JPS63193874U - - Google Patents
Info
- Publication number
- JPS63193874U JPS63193874U JP8432287U JP8432287U JPS63193874U JP S63193874 U JPS63193874 U JP S63193874U JP 8432287 U JP8432287 U JP 8432287U JP 8432287 U JP8432287 U JP 8432287U JP S63193874 U JPS63193874 U JP S63193874U
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- emitting element
- light emitting
- light
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 2
Description
第１図は本考案に係る半導体レーザ装置の実施
例を示す部分断面斜視図、第２図は同実施例に用
いたリードフレームを示す平面図、第３図は従来
例を示す部分断面正面図、第４図は従来例の断面
図である。
ａ……切込み、１……半導体レーザチツプ、４
……フオトダイオード、１０……半導体レーザ装
置、１１……取付板、１１ｂ……折曲板、１４…
…リードフレーム。
FIG. 1 is a partially sectional perspective view showing an embodiment of a semiconductor laser device according to the present invention, FIG. 2 is a plan view showing a lead frame used in the same embodiment, and FIG. 3 is a partially sectional front view showing a conventional example. , FIG. 4 is a sectional view of a conventional example. a... Cut, 1... Semiconductor laser chip, 4
...Photodiode, 10...Semiconductor laser device, 11...Mounting plate, 11b...Bending plate, 14...
…Lead frame.
Claims (1)
を受光して該発光素子の出力を制御するための受
光素子を有する半導体レーザ装置において、 前記半導体発光素子を、リードフレームに形成
された取付板に配設し、前記受光素子を、取付板
を折り曲げ、形成してなる折曲板に配設して、該
受光素子の受光面を半導体発光素子に対向させた
ことを特徴とする半導体レーザ装置。[Claims for Utility Model Registration] A semiconductor laser device having a semiconductor light emitting element and a light receiving element for receiving part of light from the light emitting element and controlling the output of the light emitting element, comprising: , the light receiving element is arranged on a mounting plate formed on a lead frame, and the light receiving element is arranged on a bent plate formed by bending the mounting plate, so that the light receiving surface of the light receiving element faces the semiconductor light emitting element. A semiconductor laser device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8432287U JPS63193874U (en) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8432287U JPS63193874U (en) | 1987-05-29 | 1987-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193874U true JPS63193874U (en) | 1988-12-14 |
Family
ID=30938719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8432287U Pending JPS63193874U (en) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193874U (en) |
-
1987
- 1987-05-29 JP JP8432287U patent/JPS63193874U/ja active Pending
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