリードを一方からの
み取り出す場合の実施例と、一方、他方の双方から取り
出す場合の実施例との両方を示している。FIG. 10 shows still another embodiment of the present invention, in which the outer leads are mounted on a plane without forming. In this case, the interrupter 10 is fitted in the hole 41 of the substrate 12. FIG. 10 shows an embodiment in which leads are taken out from only one side and an embodiment in which leads are taken out from both sides.
【００２２】図１１は本発明の更に異なる実施例で、ア
ウターリードを基板１２の孔に挿通して半田５１で接続
を行って実装される場合である。この図１１もリードを
樹脂９の一方のみから取り出す場合と、一方、他方の双
方から取り出す場合の実施例の両方を示している。FIG. 11 shows a still further embodiment of the present invention, in which the outer leads are inserted into holes of the substrate 12 and connected by solder 51 for mounting. FIG. 11 also shows both the case where the lead is taken out from only one of the resins 9 and the embodiment where the lead is taken out from both the other.
【００２３】なお、本発明は実施例のみに限られること
無く、種々の応用が可能である。例えば、図８（ａ）〜
（ｄ）において、リード５−１、５−３間の間隔は図の
ようには広げず、リード５−２、５−５間の間隔を図の
ものより広くすることにより、リード５−２、５−５間
の間隔をリード５−１、５−３間の間隔より大として、
樹脂内で少なくともリード５−１、５−３とリード５−
２、５−４、５−５との一方をフォーミングして遮光性
樹脂の表面の同方向から、リード５−１〜５−５を、フ
ォトインタラプタ取付体の表面に沿って同列状に並べて
外部へ取り出すようにしてもよい。この場合例えば、リ
ード５−１はリード５−５、５−４間に配置され、リー
ド５−３はリード５−４、５−２間に配置される。It should be noted that the present invention is not limited to the embodiments, and various applications are possible. For example, FIG.
In (d), the interval between the leads 5-1 and 5-3 is not widened as shown in FIG. , 5-5 is greater than the spacing between leads 5-1 and 5-3,
At least lead 5-1 and 5-3 and lead 5-
2, 5-4, and 5-5 are formed, and leads 5-1 to 5-5 are arranged in the same row along the surface of the photointerrupter mounting body from the same direction on the surface of the light-shielding resin and are externally formed. May be taken out. In this case, for example, the lead 5-1 is arranged between the leads 5-5 and 5-4, and the lead 5-3 is arranged between the leads 5-4 and 5-2.
【００２４】[0024]
【発明の効果】以上説明した如く本発明によれば、実装
取付面に対し、光軸を垂直にして実装できる構造のフォ
トインタラプタを、部品点数の削減、実装スペースの縮
小化を図った状態で実現できるものである。As described above, according to the present invention, a photointerrupter having a structure that can be mounted with the optical axis perpendicular to the mounting surface is provided with a reduced number of components and a reduced mounting space. It can be realized.
【図１】本発明の一実施例の構成図。FIG. 1 is a configuration diagram of an embodiment of the present invention.
【図２】本発明の一実施例の構成図。FIG. 2 is a configuration diagram of one embodiment of the present invention.
【図３】本発明の他の実施例の構成図。FIG. 3 is a configuration diagram of another embodiment of the present invention.
【図４】上記各実施例の製造方法を示す断面図。FIG. 4 is a cross-sectional view showing the manufacturing method of each of the above embodiments.
【図５】本発明の更に異なる実施例の断面図。FIG. 5 is a sectional view of still another embodiment of the present invention.
【図６】本発明の更に異なる実施例の断面図。FIG. 6 is a sectional view of still another embodiment of the present invention.
【図７】本発明の更に異なる実施例の構成図。FIG. 7 is a configuration diagram of still another embodiment of the present invention.
【図８】本発明の更に異なる実施例の構成図。FIG. 8 is a configuration diagram of still another embodiment of the present invention.
