JPH0245659U - - Google Patents

Info

Publication number
JPH0245659U
JPH0245659U JP1988124613U JP12461388U JPH0245659U JP H0245659 U JPH0245659 U JP H0245659U JP 1988124613 U JP1988124613 U JP 1988124613U JP 12461388 U JP12461388 U JP 12461388U JP H0245659 U JPH0245659 U JP H0245659U
Authority
JP
Japan
Prior art keywords
lead frame
fixing
sealing resin
light emitting
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988124613U
Other languages
Japanese (ja)
Other versions
JP2511148Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988124613U priority Critical patent/JP2511148Y2/en
Publication of JPH0245659U publication Critical patent/JPH0245659U/ja
Application granted granted Critical
Publication of JP2511148Y2 publication Critical patent/JP2511148Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は本考案の一実施例を示す断面
図及び一部透視上面図、第３図、第４図は本考案
の他の実施例を示す断面図及び一部透視上面図、
第５図、第６図は従来例を示す断面図及び一部透
視上面図である。 １ａ……第２封止樹脂、１ｂ……第１封止樹脂
、２ａ……発光素子、２ｂ……受光素子、３ａ…
…外部電極用リードフレーム、３ｃ……接続兼固
定用リードフレーム、４……金線。 1 and 2 are a cross-sectional view and a partially transparent top view showing one embodiment of the present invention, and FIGS. 3 and 4 are a cross-sectional view and a partially transparent top view showing another embodiment of the present invention. ,
5 and 6 are a sectional view and a partially transparent top view showing a conventional example. 1a... Second sealing resin, 1b... First sealing resin, 2a... Light emitting element, 2b... Light receiving element, 3a...
...Lead frame for external electrode, 3c...Lead frame for connection and fixing, 4...Gold wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発光素子と受光素子をそれぞれリードフレーム
に固定し、これらを第１、第２樹脂により樹脂封
止してなる光結合素子において、発光素子又は受
光素子の一方、又は両方の接続兼固定用リードフ
レームを第１封止樹脂外の第２封止樹脂に埋設し
、上記接続兼固定用リードフレームをワイヤボン
ド介し別途外部リード端子に接続したことを特徴
とする光結合素子。 A lead frame for connecting and fixing one or both of the light emitting element and the light receiving element, in an optical coupling device in which a light emitting element and a light receiving element are respectively fixed to a lead frame and resin-sealed with first and second resins. is embedded in a second sealing resin outside the first sealing resin, and the connecting and fixing lead frame is separately connected to an external lead terminal via a wire bond.
JP1988124613U 1988-09-22 1988-09-22 Optical coupling element Expired - Fee Related JP2511148Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988124613U JP2511148Y2 (en) 1988-09-22 1988-09-22 Optical coupling element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988124613U JP2511148Y2 (en) 1988-09-22 1988-09-22 Optical coupling element

Publications (2)

Publication Number Publication Date
JPH0245659U true JPH0245659U (en) 1990-03-29
JP2511148Y2 JP2511148Y2 (en) 1996-09-18

Family

ID=31374504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988124613U Expired - Fee Related JP2511148Y2 (en) 1988-09-22 1988-09-22 Optical coupling element

Country Status (1)

Country Link
JP (1) JP2511148Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0288258U (en) * 1988-12-24 1990-07-12

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59154032A (en) * 1983-02-23 1984-09-03 Toshiba Corp Manufacture of semiconductor device
JPS6287448A (en) * 1985-10-12 1987-04-21 兵頭　辰已 Reinforcement for cement mixture mixed with small ring type fiber reinforcing material
JPS6278758U (en) * 1985-11-06 1987-05-20
JPS6349260U (en) * 1986-09-17 1988-04-04
JPH0233459U (en) * 1988-08-24 1990-03-02

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59154032A (en) * 1983-02-23 1984-09-03 Toshiba Corp Manufacture of semiconductor device
JPS6287448A (en) * 1985-10-12 1987-04-21 兵頭　辰已 Reinforcement for cement mixture mixed with small ring type fiber reinforcing material
JPS6278758U (en) * 1985-11-06 1987-05-20
JPS6349260U (en) * 1986-09-17 1988-04-04
JPH0233459U (en) * 1988-08-24 1990-03-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0288258U (en) * 1988-12-24 1990-07-12

Also Published As

Publication number Publication date
JP2511148Y2 (en) 1996-09-18

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees