JPH0416464Y2 - - Google Patents
Info
- Publication number
- JPH0416464Y2 JPH0416464Y2 JP1985173198U JP17319885U JPH0416464Y2 JP H0416464 Y2 JPH0416464 Y2 JP H0416464Y2 JP 1985173198 U JP1985173198 U JP 1985173198U JP 17319885 U JP17319885 U JP 17319885U JP H0416464 Y2 JPH0416464 Y2 JP H0416464Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- diode
- chip
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001681 protective effect Effects 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Protection Of Static Devices (AREA)
Description
【考案の詳細な説明】
［産業上の利用分野］
本考案は、直列接続の保護ダイオードを内蔵し
た発光ダイオードに関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a light emitting diode incorporating a series-connected protection diode.
［従来の技術］
発光ダイオードは、例えば第４図に示すように
一方のリード１Ａの先端面（反射部）に発光ダイ
オード（LED）チツプ２の一端を導電性接着剤
により接着し、他端を導電線３を介して他方のリ
ード１Ｂに接続した後、これらを外囲器用の透明
樹脂４で覆つた構造としている。[Prior Art] For example, as shown in FIG. 4, a light emitting diode is manufactured by bonding one end of a light emitting diode (LED) chip 2 to the tip surface (reflection part) of one lead 1A with a conductive adhesive, and bonding the other end to the tip surface (reflection part) of one lead 1A. After connecting to the other lead 1B via a conductive wire 3, these are covered with a transparent resin 4 for an envelope.
このような構造のLEDは素子単体の特性に頼
つているため、逆電圧が低く、高い逆電圧がかか
る場合にはLEDの逆電圧破壊を防止するための
保護ダイオードを別に必要とする。また、逆電流
が大きいため周辺の回路に悪影響を及ぼすことが
ある。 Since LEDs with this type of structure rely on the characteristics of the individual element, the reverse voltage is low, and when a high reverse voltage is applied, a separate protection diode is required to prevent reverse voltage breakdown of the LED. Furthermore, since the reverse current is large, it may have an adverse effect on peripheral circuits.
［考案の目的］
本考案の目的は、素子単体で十分な逆電圧を得
ることができる保護ダイオード内蔵の発光ダイオ
ードを提供することにある。[Purpose of the invention] An object of the invention is to provide a light emitting diode with a built-in protection diode that can obtain a sufficient reverse voltage with a single element.
［考案の概要］
本考案は、一方のリードの反射部または他方の
リードの先端に保護用のダイオードチツプを接着
し、このダイオードチツプの上面またはリードの
反射部に発光ダイオードの一端を接着し、他端を
前記他方のリードまたはダイオードチツプに導電
線を介して接続し、これらの周囲に透明樹脂で外
囲器を形成したことを特徴とするものである。[Summary of the invention] The invention involves bonding a protective diode chip to the reflective portion of one lead or the tip of the other lead, bonding one end of a light emitting diode to the top surface of this diode chip or the reflective portion of the lead, The other end is connected to the other lead or the diode chip via a conductive wire, and an envelope is formed around these with a transparent resin.
［実施例］
第１図は本考案の一実施例を示すもので、１１
Ａ及び１１Ｂは一対のリードであり、一方のリー
ド１１Ａの先端面（反射部）に保護用のダイオー
ドチツプ１２の一端を導電性接着剤により接着
し、その上にLEDチツプ１３の一端を導電性接
着剤により接着している。そして、LEDチツプ
１３の他端を導電線１４を介して他方のリード１
１Ｂに接続し、これらの周囲に透明樹脂１５で外
囲器を形成している。[Example] Figure 1 shows an example of the present invention.
A and 11B are a pair of leads, one end of a protective diode chip 12 is glued to the tip surface (reflection part) of one lead 11A with a conductive adhesive, and one end of the LED chip 13 is glued on top of that with a conductive adhesive. It is attached with adhesive. Then, connect the other end of the LED chip 13 to the other lead 1 via the conductive wire 14.
1B, and an envelope is formed around these with transparent resin 15.