【図９】本発明の更に異なる実施例の構成図。FIG. 9 is a configuration diagram of still another embodiment of the present invention.
【図１０】本発明の更に異なる実施例の断面図。FIG. 10 is a sectional view of still another embodiment of the present invention.
【図１１】本発明の更に異なる実施例の断面図。FIG. 11 is a sectional view of still another embodiment of the present invention.
【図１２】従来のインタラプタの構成図。FIG. 12 is a configuration diagram of a conventional interrupter.
【図１３】従来のインタラプタの構成図。FIG. 13 is a configuration diagram of a conventional interrupter.
【図１４】従来のフォトインタラプタの動作、構成説明
図。FIG. 14 is an explanatory diagram of an operation and a configuration of a conventional photointerrupter.
【図１５】従来のフォトインタラプタの動作、構成説明
図。FIG. 15 is an explanatory diagram of an operation and a configuration of a conventional photointerrupter.
【図１６】従来のインタラプタの構成図。FIG. 16 is a configuration diagram of a conventional interrupter.
【図１７】従来のインタラプタの構成図。FIG. 17 is a configuration diagram of a conventional interrupter.
【図１８】従来のフォトインタラプタの動作、構成説明
図。FIG. 18 is an explanatory diagram of an operation and a configuration of a conventional photointerrupter.
【図１９】従来のフォトインタラプタの動作、構成説明
図。FIG. 19 is an explanatory diagram of an operation and a configuration of a conventional photointerrupter.
１…発光素子、２…受光素子、３−１，３−２…透明モ
ールド樹脂、４−１，４−２…スリット、５−１〜５−
５…リード、８…光軸、９…遮光モールド樹脂、１０…
フォトインタラプタ、１１…被検出物通過ギャップ、１
２…基板（取付体）。DESCRIPTION OF SYMBOLS 1 ... Light-emitting element, 2 ... Light-receiving element, 3-1 and 3-2 ... Transparent mold resin, 4-1 and 4-2 ... Slit, 5-1 to 5-
5 ... lead, 8 ... optical axis, 9 ... light-shielding mold resin, 10 ...
Photo interrupter, 11: gap through which the object is detected, 1
2. Board (attachment).
フロントページの続き (56)参考文献 特開 平２−167491（ＪＰ，Ａ) 特開 平１−245116（ＪＰ，Ａ) 特開 昭62−229883（ＪＰ，Ａ) 特開 昭60−24079（ＪＰ，Ａ) 実開 昭61−72869（ＪＰ，Ｕ) 実開 昭54−103763（ＪＰ，Ｕ) 実開 昭51−92060（ＪＰ，Ｕ) 実開 平３−90462（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 31/12 Continuation of the front page (56) References JP-A-2-167491 (JP, A) JP-A-1-245116 (JP, A) JP-A-62-2229883 (JP, A) JP-A-60-24079 (JP, A) , A) Fully open 1987-72869 (JP, U) Fully open 1979-103763 (JP, U) Fully open 1979-92060 (JP, U) Fully open, 3-90462 (JP, U) (58) Field surveyed (Int.Cl. 7 , DB name) H01L 31/12
Claims (16)
これら各素子間の光軸を一致させた状態でそれぞれ搭載
する第１，第２のリード、及び前記各素子にそれぞれ電
気的に接続された第３，第４のリードと、前記各素子
を、これら各素子間に被検出物体が通過可能にそれぞれ
被覆する透明性樹脂と、該樹脂及び前記第１ないし第４
のリードの一部を被覆する遮光性樹脂とを有したフォト
インタラプタと；該フォトインタラプタを、前記光軸が
フォトインタラプタ取付面に交差する方向に取付けるフ
ォトインタラプタ取付体とを具備し；樹脂内で少なくと
も第１，第３のリードと第２，第４のリードとの一方を
フォーミングして遮光性樹脂の表面の同方向から、第１
ないし第４のリードを、フォトインタラプタ取付体の表
面に沿って同列状に並べて外部へ取り出したことを特徴
とする半導体光電変換装置。1. A light emitting element, a light receiving element, and each of these elements
The first and second leads respectively mounted in a state where the optical axes of the respective elements are aligned, and the third and fourth leads electrically connected to the respective elements, and the respective elements, A transparent resin that covers the object to be detected between these elements so that the object can pass therethrough; the resin and the first to fourth resins;
A photo-interrupter having a light-shielding resin that covers a part of the lead of the photo-interrupter; and a photo-interrupter mounting body for mounting the photo-interrupter in a direction in which the optical axis intersects the photo-interrupter mounting surface. Forming at least one of the first and third leads and the second and fourth leads to form the first and second leads from the same direction on the surface of the light-shielding resin.
