JPH0383962U - - Google Patents

Info

Publication number
JPH0383962U
JPH0383962U JP14533789U JP14533789U JPH0383962U JP H0383962 U JPH0383962 U JP H0383962U JP 14533789 U JP14533789 U JP 14533789U JP 14533789 U JP14533789 U JP 14533789U JP H0383962 U JPH0383962 U JP H0383962U
Authority
JP
Japan
Prior art keywords
led
chip
lead frame
extension
lead frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14533789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14533789U priority Critical patent/JPH0383962U/ja
Publication of JPH0383962U publication Critical patent/JPH0383962U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案によるＬＥＤの一実施例を示し
ており、Ａはその側面図、Ｂはその端面図。第２
図は第１図のＬＥＤの発光特性を示すグラフであ
る。第３図は本考案によるＬＥＤの他の実施例を
示しており、Ａはその側面図、Ｂはその端面図で
ある。第４図は、従来のＬＥＤの一例を表してお
り、Ａはその側面図、Ｂはその端面図、第５図は
従来のＬＥＤの発光特性を示すグラフである。 １０……ＬＥＤ、１１，１２……リードフレー
ム、１１ａ……上端面、１１ｂ，１２ａ……延長
部、１３……ＬＥＤチツプ、１４……レンズ。 FIG. 1 shows an embodiment of the LED according to the present invention, with A being a side view thereof and B being an end view thereof. Second
The figure is a graph showing the light emitting characteristics of the LED shown in FIG. FIG. 3 shows another embodiment of the LED according to the present invention, in which A is a side view thereof and B is an end view thereof. FIG. 4 shows an example of a conventional LED, A is a side view thereof, B is an end view thereof, and FIG. 5 is a graph showing the light emission characteristics of the conventional LED. 10... LED, 11, 12... Lead frame, 11a... Upper end surface, 11b, 12a... Extension part, 13... LED chip, 14... Lens.

Claims (1)

【実用新案登録請求の範囲】 実質的に上下に平行に延びる二本のリードフレ
ームと、該リードフレームの一方の上端面に取り
付けられ且つその上面が他方のリードフレームの
上端に対してワイヤボンデイングされているＬＥ
Ｄチツプとを含むＬＥＤにおいて、 一方のリードフレームの上端部が、ＬＥＤチツ
プを側方から覆うように該ＬＥＤチツプに対して
凹状の内面を有する延長部を有しており、該延長
部のＬＥＤチツプに対向する内面が、反射面とし
て形成されていることを特徴とする、異指向性Ｌ
ＥＤ。[Claims for Utility Model Registration] Two lead frames extending substantially vertically in parallel, the upper end of which is attached to the upper end surface of one of the lead frames, and the upper surface of which is wire bonded to the upper end of the other lead frame. LE
In the LED including a D-chip, the upper end of one lead frame has an extension having a concave inner surface with respect to the LED chip so as to cover the LED chip from the side, and the LED of the extension Different directivity L, characterized in that the inner surface facing the chip is formed as a reflective surface.
E.D.
JP14533789U 1989-12-15 1989-12-15 Pending JPH0383962U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14533789U JPH0383962U (en) 1989-12-15 1989-12-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14533789U JPH0383962U (en) 1989-12-15 1989-12-15

Publications (1)

Publication Number Publication Date
JPH0383962U true JPH0383962U (en) 1991-08-26

Family

ID=31691976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14533789U Pending JPH0383962U (en) 1989-12-15 1989-12-15

Country Status (1)

Country Link
JP (1) JPH0383962U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010186886A (en) * 2009-02-12 2010-08-26 Yuichi Suzuki Fluorescence conversion light-emitting diode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010186886A (en) * 2009-02-12 2010-08-26 Yuichi Suzuki Fluorescence conversion light-emitting diode
JP4681059B2 (en) * 2009-02-12 2011-05-11 鈴木 優一 Fluorescent light-emitting diode

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