このような構造とすると、保護用のダイオード
チツプ１２が素子に内蔵されたことになり、回路
的には第２図に示すようにLEDチツプ１３と保
護用のダイオードチツプ１２の直列回路となつ
て、素子としての逆電圧が高くなる。従つて、高
い逆電圧が要求される場合にも外部に保護ダイオ
ードを付加する必要がなくなり、回路構成が簡単
になる。 With this structure, the protective diode chip 12 is built into the element, and the circuit is a series circuit of the LED chip 13 and the protective diode chip 12, as shown in Figure 2. , the reverse voltage of the element increases. Therefore, even when a high reverse voltage is required, there is no need to add an external protection diode, simplifying the circuit configuration.
第３図は本考案の他の実施例を示すもので、保
護用のダイオードチツプ１２は他方のリード１１
Ｂの先端に接着し、一方のリード１１Ａの反射部
にはLEDチツプ１３のみを接着し、両チツプ間
を導電線１４で接続して、それらの周囲に外囲器
１５を形成したものであり、前記実施例と同様に
LEDチツプと保護用のダイオードチツプが一体
化されている。 FIG. 3 shows another embodiment of the present invention, in which the protective diode chip 12 is connected to the other lead 11.
B, and only the LED chip 13 is glued to the reflective part of one lead 11A. Both chips are connected with a conductive wire 14, and an envelope 15 is formed around them. , similar to the previous example
The LED chip and protection diode chip are integrated.
［効果］
以上のように本考案によれば、逆電圧破壊を防
止するための保護ダイオードチツプをLED素子
に内蔵させたので、素子単体で十分な逆電圧を有
するようになり、外部にダイオードを付加する必
要がなくなる。また、保護用のダイオードを内蔵
しているので、逆電流が小さくなり、周辺の回路
に影響を及ぼすことがなくなる。[Effects] As described above, according to the present invention, a protective diode chip for preventing reverse voltage breakdown is built into the LED element, so the element itself has sufficient reverse voltage, and it is no longer necessary to install an external diode. There is no need to add it. Also, since it has a built-in protection diode, reverse current is small and does not affect surrounding circuits.
第１図は本考案に係る発光ダイオードの一実施
例を示す平面図、第２図は同実施例の回路図、第
３図は本考案の他の実施例を示す平面図、第４図
は従来例を示す平面図である。
１１Ａ及び１１Ｂ……リード、１２……保護用
のダイオードチツプ、１３……LEDチツプ、１
４……導電線、１５……外囲器（透明樹脂）。
FIG. 1 is a plan view showing one embodiment of a light emitting diode according to the present invention, FIG. 2 is a circuit diagram of the same embodiment, FIG. 3 is a plan view showing another embodiment of the present invention, and FIG. FIG. 2 is a plan view showing a conventional example. 11A and 11B...Lead, 12...Protection diode chip, 13...LED chip, 1
4... Conductive wire, 15... Envelope (transparent resin).
Claims (1)
端に保護用のダイオードチツプを接着し、このダ
イオードチツプの上面またはリードの反射部に発
光ダイオードの一端を接着し、他端を前記他方の
リードまたはダイオードチツプに導電線を介して
接続し、これらの周囲に透明樹脂で外囲器を形成
したことを特徴とする発光ダイオード。 A protective diode chip is glued to the reflective part of one lead or the tip of the other lead, one end of the light emitting diode is glued to the top surface of this diode chip or the reflective part of the lead, and the other end is attached to the other lead or the diode. A light emitting diode characterized in that it is connected to a chip via a conductive wire, and an envelope is formed around these with a transparent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985173198U JPH0416464Y2 (en) | 1985-11-11 | 1985-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985173198U JPH0416464Y2 (en) | 1985-11-11 | 1985-11-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6282751U JPS6282751U (en) | 1987-05-27 |
| JPH0416464Y2 true JPH0416464Y2 (en) | 1992-04-13 |
Family
ID=31110434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985173198U Expired JPH0416464Y2 (en) | 1985-11-11 | 1985-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416464Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50128484A (en) * | 1974-03-27 | 1975-10-09 |
-
1985
- 1985-11-11 JP JP1985173198U patent/JPH0416464Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50128484A (en) * | 1974-03-27 | 1975-10-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6282751U (en) | 1987-05-27 |
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