A semiconductor photoelectric conversion device characterized in that the fourth leads are arranged in the same row along the surface of the photointerrupter mounting body and taken out.
これら各素子間の光軸を一致させた状態でそれぞれ搭載
する第１，第２のリード、及び前記各素子にそれぞれ電
気的に接続された第３，第４のリードと、前記各素子
を、これら各素子間に被検出物体が通過可能にそれぞれ
被覆する透明性樹脂と、該樹脂及び前記第１ないし第４
のリードの一部を被覆する遮光性樹脂とを有したフォト
インタラプタと；該フォトインタラプタを、前記光軸が
フォトインタラプタ取付面に交差する方向に取り付ける
フォトインタラプタ取付体とを具備し；第１，第３のリ
ード間の間隔と第２，第４のリード間の間隔との一方を
他方より大として、樹脂内で少なくとも第１，第３のリ
ードと第２，第４のリードとの一方をフォーミングして
遮光性樹脂の表面の同方向から、第１ないし第４のリー
ドを、フォトインタラプタ取付体の表面に沿って同列状
に並べて外部へ取り出したことを特徴とする半導体光電
変換装置。2. A light-emitting element, a light-receiving element, and each of these elements
The first and second leads respectively mounted in a state where the optical axes of the respective elements are aligned, and the third and fourth leads electrically connected to the respective elements, and the respective elements, A transparent resin that covers the object to be detected between these elements so that the object can pass therethrough; the resin and the first to fourth resins;
A photointerrupter having a light-shielding resin covering a part of the lead of the photointerrupter; and a photointerrupter mounting body for mounting the photointerrupter in a direction in which the optical axis intersects the photointerrupter mounting surface; One of the distance between the third lead and the distance between the second and fourth leads is larger than the other, and at least one of the first, third, and second and fourth leads is made of resin. A semiconductor photoelectric conversion device wherein the first to fourth leads are formed in the same row along the surface of the photointerrupter mounting body and taken out from the same direction on the surface of the light-shielding resin by forming.
これら各素子間の光軸を一致させた状態でそれぞれ搭載
する第１，第２のリード、及び前記各素子にそれぞれ電
気的に接続された第３，第４のリードと、前記各素子
を、これら各素子間に被検出物体が通過可能にそれぞれ
被覆する透明性樹脂と、該樹脂及び前記第１ないし第４
のリードの一部を被覆する遮光性樹脂とを有したフォト
インタラプタと；該フォトインタラプタを、前記光軸が
フォトインタラプタ取付面に交差する方向に取り付ける
フォトインタラプタ取付体とを具備し；樹脂内で少なく
とも第１，第３のリードと第２，第４のリードとの一方
をフォーミングして、遮光性樹脂の表面の一方から第
１，第３のリードを、遮光性樹脂の表面の他方から第
２，第４のリードを、外部へ取り出したことを特徴とす
る半導体光電変換装置。3. A light emitting element, a light receiving element, and each of these elements,
The first and second leads respectively mounted in a state where the optical axes of the respective elements are aligned, and the third and fourth leads electrically connected to the respective elements, and the respective elements, A transparent resin that covers the object to be detected between these elements so that the object can pass therethrough; the resin and the first to fourth resins;
A photo-interrupter having a light-shielding resin that covers a part of the lead of the photo-interrupter; and a photo-interrupter mounting body for mounting the photo-interrupter in a direction in which the optical axis intersects the photo-interrupter mounting surface. At least one of the first and third leads and the second and fourth leads is formed to move the first and third leads from one of the light-shielding resin surfaces to the first and third leads from the other of the light-shielding resin surfaces. 2. A semiconductor photoelectric conversion device, wherein the fourth lead is taken out.
