JPS62112164U - - Google Patents
Info
- Publication number
- JPS62112164U JPS62112164U JP20293185U JP20293185U JPS62112164U JP S62112164 U JPS62112164 U JP S62112164U JP 20293185 U JP20293185 U JP 20293185U JP 20293185 U JP20293185 U JP 20293185U JP S62112164 U JPS62112164 U JP S62112164U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- die island
- light
- island
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Description
第１図ａはこの考案の一実施例を示す斜視図、
第１図ｂは第１図ａのリード３を曲げる前の形状
を示す平面図、第２図は第１図に示すリードフレ
ームを用いて構成した対向型光結合半導体装置の
一例を示す図、第３図は従来の対向型光結合半導
体装置の一例の内部構造を示す図、第４図は従来
の対向型光結合半導体装置の他の例の内部構造を
示す図である。
１……発光素子、２……受光素子、３……リー
ド、４ａ……ダイアイランド、５……金線、６…
…内部樹脂、７……外部樹脂。
FIG. 1a is a perspective view showing an embodiment of this invention;
1b is a plan view showing the shape of the lead 3 shown in FIG. 1a before being bent; FIG. 2 is a diagram showing an example of a facing type optically coupled semiconductor device constructed using the lead frame shown in FIG. 1; FIG. 3 is a diagram showing an internal structure of an example of a conventional opposed type optically coupled semiconductor device, and FIG. 4 is a diagram showing an internal structure of another example of a conventional opposed type optically coupled semiconductor device. 1... Light emitting element, 2... Light receiving element, 3... Lead, 4a... Die island, 5... Gold wire, 6...
...Internal resin, 7...External resin.
Claims (1)
アイランドがリードの先端に該リードに直角な帯
状板を介して該リードに連設し、上記リードが曲
げられてダイアイランドの面が該リードに対して
直角に、かつ、ダイアイランドの中心部が上記リ
ードの面に一致する状態に形成された対向型光結
合半導体装置用リードフレーム。 A die island on which a light-emitting element or a light-receiving element is mounted is connected to the lead through a strip plate perpendicular to the lead at the tip of the lead, and when the lead is bent, the surface of the die island is placed against the lead. A lead frame for a facing type optically coupled semiconductor device, wherein the die island is formed at right angles to the surface of the lead, and the center of the die island is aligned with the surface of the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20293185U JPS62112164U (en) | 1985-12-27 | 1985-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20293185U JPS62112164U (en) | 1985-12-27 | 1985-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62112164U true JPS62112164U (en) | 1987-07-17 |
Family
ID=31167776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20293185U Pending JPS62112164U (en) | 1985-12-27 | 1985-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62112164U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53133384A (en) * | 1977-04-27 | 1978-11-21 | Omron Tateisi Electronics Co | Manufacture of optical coupling device |
-
1985
- 1985-12-27 JP JP20293185U patent/JPS62112164U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53133384A (en) * | 1977-04-27 | 1978-11-21 | Omron Tateisi Electronics Co | Manufacture of optical coupling device |
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