遮光性樹脂の外部でフォトインタラプタ取付体の取付面
に平行になるようにフォーミングされている請求項１な
いし３のいずれか１項に記載の半導体光電変換装置。4. A tip end of each of the first to fourth leads,
4. The semiconductor photoelectric conversion device according to claim 1, wherein the semiconductor photoelectric conversion device is formed outside of the light-shielding resin so as to be parallel to a mounting surface of the photointerrupter mounting body. 5.
遮光性樹脂の外側でフォトインタラプタ取付体の取付面
側の表面に交差した状態で接続された請求項１ないし３
のいずれか１項に記載の半導体光電変換装置。5. A front end of each of the first to fourth leads,
4. The photo-interrupter mounting body is connected so as to intersect with a surface on the mounting surface side of the photo-interrupter mounting body outside the light-shielding resin.
The semiconductor photoelectric conversion device according to any one of the above.
取付面側の表面に第１ないし第４のリードが平行状態で
取り付けられるまでフォトインタラプタが挿入される穴
を有した請求項１または３に記載の半導体光電変換装
置。6. The photointerrupter mounting body according to claim 1, wherein the photointerrupter mounting body has a hole on the surface on the mounting surface side into which the photointerrupter is inserted until the first to fourth leads are mounted in a parallel state. 13. The semiconductor photoelectric conversion device according to claim 1.
し透明性を有するものである請求項１ないし３のいずれ
か１項に記載の半導体光電変換装置。7. The semiconductor photoelectric conversion device according to claim 1, wherein said transparent resin has transparency to at least infrared light.
これら各素子間の光軸を一致させた状態でそれぞれ搭載
する第１及び第２のリード、前記各素子にそれぞれ電気
的に接続された第３及び第４，第５のリードと、前記各
素子を、これら各素子間に被検出物体が、通過可能にそ
れぞれ被覆する透明性樹脂と、該樹脂及び前記第１ない
し第５のリードの一部を被覆する遮光性樹脂とを有した
フォトインタラプタと；該フォトインタラプタを、前記
光軸がフォトインタラプタ取付面に交差する方向に取り
付けるフォトインタラプタ取付体とを具備し；樹脂内で
少なくとも第１，第３のリードと第２，第４，第５のリ
ードとの一方をフォーミングして遮光性樹脂の表面の同
方向から、第１ないし第５のリードを、フォトインタラ
プタ取付体の表面に沿って同列状に並べて外部へ取り出
したことを特徴とする半導体光電変換装置。8. A light emitting element, a light receiving element, and each of these elements,
First and second leads respectively mounted with their optical axes aligned with each other, third, fourth, and fifth leads electrically connected to each of the elements; A photo-interrupter having a transparent resin that covers the object to be detected between these elements so as to be able to pass through, and a light-shielding resin that covers the resin and a part of the first to fifth leads. A photo-interrupter mounting body for mounting the photo-interrupter in a direction in which the optical axis intersects the photo-interrupter mounting surface; at least the first, third, and second, fourth, and fifth leads in resin. Forming one of the leads and forming the first to fifth leads in the same direction along the surface of the photointerrupter mounting body from the same direction on the surface of the light-shielding resin and taking out the same. That semiconductor photoelectric conversion device.
これら各素子間の光軸を一致させた状態でそれぞれ搭載
する第１及び第２のリード、前記各素子にそれぞれ電気
的に接続された第３及び第４，第５のリードと、前記各
素子を、これら各素子間に被検出物体が通過可能にそれ
ぞれ被覆する透明性樹脂と、該樹脂及び前記第１ないし
第５のリードの一部を被覆する遮光性樹脂とを有したフ
ォトインタラプタと；該フォトインタラプタを、前記光
軸がフォトインタラプタ取付面に交差する方向に取り付
けるフォトインタラプタ取付体とを具備し；第１，第３
のリード間の間隔を第２，第５のリード間の間隔より大
として、樹脂内で少なくとも第１，第３のリードと第
２，第４，第５のリードとの一方をフォーミングして遮
光性樹脂の表面の同方向から、第１ないし第５のリード
を、フォトインタラプタ取付体の表面に沿って同列状に
並べて外部へ取り出したことを特徴とする半導体光電変
換装置。9. A light emitting element, a light receiving element, and each of these elements
First and second leads respectively mounted with their optical axes aligned with each other, third, fourth, and fifth leads electrically connected to each of the elements; A photo-interrupter having a transparent resin covering each of the elements so as to allow the detection object to pass therethrough, and a light-shielding resin covering a part of the resin and the first to fifth leads; A photo-interrupter mounting body for mounting the photo-interrupter in a direction in which the optical axis intersects with the photo-interrupter mounting surface;
The distance between the leads is larger than the distance between the second and fifth leads, and at least one of the first, third, and second, fourth, and fifth leads is formed in a resin to shield light. A semiconductor photoelectric conversion device, wherein first to fifth leads are arranged in the same row along the surface of the photointerrupter mounting body and taken out from the same direction on the surface of the conductive resin.
を、これら各素子間の光軸を一致させた状態でそれぞれ
搭載する第１及び第２のリード、前記各素子にそれぞれ
電気的に接続された第３及び第４，第５のリードと、前
記各素子を、これら各素子間に被検出物体が通過可能に
それぞれ被覆する透明性樹脂と、該樹脂及び前記第１な
いし第５のリードの一部を被覆する遮光性樹脂とを有し
たフォトインタラプタと；該フォトインタラプタを、前
記光軸がフォトインタラプタ取付面に交差する方向に取
り付けるフォトインタラプタ取付体とを具備し；樹脂内
で少なくとも第１，第３のリードと第２，第４のリード
との一方をフォーミングして、遮光性樹脂の表面の一方
から第１，第３のリードを、遮光性樹脂の表面の他方か
ら第２，第４，第５のリードを、外部へ取り出したこと
を特徴とする半導体光電変換装置。10. A light emitting element, a light receiving element, and first and second leads for mounting each of these elements with their optical axes aligned with each other, and electrically connected to each of the elements. Third, fourth, and fifth leads, a transparent resin that covers each of the elements so that an object to be detected can pass between the elements, and the resin and the first to fifth leads. A photo-interrupter having a light-blocking resin covering a part of the photo-interrupter; and a photo-interrupter mounting body for mounting the photo-interrupter in a direction in which the optical axis intersects the photo-interrupter mounting surface; One of the first and third leads and the second and fourth leads are formed to form first and third leads from one of the surfaces of the light-shielding resin and second and third from the other of the surfaces of the light-shielding resin. 4th, 5th Lead, semiconductor photoelectric conversion device is characterized in that extraction to the outside.
は、遮光性樹脂の外部でフォトインタラプタ取付体の取
付面に平行になるようにフォーミングされている請求項
８ないし１０のいずれか１項に記載の半導体光電変換装
置。11. The front end of the first to fifth leads is formed outside the light-shielding resin so as to be parallel to the mounting surface of the photointerrupter mounting body. Item 6. The semiconductor photoelectric conversion device according to item 1.
は、遮光性樹脂の外側でフォトインタラプタ取付体の取
付面側の表面に交差した状態で接続された請求項８ない
し１０のいずれか１項に記載の半導体光電変換装置。12. The light-emitting device according to claim 8, wherein the tip ends of said first to fifth leads are connected so as to intersect with the surface on the mounting surface side of the photointerrupter mounting body outside the light-shielding resin. 2. The semiconductor photoelectric conversion device according to claim 1.
の取付面側の表面に第１ないし第５のリードが平行状態
で取り付けられるまでフォトインタラプタが挿入される
穴を有した請求項８または１０に記載の半導体光電変換
装置。13. A photointerrupter mounting body according to claim 8, wherein said photointerrupter mounting body has a hole through which a photointerrupter is inserted until the first to fifth leads are mounted in a parallel state on the surface on the mounting surface side. 13. The semiconductor photoelectric conversion device according to claim 1.
対し透明性を有するものである請求項８ないし１０のい
ずれか１項に記載の半導体光電変換装置。14. The semiconductor photoelectric conversion device according to claim 8, wherein said transparent resin has transparency at least to infrared light.
受光ＩＣチップである請求項８ないし１０のいずれか１
項に記載の半導体光電変換装置。15. The light receiving element according to claim 8, wherein said light receiving element is a light receiving IC chip including a Schmitt circuit.
Item 6. The semiconductor photoelectric conversion device according to item 1.
を、これら各素子間の光軸を一致させた状態でそれぞれ
搭載する第１及び第２のリード、前記各素子にそれぞれ
電気的に接続された第３及び第４，第５のリードと、前
記各素子を、これら各素子間に被検出物体が通過可能に
それぞれ被覆する透明性樹脂と、該樹脂及び前記第１な
いし第５のリードの一部を被覆する遮光性樹脂とを有し
たフォトインタラプタと；該フォトインタラプタを、前
記光軸がフォトインタラプタ取付面に交差する方向に取
り付けるフォトインタラプタ取付体とを具備し；第２，
第５のリード間の間隔を第１，第３のリード間の間隔よ
り大として、樹脂内で少なくとも第１，第３のリードと
第２，第４，第５のリードとの一方をフォーミングして
遮光性樹脂の表面の同方向から、第１ないし第５のリー
ドを、フォトインタラプタ取付体の表面に沿って同列状
に並べて外部へ取り出したことを特徴とする半導体光電
変換装置。16. A light emitting element, a light receiving element, and first and second leads for mounting each of these elements with their optical axes aligned with each other, and electrically connected to each of the elements. Third, fourth, and fifth leads, a transparent resin that covers each of the elements so that an object to be detected can pass between the elements, and the resin and the first to fifth leads. A photo-interrupter having a light-shielding resin covering a part of the photo-interrupter; and a photo-interrupter mounting body for mounting the photo-interrupter in a direction in which the optical axis intersects the photo-interrupter mounting surface;
The distance between the fifth leads is made larger than the distance between the first and third leads, and at least one of the first, third, and second, fourth, and fifth leads is formed in the resin. Wherein the first to fifth leads are arranged in the same row along the surface of the photointerrupter mounting body and taken out from the same direction on the surface of the light-shielding resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23952691A JP2997578B2 (en) | 1990-11-13 | 1991-09-19 | Semiconductor photoelectric conversion device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30678490 | 1990-11-13 | ||
| JP2-306784 | 1990-11-13 | ||
| JP23952691A JP2997578B2 (en) | 1990-11-13 | 1991-09-19 | Semiconductor photoelectric conversion device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0521834A JPH0521834A (en) | 1993-01-29 |
| JP2997578B2 true JP2997578B2 (en) | 2000-01-11 |
Family
ID=26534292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23952691A Expired - Fee Related JP2997578B2 (en) | 1990-11-13 | 1991-09-19 | Semiconductor photoelectric conversion device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2997578B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4611472B2 (en) * | 1999-08-04 | 2011-01-12 | 浜松ホトニクス株式会社 | Emitter / receiver |
-
1991
- 1991-09-19 JP JP23952691A patent/JP2997578B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521834A (en) | 1993-01-29 |
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